CEA-Leti, CEA-List and PSMC Collaborate to Integrate RISC-V and MicroLED Silicon Photonics into 3D Stacking and Interposer for Next-Generation AI
法国原子能与替代能源委员会（CEA）旗下两大顶尖研究机构——全球领先的微纳技术研究所CEA-Leti与智能数字系统专家CEA-List，近日宣布与力积电（PSMC）达成战略合作。该合作旨在将CEA-List的RISC-V设计专长与CEA-Leti的硅光子技术，整合至力积电成熟的3D堆叠与中介层平台，共同开发面向下一代人工智能系统的高带宽通信与高效能计算解决方案。
当前半导体行业面临多重挑战：传统铜互连的物理极限、日益严格的功耗限制，以及对灵活可扩展计算架构的迫切需求。此次合作通过引入短距离、高带宽的光学互连以实现高效数据传输，并结合可定制的RISC-V处理器架构，直接应对这些瓶颈，有望为高性能数据传输与计算架构建立新范式。
CEA-Leti and CEA-List, the leading microelectronics and digital systems institutes of France's Atomic Energy Commission, have entered a strategic partnership with Taiwan's Powerchip Semiconductor Manufacturing Corporation (PSMC). Announced in April 2026, the collaboration aims to fuse European R&D with advanced manufacturing to tackle core semiconductor challenges for next-generation AI.
The initiative will integrate CEA-List's RISC-V processor design expertise and CEA-Leti's silicon photonics and MicroLED technologies directly into PSMC's established 3D stacking and interposer platforms. The goal is to create solutions that overcome critical industry bottlenecks: the physical and power limits of traditional copper interconnects, and the need for more flexible, scalable computing architectures.
By deploying short-reach, high-bandwidth optical links for energy-efficient data movement alongside customizable RISC-V cores, the partnership seeks to establish a new paradigm in high-performance computing. This combined approach targets more efficient data transport and adaptable processing to meet the demanding requirements of future AI systems.
The two flagship institutes of the French Alternative Energies and Atomic Energy Commission (CEA) are global innovation leaders in microelectronics and intelligent digital systems
GRENOBLE, France – April 3, 2026 – CEA-Leti, a world-leading micro & nanotechnologies research institute, and CEA-List, a specialist in smart digital systems, today announced a strategic collaboration withPowerchip Semiconductor Manufacturing Corporation (PSMC).The collaboration will leverage CEA-List's RISC-V design expertise and CEA-Leti's silicon photonics expertise to introduce high-bandwidth communication and high-efficiency computing technologies into PSMC's established 3D stacking and interposer platforms to deliver solutions for next-generation artificial intelligence (AI) systems.
The semiconductor industry faces mounting challenges, including the physical limits of traditional copper interconnects, increasingly stringent power budgets, and the urgent need for flexible, scalable computing architectures. By integrating short-reach, high-bandwidth optical links for energy-efficient data movement and customizable RISC-V processor architectures, the collaboration directly addresses these constraints and establishes a new paradigm in high-performance data transport and computing architecture.
CEA-Leti, CEA-List, and PSMC are collaborating to integrate RISC-V processors and MicroLED silicon photonics into 3D chip stacks, aiming to overcome interconnect bottlenecks for next-gen AI systems.
CEA-Leti — Micro & nanotechnologies R&D institute, based in Grenoble, France.
CEA-List — Smart digital systems R&D institute, based in Grenoble, France.
Powerchip Semiconductor Manufacturing Corporation (PSMC) — Semiconductor foundry, based in Taiwan.
Strongly track — This collaboration targets fundamental bottlenecks in AI hardware, combining advanced packaging, optical I/O, and open-source processor architecture.