The 23rd International Workshop on Junction Technology (IWJT 2026) will take place on September 28–29, 2026 at INP-Ense³ in Grenoble, France, marking the first time the event has been held outside Japan and China since its launch in 2000. The workshop is a leading global forum for semiconductor junction formation technology and typically brings together more than 100 researchers and engineers from Asia, Europe and the United States.

CEA-Leti is a member of the organizing committee, with Philippe Rodriguez serving as General Chair, underscoring the institute’s role in connecting researchers, engineers and industry experts across the semiconductor ecosystem. At IWJT 2026, CEA-Leti will present four scientific papers covering key advances in junction technology and related process integration.

The institute’s contributions include “Insights into Early Phase Formation in Ti-Based Contacts for Advanced FD-SOI,” scheduled for Monday, September 28 from 11:15 to 11:35 a.m. in session S2-02; a presentation in the Monday special session from 1:45 to 2:00 p.m.; “Advanced materials calibration for nanosecond laser annealing simulations,” presented by first author Gabin Ternin-Rozat on Tuesday, September 29 from 2:20 to 2:40 p.m. in session S9-02; and “Ni-Based Ohmic Contacts on p-GaAsSb / InP: Interfacial alloying & Electrical Properties,” scheduled for Tuesday from 3:45 to 4:05 p.m. in session S10-02.

Beyond IWJT, CEA-Leti is also co-organizing the first Open Innovation Materials & Manufacturing Europe (OIM² Europe), a new European forum aimed at bridging advanced research and industrial innovation in advanced materials, nanotechnologies and sustainable manufacturing. The institute is also involved in broader discussions on responsible digital technologies, including the END* symposium at Grenoble Scientific Polygon, where the focus is on sustainable integrated hardware and software for ICT, and a session at SEMICON Europa in Munich examining how AI is reshaping the semiconductor stack through advances in compute, 3D integration, silicon photonics and power-efficient packaging.

CEA-Leti’s international engagement continues with the 19th edition of Leti Innovation Days Tokyo, where the institute’s CEO will highlight R&D partnerships in Japan and explore new opportunities to support the Japanese semiconductor industry. This year’s theme is “The AI-Chip Revolution: Scaling Innovation in Semiconductors,” with keynote speeches, seminars and live demonstrations at the Residence of France in Japan.

The institute also points to its multidisciplinary platforms, unique equipment and expertise as foundations for innovation in heterogeneous integration, new materials and photonics, which it says are essential to meeting the challenges of AI-driven semiconductor markets. In Interlaken, Switzerland, CEA-Leti has been invited by PSI’s Helmut Schift to organize a full-day tutorial on sustainability in the semiconductor industry and life cycle assessment. The second edition of the tutorial, following the one held in Montpellier in 2024 for CEA-Leti’s 50th anniversary, is designed to train engineers and young researchers in environmental footprint assessment and eco-responsible practices, with case studies on resource optimization, greenhouse gas emissions, energy reduction and component resilience. Lecturers include Jeff Kettle of the University of Glasgow, Sébastien Toussaint of UCL, Cyrille Hibert of EPFL, and CEA-Leti’s Isabelle Servin and Yannick Rivoira.

From 9/28/2026 to 9/29/2026INP-Ense³, Grenoble, France

The workshop brings together researchers, engineers and industry experts to discuss the latest advances and challenges in semiconductor junction technology.

As a member of the organizing committee, with Philippe Rodriguez (CEA-Leti) serving as General Chair, CEA-Leti plays a key role in driving these exchanges and fostering collaboration across the semiconductor ecosystem.

