As preparations for the Chips JU Work Programme 2027 advance, stakeholders from across the European Electronic Components and Systems (ECS) community are being invited to two online consultation workshops on 5 October 2026. The sessions are designed to gather industrial input on needs, technology gaps and draft call concepts, helping shape potential topics for the next Chips JU work programme.

The first workshop, Co-Packaged Optics for Advanced Data Communication (IA), will run from 09:00 to 10:30 CEST. It will focus on energy-efficient, high-throughput and low-latency data links for AI and HPC infrastructure. Discussion points include optical engine and transceiver integration, fiber-to-chip coupling and thermal management, and test and reliability qualification needed for scale-up, scale-out and optical circuit switching.

The second session, System-Level Design for Heterogeneous Integration, is scheduled for 10:30 to 12:00 CEST. It will examine system-level design gaps towards 2030 and their importance for strengthening European technological sovereignty. Topics include the early and holistic evaluation of complex architectures, with attention to security, flexibility and cost trade-offs; scalable abstraction from high-level exploration to subsystem refinement; and full traceability from architectural requirements to final design decisions.

Participants are encouraged to comment on the relevance and ambition of the draft topics, suggest new ideas and identify critical innovation gaps. The workshops will also provide a forum to exchange views with experts from the photonics, packaging and EDA communities. Registration and further information are available via the consultation notice.

As preparations for the Chips JU Work Programme 2027 move forward, stakeholders from across the European Electronic Components and Systems (ECS) community are invited to contribute to two upcoming Online Consultation Workshops, taking place on 5 October 2026.

The interactive sessions will provide an opportunity to discuss industrial needs and technology gaps, provide feedback on draft Call concepts, and contribute to shaping potential topics for the Chips JU Work Programme 2027.

Session 1: Co-Packaged Optics for Advanced Data Communication (IA)

09:00–10:30 CEST

The session will focus on energy-efficient, high-throughput and low-latency data links for AI and HPC infrastructure, with discussions covering:

Optical engine and transceiver integration

Fiber-to-chip coupling and thermal management

Test and reliability qualification for scale-up, scale-out and optical circuit switching

Session 2: System-Level Design for Heterogeneous Integration

10:30–12:00 CEST

This session will address key system-level design gaps towards 2030 and their role in strengthening European technological sovereignty. Topics will include:

Early and holistic evaluation of complex architectures, including security, flexibility and cost trade-offs

Scalable abstraction from high-level exploration to subsystem refinement

Full traceability from architectural requirements to final design decisions

Participants are invited to provide feedback on the relevance and ambition of the draft topics, propose new ideas and identify critical innovation gaps, while exchanging with experts from the photonics, packaging and EDA communities.

Join the consultation and contribute your expertise to the preparation of the Chips JU Work Programme 2027. More information and registration here.

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