CEA-Leti will showcase a broad set of telecom, datacom and RF technologies at European Microwave Week, held from 10/4/2026 to 10/9/2026 in London, UK, with the team available at booth L286. The institute is highlighting a compact, low-power telecom/datacom technology described as enabling ultra-fast future connectivity, alongside RF dielectric sensing powered by an integrated vector network analyzer (VNA).

CEA-Leti will also present several scientific results across the EuMC/EuMIC program. On October 4, at 8:30 am in Room 13, the institute will present “Design of a 39 GHz digital beamforming TRX in 22FD SOI” during WS09. On October 6, at 2:30 pm in Room 16, it will present “Environmental and Social Impact Assessment of an Envisaged FR3-band Base Station” in EuMC/EuMIC01/02. On October 7, in the Exhibition Hall, Emma Complido, Serge Bories and Mattia Merluzzi will present “Phase Profile Optimization for High Gain-Bandwidth Transmitarray at 300 GHz” in EuMC-PO2-4. On October 8, at 11:20 am in Room 7, Mohamad El Chaar, Gustavo Misawa Hama, Florence Podevin, Antonio Augusto Lisboa de Souza, Ariana Lacorte Caniato Serrano, Gustavo Pamplona Rehder and Sylvain Bourdel will present “Environmental Impact Assessment of an FR3-band Base Station” in EuMC45-3. Later that day, at 2:10 pm in Room 7, J.L. Gonzalez-Jimenez, A. Hamani, F. Gamand, V. Gidel, A. Siligaris, G. Ducournau, F. Foglia Manzillo, A. Clemente, R. Mourot, E. Mercier, E. Froger, C. Gaquiere and M. Ramez will present “A Novel Low-complexity gmboosted Oscillator Architecture for Millimeter-Wave Applications.” The agenda also lists “A Hybrid CMOS/GaAs D-band Multi-Channel RX System-in-Package.” More information is available on EuMW’s website, and questions can be directed to Swan GEROME.

Beyond EuMW, CEA-Leti is co-organizing the first edition of Open Innovation Materials & Manufacturing Europe (OIM² Europe) in Grenoble, a new forum intended to connect advanced materials, nanotechnologies and sustainable manufacturing research with industrial innovation. The institute is also involved in the END* symposium at the Grenoble Scientific Polygon, where the focus is on building a more responsible digital sector through frugality, regulation and ethics, while stressing that mastery of data is as important as mastery of materials and energy for the sustainability of disruptive digital components and integrated circuits.

CEA-Leti will also take part in SEMICON Europa at Messe München in Germany, where the discussion centers on how artificial intelligence is reshaping semiconductors and driving the need for advances across the full technology stack. The session will cover deep-tech enablers for the AI era, including advanced compute, 3D integration, silicon photonics and power-efficient packaging, and will include two live demonstrations before concluding with Europe’s vision for sustainable AI infrastructure.

In Tokyo, the 19th edition of Leti Innovation Days will focus on “The AI-Chip Revolution: Scaling Innovation in Semiconductors.” CEA-Leti’s CEO will use the event to celebrate R&D partnerships with Japanese partners and explore new ways to support Japan’s semiconductor industry. The program will feature high-level speakers and technical experts, keynote speeches, seminars and live demos, with networking at the Residence of France in Japan. CEA-Leti says its multidisciplinary platforms, unique equipment and expertise in heterogeneous integration, new materials and photonics are helping drive semiconductor innovation and address the challenges of disruptive AI markets and technologies.

Finally, at INP-Ense³ in Grenoble, CEA-Leti is participating in a workshop on semiconductor junction technology, bringing together researchers, engineers and industry experts to discuss the latest advances and challenges. Philippe Rodriguez of CEA-Leti serves as General Chair, and the institute says its role on the organizing committee is aimed at fostering collaboration across the semiconductor ecosystem.

