SEMICON 台湾 2026

SEMICON Taiwan 2026

CEA-Leti Original
摘要
法国CEA-Leti研究所将参展2026年8月31日至9月4日在台北举行的SEMICON Taiwan,在“选择法国馆”展位展示其在微电子、光子学、嵌入式智能和先进集成等领域的最新半导体技术。多位高管(包括CEA-List数字IC与系统设计部副主任、CEA-Leti传感器与功率部总经理及技术战略合作执行副总裁等)将在论坛发言,探讨异构集成等创新方向。此次参展旨在深化与台湾及全球半导体生态的科研与产业合作,推动AI芯片等颠覆性技术研发与商业影响。

法国原子能与可替代能源委员会电子与信息技术研究所(CEA-Leti)将参加2026年8月31日至9月4日在台北南港展览馆1馆和2馆举办的SEMICON Taiwan 2026。作为Choose France Pavilion的一员,CEA-Leti将展示其半导体技术最新进展,并进一步巩固与台湾及全球半导体生态系统的长期科研与产业合作,彰显法国在技术研究、创新与转移领域的卓越实力。SEMICON Taiwan是全球半导体行业最具影响力的展会之一,汇集技术领袖、创新者与决策者,为展示尖端技术、强化国际伙伴关系以及应对微电子领域未来技术挑战提供了重要战略平台。

在Choose France Pavilion的R7324号展位,CEA-Leti专家将就微电子、光子学、嵌入式智能与先进集成等最新研发成果进行交流,并探索与产业链各方合作的可能。此外,CEA多位专家将在核心论坛发表演讲,其中包括:CEA-List研究所数字集成电路与系统设计部副主任、CEA-Leti传感器与电源部门总经理、CEA台湾本地代表副总裁,以及CEA-Leti技术战略合作伙伴执行副总裁。该展会不仅连接台湾与全球微电子生态,更搭建起产业、政府、学界与研究机构之间顺畅协作的桥梁,其使命始终是引领技术趋势、驱动创新、促进合作。台湾半导体产业拥有完备的生态系统和杰出的研发人才,在云计算时代展现出巨大增长势能,SEMICON Taiwan正是行业精英把握全球技术动向、获取资源的关键场域。

与此同时,CEA-Leti还活跃于更广泛的国际科技活动中。在法国格勒诺布尔科学园区举办的END*研讨会上,研究所以及欧洲同仁将围绕信息通信技术领域更可持续的集成硬件与软件解决方案展开讨论,强调数据掌控与材料、能源掌控同等重要,推动以节俭、规范和伦理为导向的负责任数字部门发展。第十九届Leti创新日东京站以“AI芯片革命:扩展半导体创新”为主题,CEA-Leti首席执行官将在法国驻日本大使官邸庆祝与日本伙伴的研发合作,并探索支持日本半导体产业发展的新机遇,通过主题演讲、研讨会和现场演示呈现最新进展。此外,CEA-Leti专家还将携三篇关于异构集成的论文出席欧洲固态器件与电路会议(ESSERC),该年度论坛聚焦固态器件与电路的最新突破,凸显随着系统芯片集成度不断提升,技术专家、器件专家、IC设计师与系统设计师之间深度互动的必要性。同样在6月23日至25日,超过1250名半导体行业专业人士将齐聚法国格勒诺布尔Maison Minatec,共赴LID世界峰会,近距离了解CEA-Leti的最新进展。

Summary
CEA-Leti will present its latest semiconductor technologies, including microelectronics and photonics, at SEMICON Taiwan 2026 (Aug 31–Sep 4) from Booth R7324 in the Choose France Pavilion, with key executives such as the General Manager of the sensor and power department and the Executive Vice President of Technology Strategic Partnerships available to discuss collaborations. The institute aims to strengthen R&D ties with Taiwan’s semiconductor ecosystem and promote French innovation in AI-chip and heterogeneous integration. This participation highlights CEA-Leti’s role in fostering international technology transfer and addressing microelectronics challenges.

CEA-Leti will present its latest microelectronics advances at SEMICON Taiwan 2026, running August 31 to September 4 at the Taipei Nangang Exhibition Center (TaiNEX 1 & 2). As part of the Choose France Pavilion (Booth R7324), the institute aims to reinforce its long-standing scientific and industrial ties with Taiwan and the global semiconductor ecosystem while promoting French research excellence. Experts will discuss recent work in microelectronics, photonics, embedded intelligence, and advanced integration, and will explore new collaborations. Key speakers include the Deputy Head of Digital IC & System Design at CEA-List, the General Manager of CEA-Leti’s sensor and power department, CEA’s Vice President and Taiwan Local Representative, and the Executive Vice President of Technology Strategic Partnerships at CEA-Leti. The event, a premier gathering for industry leaders, underscores Taiwan’s fully integrated ecosystem and its critical role in the era of cloud economics, serving as a bridge between the private sector, government, academia, and research institutions.

CEA-Leti’s global engagement extends beyond Taiwan. In Grenoble, the END* symposium will tackle sustainable ICT through more responsible hardware and software solutions. The 19th Leti Innovation Days Tokyo, themed “The AI-Chip Revolution: Scaling Innovation in Semiconductors,” will celebrate R&D partnerships in Japan with keynotes, seminars, and live demos at the Residence of France. At ESSERC, the annual European forum on solid-state devices and circuits, CEA-Leti will share findings from three papers on heterogeneous integration. Meanwhile, the LID World Summit returns to Maison Minatec in Grenoble from June 23 to 25, expecting over 1,250 professionals to explore the latest semiconductor innovations. Across these events, CEA-Leti highlights its investments in multidisciplinary platforms, heterogeneous integration, new materials, and photonics to address the challenges of disruptive AI technologies.

