芯片法案2.0:欧盟提出新措施以加强半导体竞争力和韧性

Chips Act 2.0: EU Proposes New Measures to Strengthen Semiconductor Competitiveness and Resilience

AENEAS by Editor 2026-06-03 14:47 Original
摘要
欧盟委员会提出《芯片法案2.0》,旨在加强欧洲半导体生态、技术主权与供应链韧性,重点包括吸引投资、刺激需求与减少外部依赖。新法案强调需求侧措施,通过“需求加速器”和战略性项目,将芯片生产与AI、云计算等战略产业更紧密结合,并设立卓越区域标签以促进区域生态发展。

2026年6月3日,欧盟委员会正式提出《芯片法案2.0》提案,旨在强化本土半导体生态体系、提升技术主权、降低战略依赖并增强供应链韧性。该提案隶属于欧盟“技术主权一揽子计划”,与《云与人工智能发展法案》形成互补。

上一版《芯片法案》已撬动超过520亿欧元的公共与私人投资,建成一批先进中试线和能力中心,显著提升了成员国间的协调与危机应对能力。当前,半导体是数字技术的底座,全球市场需求加速扩大,预计到2030年市场规模将达1.37万亿欧元,AI相关元器件将成为主要增长引擎。

尽管欧洲在功率器件、传感器、光子学、制造设备和材料等领域具有优势,但在先进芯片设计与尖端制造环节仍高度依赖外部供应。欧盟芯片产量占全球不足10%,在关键技术段暴露明显短板。为此,《芯片法案2.0》首次从供需两端同时发力,设定了四大优先方向:

改善投资与竞争力——加大全链条研发和人才培养投入;将审批周期压缩至最长12个月;启动“大挑战”项目,推动AI芯片等战略技术的工业化开发;通过半导体战略伙伴关系拓展国际合作。

刺激需求与产业应用——强化芯片制造商与下游行业的对接;建立“需求加速器”以加快新产品市场导入;扩大创新采购支持本土初创和成长型企业;与《云与人工智能发展法案》联动,响应数据中心、云基础设施及AI超级工厂的爆发式需求。

强化供给侧手段——支持涵盖材料到先进封装的“首创”项目;引入“战略项目”以解锁欧盟资金并协调成员国与企业共同投资;推出“半导体卓越区域”标签,促进区域性生态聚集和投资吸引力。

提升韧性与减少依赖——建立企业间半导体供应链平台,改善供应链透明度与抗风险能力;在高风险领域开展安全评估并采取缓解措施;降低对关键半导体技术的外部过度依赖。

与初版法案侧重制造和科研不同,《芯片法案2.0》明显加大对需求侧的引导,力图使欧洲芯片产能更紧密匹配战略产业与新兴市场需要,从而反向强化本地生产、提升工业韧性并加速创新技术的商业化落地。

提案将进入欧洲议会和欧盟理事会的立法讨论程序。若顺利推进,该法案将成为下一阶段欧洲半导体战略的核心支柱,深刻影响其产业竞争格局、技术自主能力和长期供应链安全。

Summary
The European Commission has proposed Chips Act 2.0 to strengthen Europe’s semiconductor competitiveness and resilience by accelerating permits, launching strategic projects, and creating demand-side incentives aligned with AI and cloud needs. Building on the first Act’s €52 billion in investments, the new framework aims to reduce the EU’s heavy dependence on external suppliers and boost its sub-10% global production share. The legislation, part of a broader technology sovereignty package, targets a market expected to reach €1.37 trillion by 2030.

The European Commission has unveiled the Chips Act 2.0, a proposed regulation to bolster the EU’s semiconductor ecosystem, sharpen technological sovereignty, and secure supply chains. Announced on 3 June 2026 as part of the broader Technology Sovereignty Package, it complements initiatives like the Cloud and AI Development Act. The initial European Chips Act mobilised over €52 billion in public-private investment and set up pilot lines and competence centres, but the EU still accounts for under 10% of global chip production and remains heavily reliant on external suppliers for advanced design and cutting-edge manufacturing—a vulnerability the new proposal directly targets.

The Chips Act 2.0 focuses on four pillars. For investment and competitiveness, it promises fast-tracked permitting in under 12 months, “Grand Challenges” to drive industrialisation of AI chips and other strategic technologies, and expanded international Strategic Partnerships on Semiconductors. To stimulate demand, the plan creates Demand Accelerators to speed market adoption of novel components, leverages innovation procurement to support startups and scaleups, and forges synergies with the Cloud and AI Development Act to channel demand from data centres and AI Gigafactories. On the supply side, it backs “First-of-a-Kind” projects across the full value chain—from materials to advanced packaging—introduces Strategic Projects with EU and member-state co-investment, and launches a Semiconductor Regions of Excellence label to attract investment into regional clusters. Finally, to boost resilience, it establishes a B2B Semiconductor Supply Chain Platform for greater visibility, supports risk mitigation, and aims to cut overreliance on external sources for critical technologies.

A key evolution from the first act is the heightened emphasis on demand-side levers, better aligning European production with the needs of strategic industries and emerging markets like AI. The legislation now enters discussions in the European Parliament and Council, where it is expected to shape the EU’s long-term semiconductor strategy and industrial resilience.

