The 52nd International Conference on Micro and Nano Engineering (MNE 2026) will take place in Interlaken, Switzerland, from September 21 to 24. CEA-Leti has been selected by Program Chair Helmut Schift of the PSI Institute to organize a full-day tutorial on sustainability in semiconductor manufacturing and life cycle assessment (LCA), marking the second such session after its debut at the Montpellier edition in 2024 during CEA-Leti’s 50th anniversary celebrations.

The tutorial targets engineers and young researchers, combining instruction on environmental footprint quantification via LCA with practical adoption of eco-responsible practices. Case studies will cover resource optimization, greenhouse gas emissions reduction, energy consumption cuts, and electronic component resilience. Lecturers are experts in their fields, though the detailed speaker list is not disclosed in this announcement.

CEA-Leti will present two invited papers at the conference. On Wednesday, September 23, at 3:00 pm, Isabelle Servin from CEA-Leti will deliver “Sustainable process strategies based on the environmental footprint of semiconductor manufacturing.” Immediately following, at 3:15 pm, Yannick Rivoira, also of CEA-Leti, will speak on “From Silica Sand to Semiconductors: Understanding and Assessing Environmental Impacts in Cleanroom Manufacturing.” Both appear on page 24 of the program. Additionally, CEA-Leti will hold a workshop titled “Towards Sustainable Semiconductor Manufacturing & Life Cycle Assessment in Microelectronics,” a short course illustrating the evaluation of ecological footprints in manufacturing and the application of eco-design principles from cleanroom processes through final components and technologies.

Inquiries about the tutorial or workshop can be directed to Isabelle Servin, CEA-Leti’s sustainability advisor for semiconductor manufacturing.

The announcement also spotlights several other CEA-Leti engagements. The institute co-organizes the first Open Innovation Materials & Manufacturing Europe (OIM² Europe) forum in Grenoble, France, at the Grenoble Scientific Polygon, bridging advanced materials, nanotechnologies, and sustainable manufacturing research with industrial innovation. The END symposium in Grenoble will explore Europe’s role in driving a more responsible digital sector through frugality, regulation, and ethics, with a focus on sustainable integrated hardware and software for ICT. The 19th Leti Innovation Days Tokyo, held at the Residence of France in Japan under the theme “The AI-Chip Revolution: Scaling Innovation in Semiconductors,” will see CEA-Leti’s CEO celebrate R&D partnerships and explore support for Japan’s semiconductor industry, featuring keynotes, seminars, and live demonstrations. Finally, at ESSERC, the European forum for solid-state devices and circuits, CEA-Leti experts will man a booth and present three papers on heterogeneous integration, reflecting the growing need for tighter interaction among technologists, device specialists, IC designers, and system architects.

From 9/21/2026 to 9/24/2026Interlaken, Switzerland

CEA-Leti has the honour to be invited to organize a Tutorial on sustainability in semiconductor industry and life cycle assement by the Program Chair, Helmut Schift from PSI institute. It will the second edition after the tutorial held in Montpellier in 2024 during the celebration of 50th anniversary.

This full-day tutorial objective is to train engineers and young researchers both in assessing the environmental footprint assessing (LCA) and adopting sustainable practices in semiconductor industry based on eco-responsible approach. We will illustrate this using practical case studies, ranging from resource optimisation, greenhouse gas (GHG) emissions or energy consumption reduction to the resilience of electronic components.

Lecturers-​experts in their field will be speaking :

CEA-LETI’S MAJOR SCIENTIFIC RESULTS AT MNE 2026

With 2 invited papers, the institute will present this year’s major scientific results atMNE2026, The 52nd International Conference on Micro and Nano Engineering, including the following topics:

​Invited Talk​WednesdaySeptember 23, 20263:00​ pm​

Sustainable process strategies based on the environment​​al footprint of semiconductor manufact​uring » Isabelle Servin1 (1. CEA-Leti) see Page24

​Invited Talk​​WednesdaySeptember 23,​ 2026​3:15 pm

From Silica Sand to Semiconductors: Understanding and Assessing Environmental Impacts in Cleanroom Manufacturing » Yannick Rivoira1 (1. CEA-Leti) see Page 24​

Workshop CEA-Leti  "Towards Sustainable Semiconductor Manufacturing & Life Cycle Assessment in Microelectronics"

The short course organized by CEA-Leti’s will highlight the evaluation of ecological footprint in semicconductor manufacturing and illustrate sustainable microelectronics from clean room manufacturing to components with and technologies by applying the principles of eco-design.​

More information on ​​MNE 2026’s website

From 09/21/2026 to 09/24/2026 |Interlaken, Switzerland

Contact:Isabell​e Servin​with any questions.​​

Sustainability advisor for Semiconductor Manufaturing, PhD

Event | Agenda|Grenoble, France

CEA-Leti is proud to co-organize the first edition of Open Innovation Materials & Manufacturing Europe (OIM² Europe), a new European forum designed to bridge the gap between cutting-edge research and industrial innovation in advanced materials, nanotechnologies, and sustainable manufacturing.

Event|Grenoble Scientific Polygon, France

Europe has the expertise and skills to promote a more responsible digital sector (frugality, regulation, ethics) that creates high-quality jobs. However, mastery of data is just as crucial as mastery of materials and energy when it comes to the operability and sustainability of disruptive digital components and integrated circuits. More sustainable integrated hardware and software solutions will be discussed at the END* symposium in the field of Information & Communication Technologies (ICT)

CEA-Leti has invested in multidisciplinary platforms with unique equipment and expertise. By leveraging advances in heterogeneous integration, new materials and photonics, we are driving semiconductor innovation and tackling the new challenges of disruptive AI markets and technologies.

During this 19th edition of Leti Innovation Days Tokyo, CEA-Leti’s CEO will celebrate R&D partnerships with its partners in Japan and explore new possibilities to support the Japanese semiconductor industry. This year’s theme is “The AI-Chip Revolution: Scaling Innovation in Semiconductors”.

High-level speakers and technical experts will present the latest advances through keynote speeches, seminars and live demos. Join us to enjoy lively networking and exchanges in a unique setting at the Residence of France in Japan.

CEA-Leti experts will be onsite at CEA-Leti's booth and available to discuss the findings of three papers on heterogeneous integration

The aim of ESSERC is to provide an annual European forum for the presentation and discussion of recent advances in solid-state devices and circuits. The level of integration for system-on-chip design is rapidly increasing. This is made available by advances in semiconductor technology. Therefore, more than ever before, a deeper interaction among technologists, device experts, IC designers and system designers is necessary.