ASML has lined up three of the semiconductor industry’s biggest players — Intel Foundry, TSMC and Samsung — behind its push to accelerate adoption of extreme ultraviolet lithography with high numerical aperture, or EUV High NA, while also moving the ecosystem toward 12-inch masks.
The Dutch equipment maker made the announcements over the course of a single day, on 7 September, as part of a broader effort to build momentum around the next generation of chipmaking lithography. The goal is to speed up industrial deployment of EUV High NA, a technology seen as critical for advancing the most advanced process nodes, and to help standardize the transition to larger 12-inch masks.
ASML’s move underscores how central lithography remains to the semiconductor roadmap, and how much the company is relying on collaboration with leading foundries and chipmakers to make High NA a practical manufacturing tool rather than just a laboratory milestone. By bringing Intel Foundry, TSMC and Samsung into the fold, ASML is signaling that the industry’s top manufacturers are now aligning around the technology’s future use.