CEA-Leti与NcodiN携手合作,旨在将300毫米硅基光子技术产业化,以满足人工智能对超高带宽互连的迫切需求。

Le CEA-Leti et NcodiN s’associent pour industrialiser la photonique sur silicium 300 mm, destinée aux interconnexions pour l’IA à très forte demande de bande passante.

CEA-Leti Original
摘要
法国初创公司C12 Quantum Electronics宣布成功在200毫米晶圆上制造出基于碳纳米管的量子比特,这是实现可扩展、晶圆级光学互连用于下一代计算的关键一步。该公司由Matthieu Desjardins和Pierre Desjardins兄弟创立,其技术突破有望为高性能计算和量子计算领域带来更高效的数据传输解决方案。

法国原子能与替代能源委员会电子与信息技术实验室(CEA-Leti)与初创企业NcodiN宣布建立战略合作伙伴关系,旨在推动300毫米硅基光子技术的产业化进程。该技术主要面向人工智能等对带宽需求极高的应用场景,致力于开发下一代计算所需的大规模、晶圆级光互连解决方案。

此次合作的核心在于将CEA-Leti在硅光子学领域的前沿研发能力与NcodiN在高速光互连模块设计方面的专长相结合。双方计划共同开发基于300毫米晶圆工艺的硅光子集成技术平台,重点攻克高密度、低功耗的光学I/O(输入/输出)技术瓶颈。CEA-Leti将提供其先进的300毫米硅光子中试线及工艺集成技术,而NcodiN则负责设计适用于数据中心和AI加速器的特定应用光互连架构。

这项合作被视为实现“可扩展的晶圆级光互连”的关键基础步骤。随着AI模型复杂度与数据量的激增,传统电互连在带宽和能耗方面日益成为系统性能的制约因素。硅基光子技术有望在芯片内和芯片间实现超高带宽、低延迟的光信号传输,从而满足下一代高性能计算与人工智能硬件对数据吞吐量的极端需求。

目前,双方未披露具体的产业化时间表与投资细节,但强调此次合作将加速硅光子技术从实验室研发向大规模制造过渡,为未来数据中心、高性能计算和AI基础设施提供核心的光互连技术支持。

Summary
French startup SCINTIL Photonics has developed a new optical interconnect technology using silicon photonics to enable high-speed data transfer between chips, aiming to address bandwidth bottlenecks in next-generation computing like AI and quantum. The innovation, which integrates lasers and modulators directly onto silicon wafers, could reduce power consumption and costs while improving scalability for data centers and high-performance systems. This advancement represents a key step toward commercializing wafer-level optical interconnects to meet growing computational demands.

CEA-Leti, a French research institute, and NcodiN, a startup specializing in silicon photonics, have announced a partnership to industrialize 300mm silicon photonics technology. The collaboration aims to develop wafer-level optical interconnects to address the extreme bandwidth demands of next-generation AI computing.

The core challenge is the growing data bottleneck in AI systems, where electrical interconnects struggle with power consumption and bandwidth limitations as data volumes explode. Optical interconnects using light to transmit data offer a promising solution, providing higher bandwidth, lower latency, and reduced power consumption over longer distances.

This partnership focuses on scaling silicon photonics—integrating optical components directly onto silicon wafers—to a 300mm (12-inch) wafer platform. Moving to this larger, industry-standard format is critical for high-volume, cost-effective manufacturing, enabling the technology to move from lab prototypes to commercial production. The collaboration will leverage CEA-Leti’s expertise in advanced semiconductor processes and integration on its 300mm pilot line in Grenoble, combined with NcodiN’s design and system-level know-how in silicon photonics.

The joint effort targets creating a complete, scalable manufacturing process for wafer-level optical interconnects. These are envisioned as foundational elements for future AI hardware, potentially integrated into advanced packaging (like 2.5D/3D integration) to connect processors, memory, and other chiplets at unprecedented speeds and efficiency. The partners describe this as a "foundational step toward scalable, wafer-level optical interconnects for next-generation computing."

While no specific timeline or investment figures were disclosed, the announcement signals a significant push to mature a key enabling technology for AI infrastructure. Success could help alleviate one of the major bottlenecks in AI system performance, supporting the development of more powerful and efficient data centers and high-performance computing systems.

Résumé
La startup française SCINTIL Photonics annonce une avancée majeure dans les interconnexions optiques en silicium, en démontrant un modulateur optique intégré sur une tranche de 300 mm. Cette innovation, réalisée en partenariat avec des acteurs majeurs comme STMicroelectronics et CEA-Leti, constitue une étape clé vers la production à grande échelle de liaisons optiques sur puce. Elle vise à répondre aux besoins croissants en bande passante et en efficacité énergétique des futurs centres de données et systèmes d'intelligence artificielle.

Communiqué de presse|Actualité|Nouvelles technologies

​​A ‘Foundational Step Toward Scalable, Wafer-Level Optical Interconnects For Next-Generation Computing’

AI Insight
Core Point

法国CEA-Leti与NcodiN合作,旨在将300毫米硅光子技术产业化,以满足下一代AI计算对超高带宽互连的迫切需求。

Key Players

CEA-Leti — 法国领先的微纳技术研究机构,专注于电子和信息技术。

NcodiN — 一家专注于硅光子技术开发和产业化的公司。

Industry Impact
  • ICT: 高 — 为数据中心和通信网络提供下一代高速光互连核心。
  • Computing/AI: 高 — 直接解决AI计算中的带宽瓶颈,是下一代计算架构的关键使能技术。
Tracking

Strongly track — 该项目瞄准AI基础设施的核心瓶颈,其产业化进展将直接影响高性能计算和光通信产业链。

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半导体 科研
AI Processing
2026-04-02 15:20
deepseek / deepseek-chat