LIGHTSPRING lève 3,1 millions d’euros pour s’attaquer au maillon faible des puces photoniques
总部位于法国贝桑松的深科技公司 Lightspring 完成 310 万欧元种子轮融资，由 Atlantic 和 OVNI Capital 领投。公司源自 FEMTO-ST 实验室的研究成果，核心方向不是直接改进光子芯片本身，而是解决其关键短板：在芯片上直接制造三维光学接口。
Lightspring 正在开发一种工艺，可将光学接口直接集成到芯片表面，并以三维结构实现更高效的光连接。该技术瞄准的是光子芯片落地应用中的“最后一公里”问题，即如何让芯片与外部光学系统之间实现更稳定、更高性能的耦合与连接。公司希望通过这一方法，提升光子集成系统的实用性，而不仅仅停留在芯片内部性能优化层面。
此次融资将为 Lightspring 推进技术工业化和后续商业化提供资金支持，也反映出资本市场对光子芯片配套基础技术的关注正在升温。
Lightspring, a deeptech startup based in Besançon, has raised a €3.1 million seed round led by Atlantic and OVNI Capital. Spun out of research carried out at the FEMTO-ST laboratory, the company is developing a process to manufacture optical interfaces directly on chips in three dimensions.
Rather than trying to improve photonic circuits themselves, Lightspring is targeting one of the sector’s main weak points: the interface layer that connects optical components and enables them to function effectively. The company’s technology is designed to simplify and strengthen this critical step in chip integration, with the broader goal of making photonic systems more practical and scalable for industrial use.
La deeptech bisontine Lightspring boucle un tour d’amorçage de 3,1 millions d’euros mené par Atlantic et OVNI Capital. Issue de travaux conduits au laboratoire FEMTO-ST, elle développe un procédé permettant de fabriquer directement sur les puces des interfaces optiques en trois dimensions. L’objectif est moins d’améliorer les circuits photoniques eux-mêmes que de résoudre l’un des …
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Lightspring raised €3.1M seed funding to manufacture 3D optical interfaces directly on photonic chips, targeting a key bottleneck for photonic integration and performance.
Lightspring — deeptech developing direct 3D optical interface fabrication on photonic chips; based in Besançon, France.
Atlantic — early-stage investor leading the seed round; based in France.
OVNI Capital — seed/early-stage investor in the round; based in France.
FEMTO-ST — research lab whose work underpins the technology; based in France.
[Monitor] — early-stage funding plus manufacturing-focused photonic integration could accelerate commercialization if technical yield and scaling hold.