DISCOVER CEA-LETI’S MAJOR SCIENTIFIC RESULTS ATIWJT 26​

With 4 papers, the institute will present this year’s major scientific results at IWJT 26, including the following topics:

Monday Sept. 2811:15 - 11:35 a.mS2 - 02

Insights into Early Phase Formation in Ti-Based Contacts for Advanced FD-SOI

Monday Sept. 281:45 - 2:00 p.m​S3 - Special Session

Tuesday Sept. 292:20 - 2:40 p.mS9 - 02​

1st Author : Gabin Ternin-Rozat​

Advanced materials calibration for nanosecond laser annealing simulations​

Tuesday Sept. 293:45 - 4:05 p.mS10 - 02​

Ni-Based Ohmic Contacts on p-GaAsSb / InP: Interfacial

alloying & Electrical Properties​​​

The 23ʳᵈ International Workshop on Junction Technology (IWJT 2026) will be held September 28–29, 2026, in Grenoble, France — the first time the workshop leaves Japan and China since its founding in 2000. IWJT is the premier global forum for semiconductor junction formation technology, drawing over 100+ top researchers and engineers from Asia, Europe, and the US each year.

More information on ​​IWJT's website

From 9/28/2026 to 9/29/2026 |​INP-Ense³, Grenoble, France

Contact:Philippe Rodriguez​​with any questions.​​

Event | Agenda|Grenoble, France

CEA-Leti is proud to co-organize the first edition of Open Innovation Materials & Manufacturing Europe (OIM² Europe), a new European forum designed to bridge the gap between cutting-edge research and industrial innovation in advanced materials, nanotechnologies, and sustainable manufacturing.

Event|Grenoble Scientific Polygon, France

Europe has the expertise and skills to promote a more responsible digital sector (frugality, regulation, ethics) that creates high-quality jobs. However, mastery of data is just as crucial as mastery of materials and energy when it comes to the operability and sustainability of disruptive digital components and integrated circuits. More sustainable integrated hardware and software solutions will be discussed at the END* symposium in the field of Information & Communication Technologies (ICT)

Event | Agenda|SEMICON Europa, Messe München, Germany.

Artificial intelligence is reshaping the semiconductor landscape, demanding breakthroughs across the entire technology stack.

This session explores the deep-tech innovations enabling the AI era—from advanced compute, 3D integration and silicon photonics to power-efficient packaging—before showcasing two real-world demonstrations and concluding with Europe’s vision for sustainable AI infrastructure.

During this 19th edition of Leti Innovation Days Tokyo, CEA-Leti’s CEO will celebrate R&D partnerships with its partners in Japan and explore new possibilities to support the Japanese semiconductor industry. This year’s theme is “The AI-Chip Revolution: Scaling Innovation in Semiconductors”.

High-level speakers and technical experts will present the latest advances through keynote speeches, seminars and live demos. Join us to enjoy lively networking and exchanges in a unique setting at the Residence of France in Japan.

CEA-Leti has invested in multidisciplinary platforms with unique equipment and expertise. By leveraging advances in heterogeneous integration, new materials and photonics, we are driving semiconductor innovation and tackling the new challenges of disruptive AI markets and technologies.

During this 19th edition of Leti Innovation Days Tokyo, CEA-Leti’s CEO will celebrate R&D partnerships with its partners in Japan and explore new possibilities to support the Japanese semiconductor industry. This year’s theme is “The AI-Chip Revolution: Scaling Innovation in Semiconductors”.

High-level speakers and technical experts will present the latest advances through keynote speeches, seminars and live demos. Join us to enjoy lively networking and exchanges in a unique setting at the Residence of France in Japan.

Event | Agenda|Interlaken, Switzerland

CEA-Leti has the honour to be invited to organize a Tutorial on sustainability in semiconductor industry and life cycle assement by the Program Chair, Helmut Schift from PSI institute. It will the second edition after the tutorial held in Montpellier in 2024 during the celebration of 50th anniversary.

This full-day tutorial objective is to train engineers and young researchers both in assessing the environmental footprint assessing (LCA) and adopting sustainable practices in semiconductor industry based on eco-responsible approach. We will illustrate this using practical case studies, ranging from resource optimisation, greenhouse gas (GHG) emissions or energy consumption reduction to the resilience of electronic components.

Lecturers- experts in their field will be speaking : ; Jeff Kettle, University of Glasgow, United Kingdom;Sébastien Toussaint, UCL, Belgium; Cyrille Hibert, EPFL, Switzerland, Isabelle Servin and Yannick Rivoira, CEA-Leti, France