用于超高速网络的智能表面:José-Luis González Jiménez 在 EuMW 获表彰

Smart Surfaces for Ultra-Fast Networks: José-Luis González Jiménez Honored at EuMW

CEA-Leti Original
摘要
CEA-Leti 研究工程师 José Luis González Jiménez 凭借与英特尔合作开发的 58 Gb/s D 波段非视距有源可重构智能表面(RIS)链路,在欧洲微波周获奖。该成果基于欧盟及法国“未来网络”等项目,并与戴尔、Intracom Telecom 等企业协同,旨在实现 6G 超高速、低延迟无线通信。其技术通过动态放大和重定向信号,可突破复杂工业场景中的障碍,为下一代智能工厂的可重构网络与分布式 AI 铺平道路。

CEA-Leti 研究工程师 José Luis González Jiménez 因在亚太赫兹通信与智能可重构表面领域的突破,于欧洲微波周(EuMW)获颁重要奖项。他自 2011 年加入该机构,此前在加泰罗尼亚理工大学完成博士学位,主攻复杂电子系统的信号完整性。此后十余年,他专注于射频集成电路设计,目前的研究核心是面向 6G 的 D 波段(约 150 GHz)毫米波与亚太赫兹技术,旨在实现超高速、低延迟的无线通信。

获奖论文《A 58 Gb/s D-band NLOS link enabled by active RIS》基于欧洲 COREnext 与 TERRAMETA 项目,以及法国“2030 未来网络”国家计划,亦是同英特尔长期产业合作的延续。目标是在 CMOS 无线电架构和太赫兹智能表面之上构建 6G 系统。该研究直指智能工厂的迫切需求:人机协作场景下,中央系统必须在 1 毫秒内完成处理与通信,以预防事故。戴尔公司的实验暴露了 Wi-Fi 等传统技术的瓶颈,González Jiménez 的方案则依托多信道无线电链路、Intracom Telecom 的基站,以及关键的可重构智能超表面。这些表面如同电子控制的镜面,能动态调节反射角,绕开障碍物,优化复杂动态环境中的信号传播。

该研究的一项核心成就是实现了有源超表面,不仅反射电磁波,还能放大信号,显著扩展通信距离。初期在 CEA-Leti 进行了暗室测量,后续完成了集成无线电系统、智能表面与处理服务器的联合演示。这些工作为在高度动态环境中部署具有分布式计算能力的物理 AI 系统铺平道路,网络可自动适应变化与突发状况。智能超表面有望大幅提升下一代智能工厂的性能——工厂管理层所需交换的海量数据,不仅要求极高带宽,还必须满足超低延迟。该成果也典型体现了 CEA-Leti 将尖端技术转化为未来通信系统实用解决方案的抱负。

(TERRAMETA 项目由欧盟“地平线欧洲”框架计划资助,“未来网络”计划获法国 2030 投资。)

Summary
CEA-Leti research engineer José Luis González Jiménez won an award at European Microwave Week for demonstrating a 58 Gb/s D-band wireless link using an active reconfigurable intelligent surface (RIS) that amplifies signals, developed with Intel, Intracom Telecom, and EU/France 2030-funded projects. The breakthrough paves the way for ultra-fast, low-latency 6G communications in smart factories, using electronically steerable metasurfaces to maintain reliable connectivity in dynamic, obstacle-filled environments.

José Luis González Jiménez, a research engineer at CEA-Leti since 2011, has been honored at European Microwave Week (EuMW) for his work on a 58 Gb/s D-band non-line-of-sight (NLOS) link enabled by an active reconfigurable intelligent surface (RIS). The recognition highlights a key advance toward ultra-fast, low-latency 6G wireless communications for complex industrial environments.

González Jiménez brings over fifteen years of integrated circuit design experience to CEA-Leti, having joined after a PhD at the Polytechnic University of Catalonia focused on signal integrity. His current research concentrates on millimeter-wave and sub-terahertz frequencies, primarily in the D-band around 150 GHz. The award-winning paper, “A 58 Gb/s D-band NLOS link enabled by active RIS,” grew out of the European projects COREnext and TERRAMETA, the France 2030 PEPR “Future Networks” program, and an industrial collaboration with Intel.

The work targets the needs of smart factories under the TERRAMETA project, launched in 2023, where robots and humans coexist and rapid decision-making demands processing and communication times below one millisecond. Experiments with Dell revealed the inadequacy of conventional Wi‑Fi, leading to a system that combines multi‑channel radio links, a base station from Intracom Telecom, and active metasurfaces. These electronically controlled, reconfigurable mirrors can dynamically adjust their reflection angle to bypass obstacles and optimize signal propagation. Crucially, the developed metasurfaces do not merely reflect—they actively amplify the signal, significantly extending range. Measurements in CEA-Leti’s anechoic chamber confirmed the system’s performance, followed by integrated demonstrations linking the radio system, intelligent surface, and processing server.

The practical outcome is a path to intelligent communication networks that adapt autonomously to dynamic conditions, enabling distributed physical AI systems with ultra‑high bandwidth and sub‑millisecond latency. The technology directly supports next‑generation smart factories where massive data exchange at the management level is critical. The achievement exemplifies CEA-Leti’s drive to transform cutting‑edge research into deployable communication solutions.

