CEA-Leti 投资于配备独特设备和专长的多学科平台。通过利用异构集成、新材料和光子学的进展,我们正在推动半导体创新,并应对颠覆性人工智能市场和技术带来的新挑战。 在第19届 Leti 创新日活动东京站期间,CEA-Leti 首席执行官将与日本合作伙伴共同庆祝研发合作,并探索支持日本半导体产业的新机遇。

CEA-Leti has invested in multidisciplinary platforms with unique equipment and expertise. By leveraging advances in heterogeneous integration, new materials and photonics, we are driving semiconductor innovation and tackling the new challenges of disruptive AI markets and technologies. During this 19th edition of Leti Innovation Days Tokyo, CEA-Leti’s CEO will celebrate R&D partnerships with its partners in Japan and explore new possibilities to support the Japanese semiconductor industry. This

CEA-Leti Original
摘要
CEA-Leti 将于 2026 年 10 月 8 日在东京举办创新日活动,纪念与日本半导体产业合作 20 周年。CEO 将出席并探讨深化合作的新路径,展示其在多学科平台与尖端设备上的投入。活动包含日本伙伴与衍生公司的主题演讲及技术演示,旨在推动下一代半导体技术发展,仅限于受邀嘉宾参与。

2026年8月10日,CEA-Leti 将于东京的法国驻日本大使官邸举办第19届Leti创新日活动,时值该机构与日本战略合作20周年。本届特别活动旨在复盘双方二十年联合研发的成果,并由CEA-Leti首席执行官主导探讨支持日本半导体产业的新路径。

从技术布局看,CEA-Leti已系统性地投入多学科平台、尖端设备和世界级专业能力,重点借助异构集成、新型材料与光子学等领域的进展,驱动半导体创新,以应对颠覆性AI市场与技术所带来的全新挑战。此次闭门活动仅限组委会定向邀请的嘉宾参与,安排包括日本合作伙伴、CEA-Leti衍生企业在内的主题演讲、技术报告与现场演示,同时提供高层社交机会。注册与参会事宜可联系Evelyne Etchebehere。

Summary
CEA-Leti is hosting its Innovation Days Tokyo on October 8, 2026, to celebrate 20 years of strategic R&D collaboration with Japan and unveil new paths for joint work with the Japanese semiconductor industry. The invitation-only event at the Residence of France will feature keynotes from Japanese partners and CEA-Leti spin-offs, showcasing multidisciplinary platforms and equipment to drive next-generation chip technologies.

CEA-Leti marks the 20th anniversary of its strategic R&D collaboration with Japan at a special edition of Leti Innovation Days Tokyo, held on October 8, 2026, at the Residence of France in Tokyo. This 19th edition of the invitation-only event features CEO-level discussions aimed at deepening ties with the Japanese semiconductor industry, alongside technical keynotes from local partners and CEA-Leti spin-offs, live demonstrations, and networking. The institute highlights its ongoing investment in multidisciplinary platforms, unique equipment, and expertise in heterogeneous integration, new materials, and photonics to address disruptive AI market challenges and propel next-generation semiconductor innovation.

Résumé
Le CEA-Leti fête 20 ans de collaboration avec l’industrie nippone des semi-conducteurs le 8 octobre 2026 à Tokyo, où son PDG dévoilera de nouvelles pistes de partenariat. L’événement sur invitation réunit des partenaires japonais et des spin-offs du CEA-Leti pour des démonstrations et conférences sur les technologies de nouvelle génération. Cet investissement dans des plateformes pluridisciplinaires vise à façonner l’avenir du secteur.

From 10/8/2026 to 10/8/2026Tokyo, Japan

This year marks the 20th anniversary of CEA-Leti’s strategic collab​oration with Japan. This special edition of Leti Innovation Days Tokyo celebrates two decades of joint R&D success, with CEA-Leti’s CEO exploring powerful new paths for collaboration with the Japanese semiconductor industry.

Discover how CEA-Leti is investing in multidisciplinary platfo​rms, cutting-edge equipment, and world-class expertise to shape the future of the semiconductor landscape and connect with the experts driving the next generation of semiconductor technologies.

Join us for keynote speeches from Japanese partners and CEA-Leti spin-off companies, technical presentations, live demonstrations and high-level networking in a unique setting at the Residence of France in Japan.​​​

This exclusive event is by invitation only. P​articipation is reserved for guests invited by the organizing committee.​For any questions regarding your registration or participation, please contactEvelyne Etchebehere

AI Insight
Core Point

CEA-Leti celebrates 20 years of R&D collaboration with Japan at a Tokyo event, seeking new partnerships to advance semiconductor innovation for disruptive AI markets.

Key Players
  • CEA-Leti — Microelectronics and nanotechnologies research institute, based in Grenoble, France.
Industry Impact
  • ICT: High — investments in heterogeneous integration, materials, and photonics directly advance chip manufacturing.
  • Computing/AI: High — focus on disruptive AI technologies and new architectures to meet future computing demands.
Tracking

Monitor — Event could yield new France-Japan R&D partnerships in next-gen semiconductors.

Highlights
Upcoming Event
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Categories
半导体
AI Processing
2026-07-27 23:02
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