2026年显示周

DISPLAY WEEK 2026

CEA-Leti Original
摘要
法国研究机构CEA-Leti将于2026年5月在美国洛杉矶展示其高性能MicroLED技术,该技术旨在推动下一代显示器和数据中心光通信的发展。此外,CEA-Leti还将在同年6月于法国和台湾举办多场半导体行业峰会,重点介绍其在半导体可靠性、先进封装及AI硬件架构等领域的最新成果。

2026年5月5日至7日,法国研究机构CEA-Leti将在美国洛杉矶的Display Week 2026展会上,重点展示其面向下一代显示与数据通信的高性能MicroLED解决方案。该技术旨在服务于人工智能、高性能计算及数据中心领域,并有望在显示技术及环境交互方面实现重大突破。

CEA-Leti将推出一套可见光通信系统,旨在提升高速计算场景下的传输速度、密度并降低功耗。展会期间,其专家团队将到场介绍最新技术成果,项目负责人Vygintas Jankus和François Templier将负责接洽问询。

除Display Week外,CEA-Leti还将在2026年参与多项重要行业活动。6月23日至25日,在法国格勒诺布尔举行的LID World Summit峰会上,CEA-Leti将向超过1250名半导体行业专业人士展示其在半导体可靠性与先进压电材料方面的最新进展。报告将重点阐述MEMS(微机电系统)从1980年代至今的发展路线图,特别是推动下一代设备创新的材料与传感技术,涉及麦克风MEMS和光机械传感等领域。

此外,CEA-Leti首席执行官Sébastien Dauvé将携专家团队,与台湾工业技术研究院(ITRI)的领导人及专家在中国台湾新竹举行战略研讨会。会议将聚焦全球半导体行业展望、硅光子学、先进异质集成与封装、MicroLED、电源管理策略以及支持人工智能的硬件架构等前沿议题。

CEA-Leti还确认将在2026年的IRPS(国际可靠性物理研讨会)上展示其在微电子可靠性领域的综合专业知识。这一系列密集的行业亮相,凸显了该机构在推动显示技术、数据通信及半导体前沿创新方面的活跃角色。

Summary
CEA-Leti will present its high-performance microLED technology for next-generation displays and data communications at Display Week in Los Angeles from May 5-7, 2026. The French research institute will also showcase semiconductor reliability and advanced piezoelectric materials at the LID World Summit in Grenoble in June and at IRPS 2026, highlighting innovations for AI, HPC, and data centers.

CEA-Leti Announces Major MicroLED and Semiconductor Tech Showcases for 2026

French research institute CEA-Leti has outlined a series of high-profile presentations and events for 2026, headlined by the debut of its advanced microLED technology at Display Week in Los Angeles.

Display Week 2026: MicroLEDs for Displays and Data Comms

From May 5-7, 2026, in Los Angeles, CEA-Leti will introduce its high-performance microLED solutions. The technology is targeted at next-generation displays and visible light communication (VLC) systems for applications in AI, high-performance computing (HPC), and data centers. The institute positions this as a major breakthrough for display technology and environmental interaction, promising improvements in speed, density, and power consumption for computing. Experts Vygintas Jankus and François Templier will be available for discussions.

LID World Summit 2026: Semiconductor Reliability & MEMS

Following that, CEA-Leti will present its latest results in semiconductor reliability and advanced piezoelectric materials at the LID World Summit in Grenoble, France, from June 23-25. The event, expected to draw over 1,250 industry professionals, will feature a presentation on the evolution of Microelectromechanical Systems (MEMS). The talk will chart the development from simple capacitive sensors of the 1980s to today's highly sensitive piezoresistive sensors, focusing on innovative materials and sensing technologies for next-generation devices like microphone MEMS and optomechanical sensors.

Taiwan Strategic Seminar: Ecosystem Collaboration

In a separate strategic event, CEA-Leti CEO Sébastien Dauvé will join experts from the institute and Taiwan's Industrial Technology Research Institute (ITRI) for an afternoon seminar in Hsinchu, Taiwan. The program, focused on high-level exchanges between the French and Taiwanese innovation ecosystems, will cover the global industry outlook and latest advances in Silicon Photonics, Advanced Heterogeneous Integration and Packaging, MicroLEDs, Power Management, and AI-enabling hardware architectures.

