富士康、Radiall与Thales在法国波尔多附近的巴尔普（Barp）为全新的Tessalia工厂举行奠基仪式，正式启动先进半导体封装设施的建设。该项目总投资预计将超过2.5亿欧元，规划至2033年实现年产5000万个以上系统级封装（SiP）组件的能力，瞄准高端芯片封装市场。从计划公布到破土动工仅用时十二个月，推进速度迅速。该工厂的落地不仅强化了三方在半导体封装领域的合作，也有望带动当地产业生态，并提升法国乃至欧洲在先进封装环节的自主供给水平。
富士康、Radiall与泰雷兹的法国工厂启动！
C’est parti pour l’usine française de Foxconn, Radiall et Thales !
摘要
富士康、Radiall与泰雷兹在法国波尔多附近的勒巴尔普为Tessalia先进半导体封装厂奠基，项目投资或超2.5亿欧元。该工厂目标到2033年年产超5000万颗系统级封装（SiP）元件，旨在强化欧洲先进半导体封装产能。
富士康、Radiall与泰雷兹在法国波尔多附近的勒巴尔普为Tessalia先进半导体封装厂奠基，项目投资或超2.5亿欧元。该工厂目标到2033年年产超5000万颗系统级封装（SiP）元件，旨在强化欧洲先进半导体封装产能。
Summary
Foxconn, Radiall, and Thales have broken ground on the Tessalia advanced semiconductor packaging plant near Bordeaux, with an investment potentially exceeding €250 million. The factory aims to produce over 50 million system-in-package (SiP) components per year by 2033, bolstering Europe’s chip supply chain through a joint effort combining global manufacturing scale with French industrial and defense expertise.
Foxconn, Radiall, and Thales have broken ground on the Tessalia advanced semiconductor packaging plant near Bordeaux, with an investment potentially exceeding €250 million. The factory aims to produce over 50 million system-in-package (SiP) components per year by 2033, bolstering Europe’s chip supply chain through a joint effort combining global manufacturing scale with French industrial and defense expertise.
Foxconn, Radiall, and Thales have laid the foundation stone for Tessalia, an advanced semiconductor packaging plant in Le Barp, near Bordeaux. The project, representing an investment that could exceed €250 million, aims to produce more than 50 million system-in-package (SiP) components annually by 2033. Construction commenced just twelve months after the consortium’s initial announcement, underscoring the rapid pace of the initiative.
Résumé
Foxconn, Radiall et Thales ont posé la première pierre de l’usine Tessalia au Barp (Gironde), pour un investissement dépassant 250 M€. Cette unité de packaging avancé de semi-conducteurs vise à produire plus de 50 millions de composants SiP par an d’ici 2033, renforçant ainsi la souveraineté industrielle française.
Foxconn, Radiall et Thales ont posé la première pierre de l’usine Tessalia au Barp (Gironde), pour un investissement dépassant 250 M€. Cette unité de packaging avancé de semi-conducteurs vise à produire plus de 50 millions de composants SiP par an d’ici 2033, renforçant ainsi la souveraineté industrielle française.
Foxconn, Radiall et Thales ont posé la première pierre de Tessalia au Barp, près de Bordeaux. Fruit d’un investissement qui pourrait dépasser 250 M€, cette future usine de packaging avancé de semi-conducteurs vise une production de plus de 50 millions de composants SiP par an d’ici 2033. Cela n’a pas traîné. Seulement douze mois après […]
Cet article C’est parti pour l’usine française de Foxconn, Radiall et Thales ! a été publié par VIPress.net.
Core Point
Foxconn, Radiall, and Thales broke ground on a €250M+ advanced semiconductor packaging plant in France, aiming to produce over 50M SiP units/year by 2033, strengthening Europe’s chip supply chain resilience.
Key Players
- Foxconn — Taiwanese electronics contract manufacturer and global supply chain leader.
- Radiall — French designer and maker of high-reliability interconnect components.
- Thales — French aerospace, defence, and cybersecurity multinational.
Industry Impact
- ICT: High — scalable SiP packaging for network, server, and IoT infrastructure.
- Computing/AI: High — advanced packaging critical for AI accelerators and high-performance computing.
- Automotive: Medium — SiPs support advanced driver-assistance and infotainment systems.
- Terminals/Consumer Electronics: Medium — enables miniaturized, power-efficient mobile and wearable devices.
Tracking
Strongly track — first-of-its-kind European joint venture for high-volume advanced packaging directly addresses chip sovereignty goals.