CEA-Leti’s 28th LID World Summit returns to Grenoble from June 23–25, 2026, expecting over 1,250 international industry leaders. Themed “Lab to Market with Sustainable Chips to Power the Next Wave of AI Factories,” the event tackles the semiconductor industry’s pressing shift from R&D-focused lab-to-fab models toward scalable lab-to-market structures. It highlights sustainable chip innovations essential for next-generation AI factories while aiming to bolster European technological sovereignty and competitiveness amid surging demand for advanced AI semiconductors.

The summit features 11 technical conferences covering: data and network/cloud convergence, computing and defense semiconductors, cybersecurity, the FAMES Pilot Line, the RESOLVE Initiative, and a dedicated startups and investments track showcasing deep tech ventures from early-stage to growth-ready companies. A closing session on “Disruptive Digital Interfaces” with a special guest speaker will decode the next wave of digital experiences.

LID World Summit anchors a global series of tech events—including editions in Taiwan, Austin, Silicon Valley, Tokyo, and specialized gatherings on interconnects and photonics—that foster cross-sector collaboration on mobility, healthcare, telecom, low-carbon energy, space, and defense challenges.

​​​28th Annual Gathering Brings 1,250+ International Industry Leaders to Grenoble ​​​To Accelerate the Transition From R&D to Commercial Deployment​

GRENOBLE, France – April 30, 2026 – CEA-Leti's three-day conference,LID World Summit 2026(June 23-25), will explore the semiconductor industry's critical transition from lab-to-fab to lab-to-market structures, powered by sustainable chips, essential to next-generation AI factories.

With the theme of “Lab to Market with Sustainable Chips to Power the Next Wave of AI Factories", the 28thedition of the LID World Summit will showcase innovations that advance European technological sovereignty and chip competitiveness, while strengthening industry capacity to support accelerating demand for advanced AI semiconductors.

In addition to presenting timely perspectives on strategic technologies driving international competitiveness, this year's event will offer 11 technical conferences covering topics such as​​​ data & network/cloud convergence, semiconductors for computing and defense, cybersecurity, the FAMES Pilot Line, the RESOLVE Initiative, and startups and investments.

Startups an​​​d Investments:Emerging technologies and investments across deep tech—from early-stage ventures to growth-ready companies shaping the next industrial wave.

Closing Confer​ence:Disruptive Digital Interfaces: decoding the next wave of digital experiences featuring a special guest ​​speaker.

The LID World Summit is CEA-Leti's signature international event and largest annual gathering. It anchors a series of tech events including LID Taiwan, LID Interconnect, LID Austin, LID Silicon Valley, LID Tokyo, LID Tech Connect and LID Photonics. These events highlight technological breakthroughs and collaboration across sectors responding to society's pressing challenges in mobility, healthcare, telecom, low-carbon energy, space, and defense & security.

Clickhe​​​reto see details of event keynotes, conferences & presentations.​​