From 10/4/2026 to 10/9/2026London, UK

MEET CEA-LETI’S EXPERTS AT BOOTH L286

A compact, low-power telecom/datacom technology Technologie télécom/datacom compacte et basse consommation pour une connectivité ultra-rapide. offering unprecedented speed for tomorrow’s connectivity

RF dielectric sensing powered by an integrated VNA​

DISCOVER CEA-LETI’S MAJOR SCIENTIFIC RESULTS

October 4th8:30 am - 6:30 pmWS09 EuMC/ EuMICRoom 13​

Design of a 39 GHz digital beamforming TRX in 22FD SOI

October 6th - 2:30 pmEuMC/EuMIC01/02Room 16

Environmental and Social Impact Assessment of an Envisaged FR3-band Base Station

October 6th - 3:50 pmEuMC05-6Room 4

​D. Demmer, A. Clemente,M. Zhan, B. Ouardi,

Phase Profile Optimization for High Gain-Bandwidth Transmitarray at 300 GHz

October 7thEuMC-PO2-4Exhibition Hall

Emma Complido,Serge Bories, Mattia Merluzzi

Environmental Impact Assessment of an FR3-band Base Station​

October 8th - 11:20 amEuMC45-3Room 7

Mohamad El Chaar, Gustavo Misawa Hama, Florence Podevin, Antonio Augusto Lisboa de Souza, Ariana Lacorte Caniato Serrano, Gustavo Pamplona Rehder, ​Sylvain Bourdel

A Novel Low-complexity gmboosted Oscillator Architecture for Millimeter-Wave Applications​

October 8th - 2:10 pm​EuMC49-1Room 7

J.L. Gonzalez-Jimenez,​A. Hamani, F. Gamand, V. Gidel, A. Siligaris,G. Ducournau, F. Foglia Manzillo, A. Clemente,R. Mourot, E. Mercier, E. Froger,C. Gaquiere, M. Ramez

A Hybrid CMOS/GaAs D-band Multi-Channel RX System-in-Package​

More information on ​​EuMW’s website

From10/4/2026to10/9/2026​  |​London, UK​​

Contact:Swan GEROMEwith any questions.​​

Event | Agenda|Grenoble, France

CEA-Leti is proud to co-organize the first edition of Open Innovation Materials & Manufacturing Europe (OIM² Europe), a new European forum designed to bridge the gap between cutting-edge research and industrial innovation in advanced materials, nanotechnologies, and sustainable manufacturing.

Event|Grenoble Scientific Polygon, France

Europe has the expertise and skills to promote a more responsible digital sector (frugality, regulation, ethics) that creates high-quality jobs. However, mastery of data is just as crucial as mastery of materials and energy when it comes to the operability and sustainability of disruptive digital components and integrated circuits. More sustainable integrated hardware and software solutions will be discussed at the END* symposium in the field of Information & Communication Technologies (ICT)

Event | Agenda|SEMICON Europa, Messe München, Germany.

Artificial intelligence is reshaping the semiconductor landscape, demanding breakthroughs across the entire technology stack.

This session explores the deep-tech innovations enabling the AI era—from advanced compute, 3D integration and silicon photonics to power-efficient packaging—before showcasing two real-world demonstrations and concluding with Europe’s vision for sustainable AI infrastructure.

During this 19th edition of Leti Innovation Days Tokyo, CEA-Leti’s CEO will celebrate R&D partnerships with its partners in Japan and explore new possibilities to support the Japanese semiconductor industry. This year’s theme is “The AI-Chip Revolution: Scaling Innovation in Semiconductors”.

High-level speakers and technical experts will present the latest advances through keynote speeches, seminars and live demos. Join us to enjoy lively networking and exchanges in a unique setting at the Residence of France in Japan.

CEA-Leti has invested in multidisciplinary platforms with unique equipment and expertise. By leveraging advances in heterogeneous integration, new materials and photonics, we are driving semiconductor innovation and tackling the new challenges of disruptive AI markets and technologies.

During this 19th edition of Leti Innovation Days Tokyo, CEA-Leti’s CEO will celebrate R&D partnerships with its partners in Japan and explore new possibilities to support the Japanese semiconductor industry. This year’s theme is “The AI-Chip Revolution: Scaling Innovation in Semiconductors”.

High-level speakers and technical experts will present the latest advances through keynote speeches, seminars and live demos. Join us to enjoy lively networking and exchanges in a unique setting at the Residence of France in Japan.

Event|INP-Ense³, Grenoble, France

The workshop brings together researchers, engineers and industry experts to discuss the latest advances and challenges in semiconductor junction technology.

As a member of the organizing committee, with Philippe Rodriguez (CEA-Leti) serving as General Chair, CEA-Leti plays a key role in driving these exchanges and fostering collaboration across the semiconductor ecosystem