The IMAGINATION Penta-Euripides² project, a major European consortium initiative, has delivered significant technological advances in imaging systems tailored for live broadcast and high-speed industrial inspection. The project united key players across the imaging value chain, including Caeleste, Delft University of Technology, Euresys, Grass Valley, KLA, Melexis, Teledyne Adimec, and intoPIX, to translate advanced research into near-market-ready technologies.

For broadcast applications, the consortium introduced several innovations to meet demands for higher quality and more complex production workflows. A novel two-sensor camera architecture, using an optical white-light splitter, enables both double-speed slow motion (increasing from 6× to 12×) and an extended dynamic range of at least two additional F-stops. The project also demonstrated software-based depth-of-field control from single-image depth maps and successfully integrated ticoRAW compression into a broadcast camera for efficient, quality-preserving transmission to cloud and edge processing environments. These developments aim to enhance image quality, creative flexibility, and productivity for next-generation, cloud-enabled production.

In the domain of semiconductor inspection, IMAGINATION tackled the challenges posed by increasingly complex components and advanced packaging. The project doubled sustained imaging performance to 10 gigapixels per second, supported by a complete 100 Gb/s ecosystem encompassing cameras, frame grabbers, and vision processors. New platforms enable very high-resolution imaging (up to 100 megapixels) at high frame rates for detecting extremely small defects, crucial for 100% inspection. The consortium also demonstrated 3D imaging capabilities, including Time-of-Flight with embedded processing, and implemented smarter data handling via advanced compression and the world's first use of the Generic Data Container (GenDC) over CoaXPress. This allows standardized transport of images, metadata, and auxiliary data, supporting faster, AI-driven inspection.

The project also pushed CMOS image sensor technology forward. Advancements include new pixel concepts like Single-Photon Avalanche Diodes (SPADs) and Floating Transfer Gate pixels for improved low-light and photon-counting performance, as well as a CMOS-compatible layer-exchange technology to boost sensitivity from the visible into the short-wave infrared range. New high-speed, low-cost sensor test systems were developed to reduce characterization costs. These sensor advances create opportunities in fields ranging from space observation and automotive LiDAR to scientific and medical imaging.

IMAGINATION strengthens Europe's industrial position in broadcast tech, semiconductor inspection, and imaging components. Its broader impact includes boosting industrial quality and productivity through faster inspection, reducing the environmental footprint of broadcast via cloud workflows, and supporting long-term ecosystem development through contributions to standards like CoaXPress, SMPTE, and AMWA-NMOS. The project has generated patents, demonstrators, and standard contributions, with several partners continuing collaboration in follow-up Xecs projects to commercialize the results.

The project was conducted under the Penta and Euripides² Eureka Clusters, operated by AENEAS.

The IMAGINATION Penta-Euripides² project delivered major advances in image sensors, optical and camera architectures, and high-speed imaging systems, addressing demanding applications in live television broadcasting and machine vision for semiconductor inspection. The project was carried out by a European consortium bringing together leading industrial and research players across the imaging value chain, including Caeleste, Delft University of Technology, Euresys, Grass Valley Nederland BV, KLA, Melexis NV, Teledyne Adimec Advanced Image Systems BV and intoPIX SA.

Together, the consortium successfully translated advanced research into validated, near-market technologies.

New camera architectures and enhanced imaging for broadcast

To support growing media consumption and increasingly complex production workflows, IMAGINATION introduced significant innovations in broadcast imaging, driven by close collaboration between camera manufacturers, compression specialists and system architects:

A new two-sensor camera architecture using an optical white-light splitter enabled both double-speed slow motion (from 6× to 12×) and an extended dynamic range of at least two additional F-stops.

Depth maps generated from single images were demonstrated, enabling software-based depth-of-field control and new creative options in video processing.

ticoRAW compression was successfully implemented in a broadcast camera, enabling efficient transmission to cloud and edge processing environments while preserving visual quality.

These developments improve image quality, flexibility and productivity in live broadcast workflows and prepare next-generation cameras for cloud-enabled production.

High-speed machine vision for advanced semiconductor packaging

IMAGINATION addressed the rapidly increasing complexity of semiconductor components and advanced packaging, where inspection speed, accuracy and data handling are critical:

Sustained imaging performance was doubled to 10 Gpixels per second, enabled by a complete 100 Gb/s ecosystem spanning cameras, frame grabbers and vision processing platforms.

New platforms support very high-resolution imaging (up to 100 megapixels) at high frame rates, enabling detection of extremely small defects required for 100% inspection.

3D imaging capabilities, including Time-of-Flight approaches with embedded image processing, were demonstrated, supporting reliable absolute distance measurements.

Smarter data handling was achieved through advanced compression and the world’s first implementation of the Generic Data Container (GenDC) over CoaXPress, enabling standardized transport of images, metadata and auxiliary data across the inspection chain.

These results enable faster, more reliable inspection in semiconductor manufacturing environments driven by AI, HPC and advanced packaging.

More sensitive image sensors from visible to infrared

The project also advanced CMOS image sensor technologies, bridging the gap between research and industrial deployment:

New pixel concepts improved low-light and photon-counting performance, including Single-Photon Avalanche Diodes (SPADs) and Floating Transfer Gate (FTG) pixels.

A CMOS-compatible layer-exchange technology demonstrated increased sensitivity from the visible into the short-wave infrared range.

New high-speed, low-cost sensor test systems reduced characterization costs and support future sensor development.

These advances open opportunities in space and Earth observation, automotive sensing and LiDAR, scientific instrumentation, medical and life-science imaging.

Industrial, societal and ecosystem impact

IMAGINATION strengthens Europe’s position in broadcast technology, semiconductor inspection and imaging components, while also contributing to:

Higher industrial quality and productivity through faster and more accurate inspection systems

Reduced environmental impact via cloud-enabled and remote broadcast workflows

Long-term ecosystem development through standardisation activities, including CoaXPress, SMPTE and AMWA-NMOS

The project resulted in patents, demonstrators and contributions to international standards, and several partners continue collaboration in follow-up Xecs projects, ensuring that IMAGINATION’s results are carried forward into future products and markets.

To learn more about the project, its scope and outcomes, see the official Project Impact Summary.

Penta and Euripides² are Eureka Clusters, operated by AENEAS.

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