Résumé
José Luis González Jiménez, ingénieur-chercheur au CEA-Leti, a été récompensé à l’European Microwave Week pour sa démonstration d’une liaison sans fil D-band à 58 Gb/s exploitant des surfaces intelligentes reconfigurables actives, issue d’une collaboration avec Intel et Intracom Telecom. Ses travaux, financés par les projets européens TERRAMETA et France 2030, ouvrent la voie aux réseaux 6G ultra-rapides et à faible latence, cruciaux pour les usines intelligentes en environnements industriels complexes.

News|Headlines|Success|Nomination|Profile

​​​A research engineer at CEA-Leti since 2011, José Luis González Jiménez develops innovative 6G technologies based on silicon integrated circuits and systems, sub-terahertz waves and reconfigurable intelligent surfaces. Recognized at theEuropean Microwave Week (EuMW), his work paves the way for ultra-fast, low-latency wireless communications capable of operating in complex industrial environments.​

For more than fifteen years, José Luis González Jiménez has been working at CEA-Leti on the design of integrated circuits for radio communications, particularly in the field of radio frequency (RF) technologies. His career began with studies in telecommunications, specializing in electronic circuits. He joined CEA-Leti in 2011 after completing a PhD at the Polytechnic University of Catalonia, where he focused on signal integrity challenges in complex electronic systems.

Today, his research focuses on very high-frequency communications, particularly millimeter-wave and sub-terahertz technologies, mainly in the D-band (around 150 GHz). These technologies are now at the heart of the challenges associated with ultra-high-speed wireless communications.

The work presented in the paper "A 58 Gb/s D-band NLOS link enabled by active RIS" builds on the European projects COREnext¹, TERRAMETA², and the “France 2030 PEPR" Future Networks³ French national program. It also represents a significant continuation of an industrial collaboration with Intel. The objective is to develop 6G technologies based on CMOS radio architectures and terahertz intelligent surfaces for ultra-high-speed wireless communications.

The award received at the European Microwave Week represents an important recognition for José Luis:

Launched in 2023, the TERRAMETA project aims to address the needs of smart factories, where robots and humans operate side by side. How can their behavior be predicted to help prevent accidents?

Processing and communication times must remain below one millisecond to enable the central system to make rapid decisions.

Experiments conducted with Dell highlighted the limitations of conventional wireless technologies such as Wi-Fi. The solution developed by José Luis relies on multi-channel radio links combined with a base station provided by Intracom Telecom. It also integrates intelligent metasurfaces capable of reflecting and redirecting signals according to the surrounding environment.

These surfaces act as electronically controlled reconfigurable mirrors, allowing the reflection angle to be adjusted dynamically to bypass obstacles and optimize signal propagation in complex, constantly changing environments.

One of the project's major achievements is the demonstration of active metasurfaces that not only reflect electromagnetic waves but also amplify the signal, significantly extending communication range. Initial testing was carried out at CEA-Leti, including measurements in an anechoic chamber, before integrated demonstrations combining the radio system, intelligent surface, and processing server.

José Luis's work opens the door to intelligent, reconfigurable communication networks designed for highly dynamic environments and to deploy physical IA systems with distributed computing capabilities. These systems could automatically adapt to changing conditions, external constraints, and unexpected situations.

Intelligent metasurfaces could significantly improve the performance of the next generation of smart factories, where the enormous volume of data to be exchanged at the factory management level requires both extremely high communication bandwidth and ultra-low latency.

Through this research, José Luis perfectly illustrates CEA-Leti's ambition: transforming cutting-edge technological advances into practical solutions for the communication systems of tomorrow.​

² Funded by theEU Horizon Europe Framework Programme(TERRAMETA)³ Funded by theFrance 2030 Future Networksprogram​

Acknowledgments:A. Siligaris, A. Hamani, A. Clemente, F.Foglia Manzillo, C. Dehos, J.-B.

Doré, N. Cassiau, Benjamin Blampey, Renaud Mourot

For more information about the paper:https://www.researchgate.net/publication/397774318_A_58_textGbmathrms_D-Band_NLOS_Link_Enabled_by_Active_RIS

For more information about the conference:https://www.eumw.eu/

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AI Insight
Core Point

CEA-Leti研究员José Luis González Jiménez因开发基于可重构智能表面(RIS)的58 Gb/s D波段(150 GHz)非视距无线链路获欧洲微波周奖,为6G超高速、低延迟工业通信提供关键技术路径。

Key Players
  • CEA-Leti — 法国微电子研究院,格勒诺布尔,研发硅基集成电路与太赫兹技术。
  • Intel — 半导体巨头,美国,提供工业合作与CMOS射频架构支持。
  • Dell — 计算基础设施供应商,美国,验证传统Wi-Fi在智能工厂的局限性。
  • Intracom Telecom — 电信设备商,希腊,提供演示用基站系统。
Industry Impact
  • ICT: 高 — 非视距D波段传输与有源RIS将重塑6G无线网络架构。
  • 计算/人工智能: 中 — 支持分布式计算与物理AI系统,实现实时自适应网络。
  • 终端/消费电子: 中 — 未来6G终端可能集成智能表面技术。
Tracking

强烈跟踪 — 该成果验证了有源RIS在6G工业关键任务通信的可行性,可能影响标准制定与运营商试验。

Highlights
Tech Breakthrough Local Research
Related Companies
CEA-Leti
CEA-Leti mature
positive
Intel
mature
neutral
Dell
mature
negative
neutral
Categories
半导体 电信 科研
AI Processing
2026-07-28 23:03
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