ICOS²项目启动,旨在加强欧洲半导体韧性及全球伙伴关系:新闻稿

ICOS² Project Launches to Strengthen Europe’s Semiconductor Resilience and Global Partnerships: Press Release

AENEAS by Editor 2026-06-29 09:31 Original
摘要
由爱尔兰Tyndall国家研究所协调,联合ASML、博世、英飞凌、恩智浦、意法半导体等21家欧洲产学研机构,正式启动ICOS²项目,旨在通过国际合作强化欧洲半导体供应链韧性与技术自主。该项目将基于经济、技术及合作情报,为《芯片法案2.0》等政策提供数据驱动建议,并计划与加拿大、日本、韩国、中国台湾、美国等全球主要半导体生态建立互利伙伴关系,降低外部依赖风险。

欧洲顶尖半导体联盟正式启动ICOS²(国际半导体创新与供应韧性合作)项目。该项目是Horizon Europe框架下的协调与支持行动,旨在通过促进国际伙伴关系,巩固欧洲在全球半导体生态中的地位。

项目由爱尔兰Tyndall国家研究所协调,联合21家欧洲产业、研究与政策领域的领先机构,包括ASML、博世、英飞凌、恩智浦、意法半导体等技术巨头,以及欧洲最主要的研究创新力量。

半导体是欧洲经济安全的基础,支撑汽车、医疗、能源和电信等关键行业。但欧洲目前面临结构性挑战:制造产能有限,在价值链多个环节依赖外部伙伴。ICOS²将提供基于证据的严谨情报和可行动建议,支持欧盟政策制定者和产业领袖规划未来半导体战略。项目与欧盟芯片议程高度一致,紧密配合《欧洲芯片法案》及其向“芯片法案2.0”的演进。

通过提供数据驱动的洞察、风险分析和合作框架,ICOS²将帮助:加强欧洲技术自主与产业竞争力;降低全球半导体供应链脆弱性;与关键全球伙伴开展有针对性的国际合作;为欧盟及成员国未来的政策和投资决策提供依据。特别是,ICOS²将为芯片法案2.0的落地设计提供直接输入,支撑更协调、更具战略性的欧洲全球半导体参与方式。

鉴于半导体创新天然具有全球属性,ICOS²将基于四个支柱建立结构化的国际合作方法:经济情报——绘制全球供应链与依存关系;技术情报——分析新兴技术及欧盟定位;合作情报——评估伙伴机会与风险;可行动建议——推动联合研究项目与人才流动计划。项目将与加拿大、印度、日本、韩国、台湾和美国等全球领先半导体生态深度对接,识别既能加强欧洲韧性又维护战略利益的互利伙伴关系。

Tyndall战略发展主任、ICOS²项目协调人Giorgos Fagas教授表示:“在前序非常成功的ICOS项目奠定的坚实基础上,ICOS²是欧洲半导体战略从分析迈向行动的关键一步。通过将深度情报与有针对性的国际合作结合,我们正为欧洲强化工业基础和全球竞争力创造条件。”

AENEAS作为项目联盟成员对此深感自豪,更多合作方信息可见官方新闻稿。

Summary
The ICOS² project, a Horizon Europe initiative coordinated by Ireland’s Tyndall National Institute, has launched with 21 partners including ASML, Bosch, Infineon, NXP, and STMicroelectronics to strengthen Europe’s semiconductor resilience. It will deliver intelligence on supply chains, technology trends, and cooperation opportunities to guide EU policy, directly shaping the upcoming Chips Act 2.0. The consortium aims to reduce external dependencies and boost industrial competitiveness through targeted global partnerships with ecosystems like Japan, South Korea, Taiwan, and the USA.

A new European consortium has launched ICOS² (International Cooperation on Semiconductor Innovation and Supply Resilience), a Horizon Europe Coordination and Support Action tasked with bolstering Europe’s semiconductor resilience and global partnerships. Coordinated by Ireland’s Tyndall National Institute, the project unites 21 organisations from industry, research, and policy, including ASML, Bosch, Infineon, NXP, and STMicroelectronics.

ICOS² addresses Europe’s structural semiconductor weaknesses—limited manufacturing capacity and dependence on external suppliers—by delivering data-driven intelligence and actionable recommendations to policymakers and industry leaders. The initiative aligns directly with the EU’s Chips Act and will provide concrete input for the design of the forthcoming Chips Act 2.0, aiming to strengthen technological autonomy, reduce supply-chain vulnerabilities, and shape future investment decisions.

The project builds on its predecessor, ICOS, shifting from analysis to implementation. Its framework rests on three pillars: economic intelligence to map global supply chains and dependencies; technology intelligence to assess emerging technologies and Europe’s positioning; and cooperation intelligence to evaluate partnership risks and opportunities. These feed into joint research initiatives and mobility programmes with key semiconductor ecosystems in Canada, India, Japan, South Korea, Taiwan, and the US.

