2026年9月30日至10月1日，聚焦半导体技术未来的高端论坛FIRST by FMD将在德国柏林举行。该论坛旨在提升欧洲竞争力、技术主权、安全与可持续增长，紧密呼应《欧盟芯片法案》和德国高技术议程等重大倡议，为新兴技术、工业路线图及未来基础设施的讨论提供平台。活动汇聚产业、研究机构与公共部门代表，已确认的发言人来自弗劳恩霍夫、英特尔、格罗方德、Silicon Saxony、西门子医疗以及德国联邦研究与技术航天部等机构。议程覆盖半导体全价值链发展及其在人工智能、汽车、医疗、工业制造、电信和能源等关键领域的应用。重点议题包括由“德国微电子研究制造”推动的APECS中试线，该倡议旨在为先进封装与设计技术提供产业导向环境，支持芯片颗粒架构和异构集成，强化欧洲半导体生态系统。论坛还将探讨协作机遇与市场趋势。
FIRST by FMD——欧洲微电子趋势、路线图与战略对齐大会
FIRST by FMD – The European conference on microelectronic trends, roadmaps and strategic alignment
摘要
欧洲半导体技术论坛FIRST by FMD将于2026年9月30日至10月1日在柏林举行，汇聚弗劳恩霍夫、英特尔、格芯、西门子医疗及德国联邦教研部等产业与政府代表。会议将讨论后摩尔时代的芯片技术与市场趋势及APECS先进封装试产线，旨在推动异构集成和芯粒架构发展。该论坛聚焦半导体在人工智能、汽车、医疗等领域应用，旨在加强欧洲竞争力和技术主权。
欧洲半导体技术论坛FIRST by FMD将于2026年9月30日至10月1日在柏林举行，汇聚弗劳恩霍夫、英特尔、格芯、西门子医疗及德国联邦教研部等产业与政府代表。会议将讨论后摩尔时代的芯片技术与市场趋势及APECS先进封装试产线，旨在推动异构集成和芯粒架构发展。该论坛聚焦半导体在人工智能、汽车、医疗等领域应用，旨在加强欧洲竞争力和技术主权。
Summary
The FIRST by FMD forum will take place in Berlin on 30 September – 1 October 2026, gathering semiconductor leaders from Fraunhofer, Intel, GlobalFoundries, and government bodies to align on technology roadmaps and strategic initiatives like the EU Chips Act. The event will highlight the APECS pilot line for advanced chiplet packaging and heterogeneous integration, aiming to strengthen Europe’s competitiveness and technological sovereignty across AI, automotive, and other key sectors.
The FIRST by FMD forum will take place in Berlin on 30 September – 1 October 2026, gathering semiconductor leaders from Fraunhofer, Intel, GlobalFoundries, and government bodies to align on technology roadmaps and strategic initiatives like the EU Chips Act. The event will highlight the APECS pilot line for advanced chiplet packaging and heterogeneous integration, aiming to strengthen Europe’s competitiveness and technological sovereignty across AI, automotive, and other key sectors.
FIRST by FMD, a high-level European semiconductor forum, takes place in Berlin on 30 September–1 October 2026. Anchored in the EU Chips Act and Germany’s Hightech Agenda, the event focuses on strengthening Europe’s competitiveness, technological sovereignty, and sustainable growth. It brings together industry players, research organizations, and public authorities to examine emerging technologies, industrial roadmaps, and future infrastructure needs. Confirmed speakers include leaders from Fraunhofer, Intel, GlobalFoundries, Silicon Saxony, Siemens Healthineers, and the German Federal Ministry of Research, Technology and Space. The programme spans the semiconductor value chain and key application sectors: artificial intelligence, automotive, healthcare, industrial manufacturing, telecoms, and energy. A central feature is the APECS pilot line, run by Research Fab Microelectronics Germany, which provides an industry-oriented platform for advanced packaging, chiplet architectures, and heterogeneous integration. The forum also addresses market trends and collaboration opportunities across the ecosystem. Full details are available via FIRST by FMD.
