Power Integrations has unveiled what it describes as the first 2200 V gallium nitride (GaN) technology, a development that pushes GaN into voltage ranges traditionally dominated by silicon carbide (SiC). The company says the breakthrough could provide a compelling high-frequency alternative for demanding power applications, including AI data centers, electric vehicles, and HVDC infrastructure.
The significance of the announcement lies in the fact that GaN has so far been used mainly in lower-voltage segments, while SiC has held the advantage at higher voltages. By reaching 2200 V, Power Integrations is positioning GaN as a viable option in markets where efficiency, switching speed, and power density are critical, and where designers have typically had to rely on SiC-based solutions.
The move marks an important step in the evolution of wide-bandgap semiconductors, potentially broadening the competitive landscape for next-generation power electronics. If adopted commercially, the technology could open the door to smaller, faster, and more efficient power systems in high-growth sectors such as AI infrastructure, electrified transport, and long-distance high-voltage power transmission.