Résumé
La Commission européenne a présenté le Chips Act 2.0, un nouveau cadre visant à renforcer la compétitivité et la souveraineté de l’UE dans les semi-conducteurs en mettant l’accent sur l’investissement, la stimulation de la demande et la résilience des chaînes d’approvisionnement. Ce plan, qui s’appuie sur le premier Chips Act ayant mobilisé 52 milliards d’euros, cherche à réduire la dépendance extérieure (l’Europe produit moins de 10 % des puces mondiales) tout en créant des synergies avec le Cloud and AI Development Act pour répondre aux besoins de l’IA et du cloud. L’impact attendu est un écosystème semi-conducteur européen plus autonome, aligné sur les secteurs stratégiques et capable de conquérir une part d’un marché qui pourrait atteindre 1 370 milliards d’euros d’ici 2030.

Brussels, 3 June 2026 – The European Commission has presented the proposed Chips Act 2.0, a new framework designed to strengthen Europe’s semiconductor ecosystem, enhance technological sovereignty, reduce strategic dependencies, and reinforce the resilience of semiconductor supply chains. The proposal forms part of the broader Technology Sovereignty Package and complements other initiatives, including the Cloud and AI Development Act.

The proposal builds on the achievements of the first European Chips Act, which helped mobilise more than €52 billion in public and private investments, establish advanced pilot lines and competence centres, and strengthen coordination and crisis preparedness across Member States.

Today, semiconductors underpin virtually every digital technology, from connected vehicles and industrial automation to cloud computing and artificial intelligence. As global demand continues to accelerate, the semiconductor market is expected to reach €1.37 trillion by 2030, with AI-related components driving a significant share of future growth.

Why Chips Act 2.0?

Despite Europe’s strengths in areas such as power electronics, sensors, photonics, manufacturing equipment and materials, the EU remains highly dependent on external suppliers for advanced semiconductor design and leading-edge manufacturing. According to the Commission, Europe currently accounts for less than 10% of global semiconductor production and remains particularly exposed in critical technology segments.

The Chips Act 2.0 seeks to address these challenges by supporting both the supply and demand sides of the semiconductor ecosystem while strengthening Europe’s long-term competitiveness and resilience.

Key objectives

The proposed regulation focuses on four main priorities:

– Improving conditions for investment and competitiveness

Strengthening research, innovation and skills across the semiconductor ecosystem;

Accelerating permitting procedures, with approvals targeted within a maximum of 12 months;

Launching “Grand Challenges” to support industrial development of strategic technologies, including AI chips;

Expanding international cooperation through Strategic Partnerships on Semiconductors.

–  Stimulating demand and industrial uptake

Strengthening links between chip manufacturers and user industries;

Establishing Demand Accelerators to speed up market adoption of new semiconductor products;

Increasing the use of innovation procurement to support European startups and scaleups;

Creating synergies with the Cloud and AI Development Act to support growing demand from data centres, cloud infrastructure and AI Gigafactories.

– Reinforcing supply-side measures

Supporting “First-of-a-Kind” projects across the semiconductor value chain, from materials to advanced packaging;

Introducing Strategic Projects to unlock EU funding and facilitate co-investment from Member States and industry;

Launching a new Semiconductor Regions of Excellence label to promote regional semiconductor ecosystems and attract investment.

– Increasing resilience and reducing dependencies

Establishing a Business-to-Business Semiconductor Supply Chain Platform to improve visibility and resilience across supply chains;

Supporting risk assessments and mitigation measures in exposed sectors;

Reducing overreliance on external suppliers for critical semiconductor technologies.

A stronger focus on demand

One of the notable evolutions of the proposed Chips Act 2.0 is the increased emphasis on demand-side measures. While the original Chips Act primarily focused on strengthening manufacturing and research capabilities, the new proposal seeks to better align European semiconductor production with the needs of strategic industries and emerging markets.

The Commission highlights that stronger demand can reinforce local production, improve industrial resilience, and support the commercialisation of innovative European technologies.

Next steps

The proposal will now enter the European legislative process involving the European Parliament and the Council. As discussions progress, the Chips Act 2.0 is expected to contribute significantly to shaping the next phase of Europe’s semiconductor strategy, industrial competitiveness, technological sovereignty and long-term resilience.

Download the Chips Act 2.0 Proposal and Annexes.

Source: European Commission

The post Chips Act 2.0: EU Proposes New Measures to Strengthen Semiconductor Competitiveness and Resilience appeared first on Aeneas.

AI Insight
Core Point

欧盟提出《芯片法案2.0》,将半导体战略重心从制造扩至需求侧,以强化技术主权、减少外部依赖,影响全球半导体供应链布局。

Key Players
  • 欧盟委员会 — 欧盟行政机构,总部布鲁塞尔,负责提出该法案以协调成员国半导体投资与产业政策。
Industry Impact
  • ICT: 高 — 法案直接拉动数据中心、云基础设施与AI计算芯片需求,强化数字基础。
  • Terminals/Consumer Electronics: 中 — 刺激先进传感器、功率电子等组件本地化应用,但短期内终端产品进口依赖仍存。
  • Computing/AI: 高 — “大挑战”项目重点扶持AI芯片,与《云与AI发展法案》联动,加速AI芯片工业部署。
  • Automotive: 中 — 需求加速器将推动车规半导体验证与批量采购,促进互联汽车供应链安全。
Tracking

重点跟踪 — 该法案将重塑欧洲半导体投资方向与对外合作关系,可能引发全球芯片供需结构调整,需跟进立法进展及成员国响应。

Categories
半导体 人工智能 云计算
AI Processing
2026-06-03 23:04
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