CEA-Leti will present five papers at CHES 2026, the annual Conference on Cryptographic Hardware and Embedded Systems, in Antalya, Turkey, from October 11 to 15, alongside one paper at FDTC, a satellite conference dedicated to fault injection attacks. CHES is described as the premier venue for research on the design and analysis of cryptographic hardware and software implementations, and as an IACR area conference that connects cryptography researchers with engineering communities across academia, industry, government and beyond.

The CEA-Leti contributions span side-channel analysis, fault injection, and cryptographic hardware design. On Sunday, October 11, at 2:20 pm in FDTC Session 3, Giorgio Fardo, Damien Couroussé, Mathieu Jan, Laurent Maingault and Loïc Mangin will present “Bridging Laser Fault Injection Experiments and Pre-Silicon Analysis on AES Hardware.” On Tuesday, October 13, at 2:50 pm in CHES Session 8B, Antoine Moran, Maxime Lecomte, Julien Maillard, Benjamin Smith and Guénaël Renault will present “Soft Analytical Side-Channel Attacks on SHA-2 and HMAC.”

Two more papers follow on Wednesday, October 14. At 10:10 am in Session 10A, Antonio Ras, Antoine Loiseau, Mikael Carmona, Simon Pontie, Guénaël Renault, Benjamin Smith and Emanuele Valea will present “PHOENIX: Crypto-Agile Hardware Sharing for ML-KEM and HQC.” At 2:50 pm in Session 12A, Julie Godard, Nicolas Aragon, Philippe Gaborit, Antoine Loiseau and Julien Maillard will present “Non-supervised SASCA on the VOLEitH Framework.” The final CHES paper is scheduled for Thursday, October 15, at 8:00 am in Session 13B: “BTCCA: Unsupervised Horizontal Attack against RSA Primitive with Barlow Twins Collision Correlation Analysis,” by Dorian Llavata, Eleonora Cagli, Rémi Eyraud, Vincent Grosso and Lilian Bossuet.

The announcement underlines CEA-Leti’s continued focus on hardware cybersecurity and advanced cryptographic implementation research. For questions, the contact listed is Laurent Maingault, Hardware cybersecurity scientific advisor.

From 10/11/2026 to 10/15/2026Antalya, Turkey

CEA-Leti will present five papers at CHES, the leading conference on cryptography and cybersecurity for embedded devices as well as a paper at a satellite conference focused on fault injection attacks.

DISCOVER CEA-LETI’S MAJOR SCIENTIFIC RESULTS AT CHES 2026

Sunday, October 112:20 pmFDTC - Session 3

Giorgio Fardo,Damien Couroussé,Mathieu Jan,Laurent Maingault,Loïc Mangin

Bridging Laser Fault Injection​ Experiments and Pre-Silicon Analysis on AES Hardware

Tuesday, October 132:50 pm​​CHES 2026 - ​​Session 8B​

Antoine Moran,Maxime Lecomte,Julien Maillard,Benjamin Smith,Guénaël Renault​

Soft Analytical Side-Channel Attacks on SHA-2 and HMAC

Wednesday, October 1410:10 am​CHES 2026 - Session 10A

Antonio Ras,Antoine Loiseau,Mikael Carmona,Simon Pontie,Guénaël Renault,Benjamin Smith,Emanuele Valea

PHOENIX: Crypto-Agile Hardware Sharing for ML-KEM and HQC

Wednesday, October 142:50 pm​CHES 2026 - Session 12A

Julie Godard,Nicolas Aragon,Philippe Gaborit,Antoine Loiseau,Julien Maillard

Non-supervised SASCA on the VOLEitH Framework​​

Thuesday, October 158:00 amCHES 2026 - Session ​13B

Dorian Llavata,Eleonora Cagli,Rémi Eyraud,Vincent Grosso,Lilian Bossuet

BTCCA: Unsupervised Horizontal Attack against RSA Primitive with Barlow Twins Collision Correlation Analysis​

The annual Conference on Cryptographic Hardware and Embedded Systems (CHES) is the premier venue for research on design and analysis of cryptographic hardware and software implementations. As an area conference of the International Association for Cryptologic Research (IACR), CHES bridges the cryptographic research and engineering communities, and attracts participants from academia, industry, government and beyond.

More information on ​​CHES 2026’s website

From 10/11/2026 to 10/15/2026 |Antalya, Turkey

Contact:Laurent Maingault​​with any questions.​​

Hardware cybersecurity Scientificic advisor

Event | Agenda|Grenoble, France

CEA-Leti is proud to co-organize the first edition of Open Innovation Materials & Manufacturing Europe (OIM² Europe), a new European forum designed to bridge the gap between cutting-edge research and industrial innovation in advanced materials, nanotechnologies, and sustainable manufacturing.

Event|Grenoble Scientific Polygon, France

Europe has the expertise and skills to promote a more responsible digital sector (frugality, regulation, ethics) that creates high-quality jobs. However, mastery of data is just as crucial as mastery of materials and energy when it comes to the operability and sustainability of disruptive digital components and integrated circuits. More sustainable integrated hardware and software solutions will be discussed at the END* symposium in the field of Information & Communication Technologies (ICT)

Event | Agenda|SEMICON Europa, Messe München, Germany.

Artificial intelligence is reshaping the semiconductor landscape, demanding breakthroughs across the entire technology stack.

This session explores the deep-tech innovations enabling the AI era—from advanced compute, 3D integration and silicon photonics to power-efficient packaging—before showcasing two real-world demonstrations and concluding with Europe’s vision for sustainable AI infrastructure.

During this 19th edition of Leti Innovation Days Tokyo, CEA-Leti’s CEO will celebrate R&D partnerships with its partners in Japan and explore new possibilities to support the Japanese semiconductor industry. This year’s theme is “The AI-Chip Revolution: Scaling Innovation in Semiconductors”.

High-level speakers and technical experts will present the latest advances through keynote speeches, seminars and live demos. Join us to enjoy lively networking and exchanges in a unique setting at the Residence of France in Japan.

Physical AI begins with sensing. As AI moves into the physical world, application-specific sensors are becoming essential for enabling efficient, reliable, and scalable systems. This year the MEMS & Imaging Summit explores how sensor innovation, semiconductor technologies, and advanced manufacturing are shaping the next generation of Physical AI. From custom sensor design to system integration, industry experts will discuss how purpose-built sensing solutions are driving practical applications across medical, manufacturing and consumer applications.

CEA-Leti will present three papers at CHES, the leading conference on cryptography and cybersecurity for embedded devices as well as a paper at a satellite conference focused on fault injection attacks.