Ongoing Expertise: Reliability at IRPS 2026

Concurrently, CEA-Leti has announced it will showcase its integrated expertise in microelectronics reliability at the International Reliability Physics Symposium (IRPS) in 2026, underscoring its broad activity across the semiconductor value chain.

Résumé
Le CEA-Leti présentera ses solutions microLED hautes performances pour les écrans de nouvelle génération et les communications de données lors du Display Week à Los Angeles en mai 2026. L'institut mettra également en avant son expertise en fiabilité des semiconducteurs et en matériaux piézoélectriques lors du LID World Summit à Grenoble en juin, et participera à des échanges stratégiques sur l'innovation dans les semiconducteurs avec Taïwan. Ces annonces visent à renforcer la position du CEA-Leti dans les technologies clés pour l'IA, le calcul haute performance et les centres de données.

From 5/5/2026 to 5/7/2026Los Angeles, USA

​CEA-Leti will introduce their high-performance microLED solutions for next-generation displays and data communications.​​

COME AND MEET CEA-LETI'S EXPERTS​

Come and discuss our lastest achievements on microLED technology for displays and data communications.

High-performance solutions for next-generation displays and data communications for AI, HPC, and data centers​​

A major breakthrough in display technologies and interaction with the environment

A visible light communication system to improve speed, density and power consumption for high- performance computing.​ ​

More information on ​​DISPLAY WEEK​​ website

From05/05/2026to07​/05/2026​ |Los Angeles, USA

Contacts:Vygintas JankusorFrançois Templier​​with any questions.​​

Program Manager,

Displays

Event|Maison Minatec, Grenoble, France

LID World Summit from 23 to 25 June offer you a front-row seat to our most recent advances. Join more than 1,250 semiconductor industry professionals at this three-day global event and come away equipped and inspired to innovate!​

CEA-Leti showcases its latest results in semiconductor reliability and advanced piezoelectric materials.

The field of Microelectromechanical Systems (MEMS) has evolved significantly since the 1980s, transitioning from simple capacitive sensors to highly sensitive piezoresistive sensors. This presentation will outline the development roadmap for MEMS, emphasizing innovative materials and sensing technologies that are driving next-generation devices, particularly in microphone MEMS and optomechanical sensing.

Event | Agenda|Ambassador Hotel, Hsinchu, Taiwan

Stay ahead in semiconductor innovation.

Join CEA-Leti CEO Sébastien Dauvé, together with CEA-Leti experts and ITRI leaders and specialists, for a strategic afternoon dedicated to semiconductor innovative technologies and high-level exchanges between French and Taiwanese innovation ecosystems. The program will address global industry outlook, and the latest advances in Silicon Photonics, Advanced Heterogeneous Integration and Packaging, MicroLEDs, Power Management strategies and AI-enabling hardware architectures.

CEA-Leti to Showcase Integrated Expertise In Microelectronics Reliability at IRPS 2026

AI Insight
Core Point

CEA-Leti将在Display Week 2026上展示其用于下一代显示和数据通信的高性能MicroLED解决方案,这标志着显示技术与光通信融合的关键进展。

Key Players

CEA-Leti — 法国领先的微电子和纳米技术研究机构,总部位于格勒诺布尔。

Industry Impact
  • ICT: 高 — 高性能光通信系统可提升数据中心与HPC的速度与能效。
  • Terminals/Consumer Electronics: 高 — MicroLED是下一代显示技术的核心突破。
  • Computing/AI: 中 — 为AI硬件架构提供新型光通信与使能硬件支持。
Tracking

Strongly track — CEA-Leti在MicroLED和硅光子学等关键使能技术上的集成创新,将定义多个硬件平台的下一代发展路径。

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半导体 科研
AI Processing
2026-04-22 15:42
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