Résumé
Le CEA-Leti participe à SEMICON Taiwan 2026 (31 août - 4 septembre) au stand R7324 du pavillon Choose France pour présenter ses avancées en microélectronique, photonique et intégration hétérogène. Des experts du CEA-Leti et du CEA-List, dont des responsables de divisions, seront présents pour renforcer les collaborations avec l’écosystème taïwanais et mondial des semi-conducteurs. Cette présence souligne l’engagement de la recherche technologique française dans l’innovation des puces, au service des marchés émergents de l’IA.

From 8/31/2026 to 9/4/2026TaiNEX 1 & 2 – Taipei Nangang Exhibition Center, Taipei, Taiwan

CEA-Leti is participating in SEMICON Taiwan 2026, highlighting its latest advances in semiconductor technologies and reinforcing its long-standing commitment to scientific and industrial cooperation with Taiwan and the global semiconductor ecosystem.  As part of the Choose France Pavilion, CEA-Leti contributes to promoting French excellence in technology research, innovation and technology transfer.

SEMICON Taiwan is one of the most influential trade shows in the semiconductor industry, bringing together technology leaders, innovators, and decision-makers from across the globe.  It provides a strategic platform to showcase cutting-edge technologies, strengthen international partnerships, and address the technological challenges shaping the future of microelectronics.

MEET CEA-LETI’S EXPERTS AT BOOTH R7324​

CEA-Leti will be at Booth R7324 (Choose France Pavilion)where its experts will be available to discuss the institute’s latest research and technological developments in microelectronics, photonics, embedded intelligence, and advanced integration, and to explore potential collaborations withstakeholders across the semiconductor ecosystem.

DON'T MISS THE OPPORTUNITY TO HEAR FROM CEA EXPERTS AS THEY TAKE PART IN KEY FORUMS

Deputy Head of the Digital IC & System Design Division, CEA-List

General Manager, sensor and power department, CEA-Leti

Vice President, Taiwan Local Representative, CEA

Executive Vice President Technology Strategic Partnerships, CEA-Leti

SEMICON Taiwan is where the industry elites go to keep up with technology developments in the world — and where they can find the information and resources to keep the good times rolling.

WHY SEMICON Taiwan? Semiconductors are the foundation of the smart future. With its fully-established industry ecosystem and excellent talents in R&D, the Taiwan semiconductor industry is full of potentials and growth momentum in the era of Cloud Economics. SEMICON Taiwan is not just a platform that connects Taiwan and global microelectronics ecosystems but also a bridge that facilitates smooth collaboration between the industry, the government, academia, and research institutions. Witnessing enormous business collaboration, SEMICON Taiwan still stays true to its missions― Leading Technology Trends, Driving Technology Innovation, and Facilitating Collaboration and continues providing various channels and activities that meet the companies' marketing and promotion needs.

More information on ​​​SEMICON West's website​

From 8/31/2026 to 9/04/2026|​TaiNEX 1 & 2 – Taipei Nangang Exhibition Center, Taipei, Taiwan​

Contact:​Jean-Ch​ristophe Bonté​with any questions.​​

Event|Grenoble Scientific Polygon, France

Europe has the expertise and skills to promote a more responsible digital sector (frugality, regulation, ethics) that creates high-quality jobs. However, mastery of data is just as crucial as mastery of materials and energy when it comes to the operability and sustainability of disruptive digital components and integrated circuits. More sustainable integrated hardware and software solutions will be discussed at the END* symposium in the field of Information & Communication Technologies (ICT)

CEA-Leti has invested in multidisciplinary platforms with unique equipment and expertise. By leveraging advances in heterogeneous integration, new materials and photonics, we are driving semiconductor innovation and tackling the new challenges of disruptive AI markets and technologies.

During this 19th edition of Leti Innovation Days Tokyo, CEA-Leti’s CEO will celebrate R&D partnerships with its partners in Japan and explore new possibilities to support the Japanese semiconductor industry. This year’s theme is “The AI-Chip Revolution: Scaling Innovation in Semiconductors”.

High-level speakers and technical experts will present the latest advances through keynote speeches, seminars and live demos. Join us to enjoy lively networking and exchanges in a unique setting at the Residence of France in Japan.

CEA-Leti experts will be onsite at CEA-Leti's booth and available to discuss the findings of three papers on heterogeneous integration

The aim of ESSERC is to provide an annual European forum for the presentation and discussion of recent advances in solid-state devices and circuits. The level of integration for system-on-chip design is rapidly increasing. This is made available by advances in semiconductor technology. Therefore, more than ever before, a deeper interaction among technologists, device experts, IC designers and system designers is necessary.

Event|Maison Minatec, Grenoble, France

LID World Summit from 23 to 25 June offer you a front-row seat to our most recent advances. Join more than 1,250 semiconductor industry professionals at this three-day global event and come away equipped and inspired to innovate!​

AI Insight
Core Point

CEA-Leti will present semiconductor advances at SEMICON Taiwan 2026, reinforcing its R&D ties with Taiwan and the global chip industry.

Key Players

CEA-Leti — French semiconductor and microelectronics research institute, based in Grenoble.

Industry Impact
  • ICT: High — Advances in microelectronics, photonics, and heterogeneous integration could influence chip design and manufacturing.
  • Computing/AI: High — Theme of AI-chip revolution targets disruptive AI market needs.
Tracking

Monitor — Event participation signals continued international R&D push, but no partnership agreements are yet confirmed.

Highlights
Upcoming Event
Related Companies
CEA-Leti
CEA-Leti mature
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Categories
半导体 人工智能 科研
AI Processing
2026-07-28 13:33
deepseek / deepseek-v4-pro