From 12/15/2026 to 12/15/2026San Francisco, CA
Co-organized by CEA-Leti and Soitec,the event invites you to step inside their lab-to-fab pipeline and discover the next advancesin semiconductors,embedded AI, sequential 3D, FeRAM memory.
In an executive-level format, you will have the opportunity to:• Connect and network with your peers• Exchange directly with leading experts• Explore the latest technology and market roadmaps
All in a refined and collaborative atmosphere designed to spark ideas and foster high-value connections.
Event | Agenda|Grenoble, France
CEA-Leti is proud to co-organize the first edition of Open Innovation Materials & Manufacturing Europe (OIM² Europe), a new European forum designed to bridge the gap between cutting-edge research and industrial innovation in advanced materials, nanotechnologies, and sustainable manufacturing.
Event|Grenoble Scientific Polygon, France
Europe has the expertise and skills to promote a more responsible digital sector (frugality, regulation, ethics) that creates high-quality jobs. However, mastery of data is just as crucial as mastery of materials and energy when it comes to the operability and sustainability of disruptive digital components and integrated circuits. More sustainable integrated hardware and software solutions will be discussed at the END* symposium in the field of Information & Communication Technologies (ICT)
Event | Agenda|SEMICON Europa, Messe München, Germany.
Artificial intelligence is reshaping the semiconductor landscape, demanding breakthroughs across the entire technology stack.
This session explores the deep-tech innovations enabling the AI era—from advanced compute, 3D integration and silicon photonics to power-efficient packaging—before showcasing two real-world demonstrations and concluding with Europe’s vision for sustainable AI infrastructure.
During this 19th edition of Leti Innovation Days Tokyo, CEA-Leti’s CEO will celebrate R&D partnerships with its partners in Japan and explore new possibilities to support the Japanese semiconductor industry. This year’s theme is “The AI-Chip Revolution: Scaling Innovation in Semiconductors”.
High-level speakers and technical experts will present the latest advances through keynote speeches, seminars and live demos. Join us to enjoy lively networking and exchanges in a unique setting at the Residence of France in Japan.
Physical AI begins with sensing. As AI moves into the physical world, application-specific sensors are becoming essential for enabling efficient, reliable, and scalable systems. This year the MEMS & Imaging Summit explores how sensor innovation, semiconductor technologies, and advanced manufacturing are shaping the next generation of Physical AI. From custom sensor design to system integration, industry experts will discuss how purpose-built sensing solutions are driving practical applications across medical, manufacturing and consumer applications.
CEA-Leti will present three papers at CHES, the leading conference on cryptography and cybersecurity for embedded devices as well as a paper at a satellite conference focused on fault injection attacks.