MEMS 与成像传感器峰会

MEMS & Imaging Sensors Summit

CEA-Leti Quality unknown · 质量未知 Original
摘要
CEA-Leti将在2026年11月10日至13日于德国慕尼黑举办的MEMS & Imaging Sensors Summit上展示其MEMS与传感器前沿研究成果，并强调从实验室到真实应用的落地进展。该机构将与旗下初创公司联合呈现面向“感知与物理AI”新挑战的突破技术，包括先进MEMS与光机电（optomechanics）、新一代惯性传感器以及小型化能源解决方案，相关负责人包括CEA-Leti的光机电项目经理等。活动还将安排FAMES试点产线团队在CHIPS JU展位C2311（2号馆）参展，预计将推动产业合作与传感/物理AI相关技术的商业化。

2026年11月10日至13日，MEMS & Imaging Sensors Summit将在德国慕尼黑举行。CEA-Leti将借此展示其在MEMS与传感器技术领域的前沿研究如何从实验室走向实际应用，并推动新一轮产业创新。

本次亮相的重点将围绕“感知”和Physical AI（物理人工智能）面临的新需求展开。CEA-Leti将联合旗下初创企业，展示一系列突破性技术，覆盖先进MEMS、光机械学（optomechanics）、下一代惯性传感器，以及微型化能源解决方案等方向，强调这些技术在新型智能感知系统中的应用潜力。

现场还将出现CEA-Leti相关团队与合作方的多项角色，包括光机械学项目经理、Injectpower首席执行官，以及CEA-Leti的MEMS工业合作伙伴经理等，显示该机构不仅在研发端布局，也在推动技术商业化和产业协同。

此外，FAMES pilot line团队将于CHIPS JU展位C2311（2号馆）接待来访者，进一步介绍其相关进展。大会相关信息可在MEMS & Imaging Sensors Summit官网查询。活动期间，11月11日同样在慕尼黑，相关联系人为CEA-Leti的MEMS Industrial Partnerships Manager Pierre-Damien Berger，可就活动或合作事宜进行咨询。

Summary
At the MEMS & Imaging Sensors Summit in Munich (Nov 10–13, 2026), CEA-Leti will showcase its MEMS and sensor research and how it is moving from lab work to real-world applications, including advances in optomechanics, next-generation inertial sensors, and miniaturized energy solutions. The company will present these developments alongside its startups, framing them as responses to emerging sensing challenges and “Physical AI.” CEA-Leti’s team includes a Project Manager in Optomechanics and an Industrial Partnerships Manager, and the FAMES pilot line team will be featured at CHIPS JU’s booth C2311 (Hall 2), signaling potential industry collaboration and commercialization momentum.

From 11 to 13 November 2026 in München, Germany, CEA-Leti will present its latest work at the MEMS & Imaging Sensors Summit, highlighting how its research in MEMS and sensor technologies is moving from the lab into practical applications.

Together with its startups, the institute will showcase breakthrough technologies aimed at emerging sensing and Physical AI challenges. The focus spans advanced MEMS and optomechanics, next-generation inertial sensors, and miniaturized energy solutions.

CEA-Leti will be represented by specialists including a Project Manager in Optomechanics, the Chief Executive Officer of Injectpower, and CEA-Leti’s MEMS Industrial Partnerships Manager. The FAMES pilot line team will also be present at CHIPS JU’s booth C2311 in Hall 2.

The summit takes place in München on 11/11/2026, and further information is available on the MEMS & Imaging Sensors Summit website. For questions, contact Pierre-Damien Berger, MEMS Industrial Partnerships Manager.

Résumé
Du 10 au 13 novembre 2026 à Munich, le CEA-Leti présentera au MEMS & Imaging Sensors Summit ses avancées en MEMS et capteurs, avec un focus sur le passage du laboratoire à des applications concrètes. En partenariat avec ses startups, l’organisme mettra en avant des technologies pour relever les défis du sensing et de l’« Physical AI », notamment via l’opto-mécanique, des capteurs inertiels nouvelle génération et des solutions d’énergie miniaturisées, avec la participation de responsables comme Pierre-Damien Berger et le CEO d’Injectpower. L’événement vise à accélérer l’innovation industrielle autour des capteurs et de l’IA physique.

From 11/10/2026 to 11/13/2026München, Germany

At the MEMS & Imaging Sensors Summit, CEA-Leti will showcase how its cutting-edge research in MEMS and sensor technologies is driving innovation from the lab to real-world applications.

Together with its startups, CEA-Leti will highlight breakthrough technologies addressing the new challenges of sensing and Physical AI, from advanced MEMS and optomechanics to next-generation inertial sensors and miniaturized energy solutions.​

Project Manager in Optomechanics, CEA-Leti ​

Chief Executive Officer, Injectpower​

MEMS Industrial Partnerships Manager, CEA-Leti

VISIT THE FAMES PILOT LINE TEAM AT CHIPS JU'S BOOTH C2311 - HALL 2 !

ABOUT MEMS & IMAGING SENSORS SUMMIT

More information on ​​MEMS & Imaging Sensors Summit​’s website

11/11/2026 |​ München, Germany​​

Contact:​​Pierre-Damien Berger​with any questions.​​

MEMS Industrial Partnerships Manager​

AI Insight
中文 EN
Core Point

CEA-Leti将在2026年11月在德国慕尼黑参加MEMS & Imaging Sensors Summit，联合初创团队展示MEMS/成像/光机电与惯性传感及“物理AI”相关传感技术，推动从实验室到应用落地。

Key Players

CEA-Leti — 法国半导体与微纳传感研发机构，基于MEMS、光机电与传感器技术推进产业化；总部在法国。

Injectpower — 传感/能量相关方案初创公司（文中列出CEO），总部信息未给出。

FAMES Pilot Line Team（CHIPS JU展台C2311） — 参与CHIPS JU的试点产线团队，地点在慕尼黑展会现场。

Industry Impact
  • Computing/AI: Medium — “Physical AI”与传感硬件协同，强化边缘感知与物理建模能力。
  • ICT: Medium — 高性能MEMS/成像/惯性传感器有望提升工业与终端感知链路。
  • Energy: Medium — “miniaturized energy solutions”指向微型供能/能量管理技术应用。
Tracking

Monitor — 关注CEA-Leti与初创及CHIPS JU试点产线的技术展示与潜在合作/订单转化。

Highlights
Upcoming Event
Related Companies
CEA-Leti
CEA-Leti mature
positive
InjectPower
CEA-Leti startup
neutral
Categories
半导体 科研
AI Processing
2026-09-24 15:29
openai / gpt-5.4-nano