Professor Giorgos Fagas, Director of Strategic Development at Tyndall and ICOS² coordinator, emphasised that the project “represents a critical step in moving from analysis to action,” combining deep intelligence with targeted international cooperation to strengthen Europe’s industrial base and global competitiveness.

Résumé
Le consortium européen ICOS², coordonné par le Tyndall National Institute et incluant ASML, Bosch, Infineon, NXP et STMicroelectronics, lance un projet Horizon Europe pour renforcer la résilience des semi-conducteurs par des partenariats internationaux. Il fournira des analyses de risques et des recommandations pour éclairer le Chips Act 2.0, afin de réduire les dépendances et d'améliorer la compétitivité industrielle. Le projet cible des coopérations avec le Canada, le Japon, la Corée du Sud, Taïwan et les États-Unis.

A leading European consortium has officially launched ICOS² – International Cooperation on Semiconductor Innovation and Supply Resilience, a Horizon Europe Coordination and Support Action aimed at reinforcing Europe’s position in the global semiconductor ecosystem through the promotion of international partnerships.

Coordinated by Tyndall National Institute, Ireland, ICOS² brings together 21 leading organisations spanning industry, research, and policy across Europe – including major technology leaders such as ASML, Bosch, Infineon, NXP, STMicroelectronics, alongside Europe’s foremost research and innovation actors.

Semiconductors are foundational to Europe’s economic security, enabling critical sectors such as automotive, healthcare, energy, and telecommunications. However, Europe currently faces structural challenges, including limited manufacturing capacity and dependency on external partners across the value chain. ICOS² is designed to address these challenges by providing rigorous, evidence-based intelligence and actionable recommendations to support European policymakers and industry leaders in shaping future semiconductor strategy.

The project is closely aligned with the European Union’s semiconductor agenda, including the European Chips Act and its anticipated evolution toward Chips Act 2.0.

By delivering data-driven insights, risk analyses, and cooperation frameworks, ICOS² will help:

Strengthen Europe’s technological autonomy and industrial competitiveness

Reduce vulnerabilities in global semiconductor supply chains

Enable targeted international cooperation with key global partners

Inform future policy and investment decisions at EU and Member State level

In particular, ICOS² will provide direct input to the implementation design of Chips Act 2.0, supporting a more coordinated and strategic European approach to global semiconductor engagement.

Recognising that semiconductor innovation is global by nature, ICOS² will establish a structured approach to international collaboration based on:

– Economic intelligence – mapping global supply chains and dependencies

– Technology intelligence – analysing emerging technologies and EU positioning

– Cooperation intelligence – assessing partnership opportunities and risks

– Actionable recommendations – enabling joint research initiatives and mobility programmes

The project will engage with leading semiconductor ecosystems worldwide – including Canada, India, Japan, South Korea, Taiwan, and the USA – to identify mutually beneficial partnerships that strengthen European resilience while safeguarding strategic interests.

Professor Giorgos Fagas, Director of Strategic Development at Tyndall and coordinator of the ICOS² project said “Building upon the strong foundations laid down by the preceding very successful ICOS project, ICOS² represents a critical step in moving from analysis to action in Europe’s semiconductor strategy. By combining deep intelligence with targeted international cooperation, we are creating the conditions for Europe to strengthen its industrial base and global competitiveness.”

AENEAS is proud to be a part of the ICOS² project consortium. Discover more about the project partners in the official press release.

The post ICOS² Project Launches to Strengthen Europe’s Semiconductor Resilience and Global Partnerships: Press Release appeared first on Aeneas.

AI Insight
核心观点

欧洲启动ICOS²项目,旨在通过国际合作与数据驱动的情报分析,强化半导体供应链韧性及战略自主,为即将到来的《芯片法案2.0》提供决策支持。

关键参与者
  • Tyndall National Institute — 爱尔兰国立研究机构,项目协调方。
  • ASML, Bosch, Infineon, NXP, STMicroelectronics — 欧洲半导体制造与设备龙头企业。
行业影响
  • ICT: 高 — 直接针对半导体供应链安全和国际合作战略。
  • 终端/消费电子: 高 — 依赖半导体供应,项目提升供应安全性。
  • 能源: 中 — 智慧电网和清洁能源技术依赖芯片,间接受益。
  • 计算/AI: 高 — 尖端芯片供应与创新直接影响算力和AI发展。
  • 汽车: 高 — 关键行业,严重依赖稳定的半导体供应。
追踪

重点追踪 — 项目将直接影响欧盟芯片法案2.0的设计与国际半导体合作格局,关乎产业补贴、出口管制与技术主权等政策走向。

Highlights
Investment / Funding
Related Companies
positive
ASML
mature
positive
positive
Bosch
mature
positive
Infineon
mature
positive
NXP
mature
positive
Categories
半导体 创业 科研
AI Processing
2026-06-29 16:18
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