Résumé
Le forum FIRST by FMD se tiendra à Berlin du 30 septembre au 1er octobre 2026, réunissant des acteurs majeurs tels que Fraunhofer, Intel et GlobalFoundries autour des feuilles de route industrielles et de la souveraineté technologique européenne. L’événement mettra en avant la ligne pilote APECS pour le packaging avancé et les architectures chiplet, visant à renforcer l’écosystème semiconductor dans des secteurs clés comme l’IA, l’automobile et la santé.
Le forum FIRST by FMD se tiendra à Berlin du 30 septembre au 1er octobre 2026, réunissant des acteurs majeurs tels que Fraunhofer, Intel et GlobalFoundries autour des feuilles de route industrielles et de la souveraineté technologique européenne. L’événement mettra en avant la ligne pilote APECS pour le packaging avancé et les architectures chiplet, visant à renforcer l’écosystème semiconductor dans des secteurs clés comme l’IA, l’automobile et la santé.
Members of the European semiconductor community may be interested in FIRST by FMD (Fast Innovation through Research in Semiconductor Technologies), taking place on 30 September – 1 October 2026 in Berlin, Germany.
FIRST is a high-level forum dedicated to the future of semiconductor technologies and their role in strengthening Europe’s competitiveness, technological sovereignty, security and sustainable growth. Against the backdrop of major European initiatives such as the EU Chips Act and Germany’s Hightech Agenda, the event will provide a platform for discussions on emerging technologies, industrial roadmaps and future infrastructure developments.
The forum brings together representatives from industry, research organisations and public authorities across the semiconductor ecosystem. Confirmed speakers include experts and leaders from organisations such as Fraunhofer, Intel, GlobalFoundries, Silicon Saxony, Siemens Healthineers, and the German Federal Ministry of Research, Technology and Space.
The programme will address developments across the semiconductor value chain and their applications in key sectors including artificial intelligence, automotive, healthcare, industrial manufacturing, telecommunications and energy.
Among the topics featured at FIRST 2026 is the APECS pilot line, implemented by Research Fab Microelectronics Germany. The initiative aims to provide an industry-oriented environment for advanced packaging and design technologies, supporting chiplet architectures and heterogeneous integration within the European semiconductor ecosystem.
Key Topics
Emerging semiconductor technology and market trends
Industrial roadmaps and future infrastructure developments
Collaboration opportunities across the semiconductor value chain
Advanced packaging and chiplet technologies through the APECS pilot line
Applications in AI, automotive, healthcare, telecommunications, manufacturing and energy
Further information is available via FIRST by FMD.
The post FIRST by FMD – The European conference on microelectronic trends, roadmaps and strategic alignment appeared first on Aeneas.
Core Point
FIRST by FMD 宣布2026年柏林半导体论坛，聚焦欧洲竞争力与技术主权，推动欧盟芯片法案下的产业路线图。
Key Players
- Fraunhofer — 德国应用研究机构，总部德国。
- Intel — 美国芯片制造商，全球布局。
- GlobalFoundries — 美国/德国代工厂，总部美国，德累斯顿有工厂。
- Silicon Saxony — 德国萨克森硅谷行业协会，位于德累斯顿。
- Siemens Healthineers — 医疗设备公司，总部德国。
- German Federal Ministry of Research — 德国联邦教研部。
Industry Impact
- ICT: High — 半导体路线图直接推动电信基础设施。
- Energy: Medium — 半导体在能效和能源管理中的应用受关注。
- Computing/AI: High — 先进封装和chiplet技术是算力关键。
- Automotive: Medium — 半导体支撑汽车电子与智能化演进。
Tracking
Monitor — 论坛距召开尚有时间，但战略合作与趋势值得观察。
Highlights
Upcoming Event
Related Companies
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GlobalFoundries
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Intel
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Siemens Healthineers
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Categories
半导体
科研
AI Processing
2026-06-04 23:13
deepseek / deepseek-v4-pro