Soitec, the French semiconductor materials specialist based in Grenoble, and ZenSemi, a Chinese foundry dedicated to specialized processes, are joining forces to bring BCD-on-SOI (Bipolar-CMOS-DMOS on Silicon-On-Insulator) technology to 300 mm wafers. The partnership targets the rapidly expanding power electronics requirements of AI data centers, electric vehicles, robotics, and industrial systems.
By combining Soitec’s engineered substrate leadership—notably its Smart Cut SOI wafers—with ZenSemi’s high-voltage BCD manufacturing expertise, the two companies aim to industrialize a platform that delivers superior integration, efficiency, and thermal performance at scale. Moving BCD-on-SOI from the current 200 mm standard to 300 mm promises significant cost reductions per die, higher throughput, and the ability to address complex power management and analog functions needed in advanced nodes.
The collaboration is a direct response to surging demand for high-efficiency power chips capable of handling higher voltages and currents while reducing energy losses. In AI data centers, for instance, power delivery and voltage regulation are critical bottlenecks; BCD-on-SOI enables monolithic integration of intelligent power stages. Similarly, electric vehicle traction inverters and on-board chargers benefit from the technology’s robustness and integration density. The platform is also well-suited for industrial motor drives and collaborative robots, where compact, efficient power electronics are paramount.
Soitec’s SOI substrates provide inherent dielectric isolation, which allows BCD circuits to operate at higher temperatures and with reduced parasitic effects compared to bulk silicon. ZenSemi’s process design kit and manufacturing lines are being tuned to leverage these advantages in high-volume 300 mm production, a move that aligns with the industry’s transition to larger wafers for power and analog semiconductors.
The announcement builds on Soitec’s ongoing expansion in power electronics, including recent investments in SOI wafer capacity and its push into compound semiconductors. For ZenSemi, the partnership reinforces its position as a niche foundry capable of delivering differentiated process technologies to global customers. No timeline or financial details were disclosed, but the companies emphasized that joint development work is underway with early access for key customers expected in the near term.