CEA-Leti will showcase a broad range of advanced semiconductor research at multiple upcoming events, headlined by two papers at the International Interconnect Technology Conference (IITC) 2026, taking place June 1–4 in San Jose, California. IITC focuses on advanced interconnect, metallization, and 3D heterogeneous integration for ULSI ICs. On Tuesday, June 2, at 10:10 AM, the institute presents “Toward Fine Pitch Superconducting Interconnects with Nb-Nb Direct Bonding.” The following day, at 4:10 PM, it unveils a solution for metal-layer congestion in 10nm FD-SOI standard cells: “Relieving M1 Congestion in 10nm FD-SOI Standard Cells with a Low-Cost MOL Integration,” authored by Emmanuel Petitprez and a team of 17 researchers including Pierre Brianceau and Claire Fenouillet-Beranger. Both sessions are at the Hayes Mansion. Philippe Rodriguez is the contact for IITC inquiries.

Beyond IITC, CEA-Leti will attend the LID World Summit from June 23–25 at Maison Minatec, Grenoble. Experts will staff booth 502, presenting seven papers and posters covering hybrid bonding and low-temperature processing, contributing to a total of 11 papers that cement CEA-Leti’s leadership in advanced silicon integration. The institute also plans to debut high-performance microLED solutions for next-generation displays and data communications. Later, on September 29, CEA hosts the “Organoids & Organoids-on-Chip” workshop at its Grenoble site.

From 6/1/2026 to 6/4/2026San Jose, California, US

The IITC conference invites original research on advanced interconnect, metallization, and 3D heterogeneous integration technologies for ULSI IC applications.​

DISCOVER CEA-LETI’S MAJOR SCIENTIFIC RESULTS

2 Tuesday June 202610:10AM - 10:35AMPaper 2.2Hayes Mansion​

Toward Fine Pitch Superconducting Interconnects with Nb-Nb Direct Bonding​​

3 Wenesday June 202604:10 PM - 04:30 PMPaper 10.3​Hayes Mansion

1st Author : Emmanuel PetitprezAuthors: Pierre BrianceauAlexis KrakovinskyKrunoslav RomanjekYves ManegliaOlivier BillointJorge Nacenta-Mendivil​Fabien BringuierMessaoud BedjaouiValérie LaprasFrançois ​AussenacLudovic CoutureAlexandre Magalhaes-Lucas​Gennie GarnierBlandine ​DuriezMarie-Claire​ CyrilleClaire​Fenouillet-Beranger

Relieving M1 Congestion in 10nm FD-SOI Standard Cells with a Low-Cost MOL Integration

ABOUTInternational Interconnect Technology Conference

The IITC conference invites original research on advanced interconnect, metallization, and 3D heterogeneous integration technologies for ULSI IC applications.​​

More information on​​International Interconnect Technology Conferencewebsite​

From 6/01/2026to 4/06/​​​2026​ |​San Jose, California, US​

Contact:​Philippe Rodriguez​​​with any questions.​​

Event | Agenda|Y-Spot Partners, Grenoble, France

We are delighted to announce that CEA is hosting the "Organoids & Organoids-on-Chip" workshop at its Grenoble site on September 29, 2026.

Event|Maison Minatec, Grenoble, France

LID World Summit from 23 to 25 June offer you a front-row seat to our most recent advances. Join more than 1,250 semiconductor industry professionals at this three-day global event and come away equipped and inspired to innovate!​

CEA-Leti experts will be onsite at booth 502 and available to discuss the findings of Seven Papers and Posters Includes Hybrid Bonding and Low-Temperature Processing

With 11 papers, Leti has established itself as a leading research centre in the field of advanced silicon integration.​

CEA-Leti will introduce their high-performance microLED solutions for next-generation displays and data communications.