From 10/11/2026 to 10/15/2026Antalya, Turkey
CEA-Leti will present three papers at CHES, the leading conference on cryptography and cybersecurity for embedded devices as well as a paper at a satellite conference focused on fault injection attacks.
DISCOVER CEA-LETI’S MAJOR SCIENTIFIC RESULTS AT CHES 2026
Sunday, October 112:20 pmFDTC - Session 3
Giorgio Fardo,Damien Couroussé,Mathieu Jan,Laurent Maingault,Loïc Mangin
Bridging Laser Fault Injection Experiments and Pre-Silicon Analysis on AES Hardware
Tuesday, October 132:50 pmCHES 2026 - Session 8B
Antoine Moran,Maxime Lecomte,Julien Maillard,Benjamin Smith,Guénaël Renault
Soft Analytical Side-Channel Attacks on SHA-2 and HMAC
Wednesday, October 1410:10 amCHES 2026 - Session 10A
Antonio Ras,Antoine Loiseau,Mikael Carmona,Simon Pontie,Guénaël Renault,Benjamin Smith,Emanuele Valea
PHOENIX: Crypto-Agile Hardware Sharing for ML-KEM and HQC
Wednesday, October 142:50 pmCHES 2026 - Session 12A
Julie Godard,Nicolas Aragon,Philippe Gaborit,Antoine Loiseau,Julien Maillard
Non-supervised SASCA on the VOLEitH Framework
Thuesday, October 158:00 amCHES 2026 - Session 13B
Dorian Llavata,Eleonora Cagli,Rémi Eyraud,Vincent Grosso,Lilian Bossuet
BTCCA: Unsupervised Horizontal Attack against RSA Primitive with Barlow Twins Collision Correlation Analysis
The annual Conference on Cryptographic Hardware and Embedded Systems (CHES) is the premier venue for research on design and analysis of cryptographic hardware and software implementations. As an area conference of the International Association for Cryptologic Research (IACR), CHES bridges the cryptographic research and engineering communities, and attracts participants from academia, industry, government and beyond.
More information on CHES 2026’s website
From 10/11/2026 to 10/15/2026 |Antalya, Turkey
Contact:Laurent Maingaultwith any questions.
Hardware cybersecurity Scientificic advisor
Event | Agenda|Grenoble, France
CEA-Leti is proud to co-organize the first edition of Open Innovation Materials & Manufacturing Europe (OIM² Europe), a new European forum designed to bridge the gap between cutting-edge research and industrial innovation in advanced materials, nanotechnologies, and sustainable manufacturing.
Co-organized by CEA-Leti and Soitec, the event invites you to step inside their lab-to-fab pipeline and discover the next advances in semiconductors, embedded AI, sequential 3D, FeRAM memory.
Event|Grenoble Scientific Polygon, France
Europe has the expertise and skills to promote a more responsible digital sector (frugality, regulation, ethics) that creates high-quality jobs. However, mastery of data is just as crucial as mastery of materials and energy when it comes to the operability and sustainability of disruptive digital components and integrated circuits. More sustainable integrated hardware and software solutions will be discussed at the END* symposium in the field of Information & Communication Technologies (ICT)
Event | Agenda|SEMICON Europa, Messe München, Germany.
Artificial intelligence is reshaping the semiconductor landscape, demanding breakthroughs across the entire technology stack.
This session explores the deep-tech innovations enabling the AI era—from advanced compute, 3D integration and silicon photonics to power-efficient packaging—before showcasing two real-world demonstrations and concluding with Europe’s vision for sustainable AI infrastructure.
During this 19th edition of Leti Innovation Days Tokyo, CEA-Leti’s CEO will celebrate R&D partnerships with its partners in Japan and explore new possibilities to support the Japanese semiconductor industry. This year’s theme is “The AI-Chip Revolution: Scaling Innovation in Semiconductors”.
High-level speakers and technical experts will present the latest advances through keynote speeches, seminars and live demos. Join us to enjoy lively networking and exchanges in a unique setting at the Residence of France in Japan.
Physical AI begins with sensing. As AI moves into the physical world, application-specific sensors are becoming essential for enabling efficient, reliable, and scalable systems. This year the MEMS & Imaging Summit explores how sensor innovation, semiconductor technologies, and advanced manufacturing are shaping the next generation of Physical AI. From custom sensor design to system integration, industry experts will discuss how purpose-built sensing solutions are driving practical applications across medical, manufacturing and consumer applications.