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ESSERC的宗旨是提供一个年度欧洲论坛,展示并讨论固态器件与电路的最新进展。片上系统设计的集成度正在快速提升,这得益于半导体技术的进步。因此,工艺专家、器件专家、IC设计师和系统设计师之间比以往任何时候都更需要深层次的互动。

The aim of ESSERC is to provide an annual European forum for the presentation and discussion of recent advances in solid-state devices and circuits. The level of integration for system-on-chip design is rapidly increasing. This is made available by advances in semiconductor technology. Therefore, more than ever before, a deeper interaction among technologists, device experts, IC designers and system designers is necessary.

CEA-Leti 将于 2026 年 9 月在西班牙 ESSERC 大会上展示其硬件安全与嵌入式系统评估创新,并联合 FAMES 与 SiNANO 举办关于 10nm 和 7nm FD-SOI 技术的专题研讨会。该机构还将在法国及东京的 Leti Innovation Days 上,探讨以 AI 芯片革命为核心的半导体创新与可持续数字技术。这一系列全球活动凸显了 CEA-Leti 在推动异构集成、

CEA-Leti 半导体 人工智能 网络安全 CEA-Leti (CEA-Leti) CEA-List (CEA) FAMES