CEA-Leti’s Optics and Photonics teams will showcase their latest work on optical data transmission at ECOC 2026 in Malaga, Spain, from Sept. 20 to 24, with a booth focused on silicon photonics, µLEDs and advanced packaging. The institute will present chiplet-based optical network-on-chip (ONoC) technologies, covering design, process development, testing and packaging, as well as photonics convergence on a silicon CMOS platform, high-performance packaging for industrial photonic integrated circuits, a visible light communication system aimed at improving speed, density and power consumption for high-performance computing, and components for quantum communications and computing.

CEA-Leti will also present two scientific papers at the conference. The first, scheduled for Monday, Sept. 21 at 4:45 pm in SC 12, Mo5-D1C1.1, is titled “Photonic integrated circuits on SOI and SiN for quantum communications and quantum computing.” The second, set for Thursday, Sept. 24 at 10:15 am in Th1-C6E1, is “Heterogeneous Integration of Low Loss Si3N4 Waveguides and High-Speed Si-Ge Photodiodes.”

ECOC, the European Conference on Optical Communications, is described as Europe’s largest and most prestigious optical communications event and the second largest worldwide. It brings together researchers from industry and academia, along with professionals, to discuss advances, future trends and the role of photonics in supporting scientific progress and economic growth. Its exhibition, held alongside the conference, is the largest optical communications exhibition in Europe and a key meeting place for decision-makers in the sector.

CEA-Leti lists contacts Eleonore Hardy, Silicon Photonics Partnerships Manager, and Laurent Fulbert, Deputy Head of the Optics & Photonics Division, for questions about the event. The institute also points to other upcoming activities, including co-organizing the first Open Innovation Materials & Manufacturing Europe (OIM² Europe) forum in Grenoble to connect research and industrial innovation in advanced materials, nanotechnologies and sustainable manufacturing; an END* symposium in Grenoble Scientific Polygon on more sustainable ICT hardware and software; a SEMICON Europa session in Munich on AI-driven semiconductor innovation spanning advanced compute, 3D integration, silicon photonics and power-efficient packaging; the 19th Leti Innovation Days Tokyo, centered on “The AI-Chip Revolution: Scaling Innovation in Semiconductors” and focused on R&D partnerships with Japan; and a workshop at INP-Ense³ in Grenoble on semiconductor junction technology, where Philippe Rodriguez of CEA-Leti serves as General Chair.

From 9/20/2026 to 9/24/2026Malaga, SPAIN

CEA-Leti's Optics and Photonics multidisciplinary teams introduced their latest results on optical data transmissions with silicon photonics, µLED & advanced packaging solutions.​

COME AND MEET CEA-LETI'S EXPERTS​

This year, CEA-Leti's booth will exhibit silicon photonics, µLED & advanced packaging solutions. Come and discuss our latest achievements.​

Chiplet-based Optical Network on Chip (ONoC)​​​

Design, process development, testing, and packaging solutions​

Photonics technologies convergence on silicon CMOS platform​​

High performance packaging towards industrial photonic integrated circuits​ ​

A visible light communication system to improve speed, density and power consumption for high- performance computing.​​​​​

Developing components for quantum communications and computing​

DISCOVER CEA-LETI’S MAJOR SCIENTIFIC RESULTS

With 2 papers, the institute will present this year’s major scientific results at ECOC 2026​, including the following topics:

Monday, Sept 21, 4:45 pmSC 12, Mo5-D1C1.1

Photonic integrated circuits on SOI and SiN for quantum communications and quantum computing

Thursday, ​​Sept 24, 10:15 amTh1-C6E1​

​Heterogeneous Integration of Low Loss Si3N4 Waveguides and High-Speed Si-Ge Photodiodes

ECOC, the European Conference on Optical Communications, is the largest and most prestigious event on optical communications in Europe and the second largest worldwide. At ECOC, researchers from both industry and academia and professionals come together to discuss and explore advances and probe future trends that will enable scientific progress and economic growth.

​​With an exciting program covering all aspects in the field of optical communications and networks, ECOC offers an irreplaceable forum for observing the state of the sector and establishing relationships with the most relevant players in the ecosystem. Expand your knowledge and discover the possibilities offered by photonics to address crucial issues that enable the growth and sustainability of the information society in emerging fields such as Artificial Intelligence, the Internet of Things, and Quantum Technologies.

The ECOC Exhibition runs in parallel with the ECOC conference and has become the largest optical communications exhibition in Europe and the key meeting place for decision-makers in the optical communications world.​​

More information on​​ECOC 2026’s website

From 09/20 to 09/24/2026 |​Malaga, SPAIN​

Contacts:Eleonore HAR​DYorLaurent FULBERT​​with any questions.​​

Silicon Photonics Partnerships Manager

Deputy Head of Optics & Photonics Division

Event | Agenda|Grenoble, France

CEA-Leti is proud to co-organize the first edition of Open Innovation Materials & Manufacturing Europe (OIM² Europe), a new European forum designed to bridge the gap between cutting-edge research and industrial innovation in advanced materials, nanotechnologies, and sustainable manufacturing.

Event|Grenoble Scientific Polygon, France

Europe has the expertise and skills to promote a more responsible digital sector (frugality, regulation, ethics) that creates high-quality jobs. However, mastery of data is just as crucial as mastery of materials and energy when it comes to the operability and sustainability of disruptive digital components and integrated circuits. More sustainable integrated hardware and software solutions will be discussed at the END* symposium in the field of Information & Communication Technologies (ICT)

Event | Agenda|SEMICON Europa, Messe München, Germany.

Artificial intelligence is reshaping the semiconductor landscape, demanding breakthroughs across the entire technology stack.

This session explores the deep-tech innovations enabling the AI era—from advanced compute, 3D integration and silicon photonics to power-efficient packaging—before showcasing two real-world demonstrations and concluding with Europe’s vision for sustainable AI infrastructure.

During this 19th edition of Leti Innovation Days Tokyo, CEA-Leti’s CEO will celebrate R&D partnerships with its partners in Japan and explore new possibilities to support the Japanese semiconductor industry. This year’s theme is “The AI-Chip Revolution: Scaling Innovation in Semiconductors”.

High-level speakers and technical experts will present the latest advances through keynote speeches, seminars and live demos. Join us to enjoy lively networking and exchanges in a unique setting at the Residence of France in Japan.

CEA-Leti has invested in multidisciplinary platforms with unique equipment and expertise. By leveraging advances in heterogeneous integration, new materials and photonics, we are driving semiconductor innovation and tackling the new challenges of disruptive AI markets and technologies.

During this 19th edition of Leti Innovation Days Tokyo, CEA-Leti’s CEO will celebrate R&D partnerships with its partners in Japan and explore new possibilities to support the Japanese semiconductor industry. This year’s theme is “The AI-Chip Revolution: Scaling Innovation in Semiconductors”.

High-level speakers and technical experts will present the latest advances through keynote speeches, seminars and live demos. Join us to enjoy lively networking and exchanges in a unique setting at the Residence of France in Japan.

Event|INP-Ense³, Grenoble, France

The workshop brings together researchers, engineers and industry experts to discuss the latest advances and challenges in semiconductor junction technology.

As a member of the organizing committee, with Philippe Rodriguez (CEA-Leti) serving as General Chair, CEA-Leti plays a key role in driving these exchanges and fostering collaboration across the semiconductor ecosystem