CEA-Leti, in collaboration with CEA-List, will present its latest hardware security innovations at the 2026 MRS Spring Meeting & Exhibit in Honolulu, Hawaii, from April 26 to May 1. The institute will feature two key demonstrators: the VASCO2, showcasing hardware security for silicon-embedded systems, and the SCIBE tool, demonstrating security assessment capabilities for embedded systems' interfaces.

The institute will also present three major scientific papers at the conference. On April 29, Stéphane Moreau (with co-authors Candice Thomas, David Bouchu, Meriem Guergour, and Jean Charbonnier) will present "Reliability of 3D ICs—From Consumer Electronics to Quantum Computing" at 8:00 AM. Later that day at 9:15 AM, Lionel Vignoud (with co-author Paul Valentin) will present on "New Ways Using Experimental Measurements and Simulation Tools to Anticipate and Solve Reliability Issues Encountered in the Manufacture of Semiconductor Devices." On April 26 at 2:00 PM, authors Manuel Manrique, Bassem Salem, and Gwenael Le Rhun will present "Sb and Cu Compensatory Doping of ZnO Nanowires for Enhanced Piezoelectric Devices."

The MRS Spring Meeting is a premier cross-disciplinary conference for materials researchers from academia, industry, and government. For inquiries regarding CEA-Leti's participation, contacts are listed as Lionel Vignoud or Paul Valentin, Research Engineers in Mechanics and Thermal Engineering based at the Maison Minatec in Grenoble, France.

The article also lists several other upcoming events where CEA-Leti will showcase its expertise:

* LID World Summit (June 23-25): A global semiconductor event in Grenoble where over 1,250 professionals will gather. A presentation will outline the MEMS development roadmap, focusing on innovative materials for next-generation devices like microphone MEMS and optomechanical sensors.

* A strategic seminar in Hsinchu, Taiwan: Featuring CEA-Leti CEO Sébastien Dauvé alongside experts from CEA-Leti and Taiwan's ITRI. The agenda covers the global industry outlook and advances in Silicon Photonics, Advanced Heterogeneous Integration and Packaging, MicroLEDs, Power Management, and AI-enabling hardware architectures.

* IRPS 2026 in Beverly Hills, CA: Where CEA-Leti will showcase its integrated expertise in microelectronics reliability.

* An event on Optical Interconnects: Focusing on cutting-edge technologies for datacenters and AI clusters.

From 4/26/2026 to 5/1/2026Honolulu, Hawaii

CEA-Leti in association with CEA-List, will showcase its hardware security innovations for silicon-embedded hardware, through the VASCO2 demonstrator, as well a​s its expertise in security assessment of embedded systems’ interfaces, through the SCIBE tool demonstrator.​​​

DISCOVER CEA-LETI’S MAJOR SCIENTIFIC RESULTS

With 3 papers,the institute will present this year’s m​​ajor scientific results at MRS Spring Meeting & Exhibit including the following topics:

29 April 2026 • 8:00am - 8:30amEL12.08.01 - EL12.08​

1st Author: Stephane MoreauAuthors: Candice ThomasDavid BouchuMeriem GuergourJean Charbonnier​

Reliability of 3D ICs—From Consumer Electronics to Quantum Computing​

29 April 2026 • 9:15am - 9:30amEL12.08.04 - EL12.08

1st Author: Lionel VignoudAuthor: Paul Valentin​

New Ways Using Experimental Measurements and Simulation Tools to Anticipate and Solve Reliability Issues Encountered in the Manufacture of Semiconductor Devices​

26 April 2026 • 2:00pm - 2:30pmEN01.06.02 - EN01.06

Authors: Manuel ManriqueBassem SalemGwenael Le Rhun​

Sb and Cu Compensatory Doping of ZnO Nanowires for Enhanced Piezoelectric Devices​

ABOUT THE 2026 MRS Spring Meeting & Exhibit​

MRS Spring Meeting & Exhibit is the conference for bringing together materials researchers from academia, industry, government, and na​tional laboratories for a week of cross-disciplinary collaboration and scientific exchange. The exhibit showcases breakthroughs in areas such as sustainable manufacturing, advanced characterization, and energy materials, driving innovation forward on a global scale.​

More information on ​​2026 MRS Spring Meeting & Exhibit​’s website

26/04/2026to01/05/2026|​Honolulu, Hawai‘i​

Contacts:Lionel Vignoud​orPaulValentinwith any questions.​​

Research Engineer – Mechanics and Thermal Engineering

Event|Maison Minatec, Grenoble, France

LID World Summit from 23 to 25 June offer you a front-row seat to our most recent advances. Join more than 1,250 semiconductor industry professionals at this three-day global event and come away equipped and inspired to innovate!​

The field of Microelectromechanical Systems (MEMS) has evolved significantly since the 1980s, transitioning from simple capacitive sensors to highly sensitive piezoresistive sensors. This presentation will outline the development roadmap for MEMS, emphasizing innovative materials and sensing technologies that are driving next-generation devices, particularly in microphone MEMS and optomechanical sensing.

Event | Agenda|Ambassador Hotel, Hsinchu, Taiwan

Stay ahead in semiconductor innovation.

Join CEA-Leti CEO Sébastien Dauvé, together with CEA-Leti experts and ITRI leaders and specialists, for a strategic afternoon dedicated to semiconductor innovative technologies and high-level exchanges between French and Taiwanese innovation ecosystems. The program will address global industry outlook, and the latest advances in Silicon Photonics, Advanced Heterogeneous Integration and Packaging, MicroLEDs, Power Management strategies and AI-enabling hardware architectures.

CEA-Leti to Showcase Integrated Expertise In Microelectronics Reliability at IRPS 2026

Event | Agenda|Beverly Hills, CA 90210

Optical Interconnects: Driving Innovation in AI factory and Beyond​

Discover how CEA-Leti is transforming optical interconnects with cutting-edge technologies designed for datacenters and AI clusters.

Join us and meet our experts to learn how these innovations will boost your product development​.