Information session on Chips JU calls: EU-Japan & Digital partnership EU-TTC countries
由Chips JU与ICOS²、JASMINE及INPACE项目联合主办的在线研讨会将于2025年7月6日（星期一）中欧夏令时13:00举行，主题聚焦两项即将启动的半导体领域研究资助征集。
第一项为“欧盟-日本半导体联合征集”（DIGITAL-JU-Chips-2026-SG-JAPAN），属于数字欧洲计划范畴；第二项为“与数字伙伴及欧美贸易与技术委员会（TTC）国家的联合征集”（HORIZON-JU-Chips-2026-3-RIA），隶属于地平线欧洲框架。两项征集均定于2026年7月7日正式开放申请。
会议将邀请Chips JU项目官员Angela Rinaldi与爱尔兰廷德尔国家研究所的代表进行专题介绍。他们将就即将到来的征集进行概览说明，重点解析资助机会，并为申请人提供切实可行的申报指导。详细的注册信息将于稍后在活动官网公布。
A webinar on July 6 at 13h CEST, jointly organized by Chips JU, ICOS², JASMINE, and INPACE, will preview two upcoming Chips JU funding calls opening July 7, 2026: the EU-Japan semiconductor call (DIGITAL-JU-Chips-2026-SG-JAPAN) and the Digital Partnership & TTC countries call (HORIZON-JU-Chips-2026-3-RIA). Chips JU Programme Officer Angela Rinaldi and Tyndall National Institute representatives will present the calls’ scope, funding opportunities, and application guidance. Registration details will be posted shortly on the website.
Save the Date for the upcoming Webina, jointly organised by Chips JU, ICOS², JASMINE and INPACE on Monday 6 July at 13h CEST.
This webinar aims to raise awareness of the two Chips JU Calls:
The EU-Japan Call on Semiconductor ( DIGITAL-JU-Chips-2026-SG-JAPAN)
The Call with Digital Partnership and TTC countries ( HORIZON-JU-Chips-2026-3-RIA)
The calls will open on July 7th, 2026
The session will feature a presentation by Angela Rinaldi, Programme Officer at Chips JU, alongside representatives from Tyndall National Institute. They will provide an overview of the upcoming calls, highlight funding opportunities, and share practical guidance for applicants.
More information regarding registration will be shared shortly on the website.
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芯片联合执行体（Chips JU）将于2026年7月6日举办网络研讨会，介绍次日开放的两项欧盟-日本及欧盟-与数字伙伴/TTC国家半导体联合研究提案，旨在促进国际资金与合作。
Low priority — 属常规信息通报，开放日期尚远，对产业格局无即时冲击。