CEA-Leti与CEZAMAT-WUT通过签署谅解备忘录巩固战略合作伙伴关系

CEA-Leti and the CEZAMAT-WUT consolidate their strategic partnership by signing a MoU

CEA-Leti Original
摘要
2026年3月19日,法国CEA-Leti与波兰华沙理工大学CEZAMAT-WUT在华沙签署谅解备忘录,旨在深化双方在FD-SOI技术和半导体领域的合作。该合作获得了法国与波兰政府高层代表的共同支持,将聚焦辐射抗性元件研发、知识共享与人才培养,以增强欧洲技术主权。此次合作亦与欧洲芯片法案框架下的FAMES试点项目及RESOLVE倡议协同,推动构建更具韧性的欧洲半导体生态系统。

2026年3月19日,华沙——法国电子与信息技术实验室(CEA-Leti)与华沙理工大学先进材料与技术中心(CEZAMAT-WUT)在共同举办的FD-SOI技术与半导体前景研讨会上,签署了一份谅解备忘录(MoU),标志着双方战略合作迈出重要一步。

此次高级别活动汇聚了学术界、产业界及政府机构的代表。华沙理工大学科研事务副校长马里乌什·马利诺夫斯基教授与CEA-Leti副主任兼项目总监让-勒内·勒克佩斯共同出席。波兰多位部委代表、法国驻波兰大使艾蒂安·德·蓬桑阁下,以及波兰数字化事务部国务秘书达里乌什·斯坦德斯基也到场见证,凸显了此项合作对增强欧洲技术主权的重要战略意义。

研讨会聚焦共同项目,重点探讨了全耗尽型绝缘体上硅(FD-SOI)技术及抗辐射元器件的开发。会议同时展示了CEZAMAT的基础设施潜力,其拥有4000平方米洁净室,具备为航天、国防及核能等关键领域提供元器件原型开发的欧洲级能力。

具体而言,此次合作将促进知识共享、联合研发项目以及人才培养。

此外,该合作亦融入更广泛的欧洲战略布局,与《欧洲芯片法案》框架下的FAMES试验线等项目协同,并参与关于半导体行业未来的战略讨论,例如RESOLVE倡议。该倡议由CEA-Leti发起,旨在为欧盟层面正在讨论的《芯片法案2.0》向欧盟委员会(DG CNECT)提出发展路径建议。目前,RESOLVE已汇集来自12个欧洲国家的14家研究技术组织,波兰的CEZAMAT-WUT亦位列其中。

此次备忘录的签署,标志着欧洲朝着更一体化、更具韧性和竞争力的半导体生态系统迈出了坚实一步。

Summary
CEA-Leti and Poland's CEZAMAT-WUT signed a Memorandum of Understanding to collaborate on semiconductor technologies like FD-SOI and radiation-hardened components, aiming to boost European technological sovereignty. The partnership, supported by high-level French and Polish officials, will involve knowledge sharing, joint R&D, and talent development, aligning with broader EU initiatives like the Chips Act. This step strengthens the European semiconductor ecosystem by leveraging CEZAMAT's prototyping facilities for critical sectors such as space, defense, and nuclear.

CEA-Leti and the Warsaw University of Technology's CEZAMAT center (CEZAMAT-WUT) have significantly deepened their strategic partnership by signing a Memorandum of Understanding (MoU) in Warsaw. The signing occurred during a joint workshop focused on FD-SOI technologies and semiconductor prospects, underscoring a shared commitment to strengthening Europe's technological sovereignty.

The high-level event featured key figures including Professor Mariusz Malinowski, Vice-Rector for Scientific Affairs at WUT, and Jean-René Lèquepeys, Deputy Director and Director of Programs at CEA-Leti. It also drew attendance from Polish ministerial representatives, the French Embassy, Dariusz Standerski—Secretary of State at Poland's Ministry of Digital Affairs—and French Ambassador to Poland, His Excellency Étienne de Poncins. Their participation highlighted the cooperation's strategic importance for both nations.

Technical discussions at the workshop centered on collaborative projects, particularly the development of FD-SOI technologies and radiation-hardened components. The potential of CEZAMAT's infrastructure was emphasized, including its 4,000 m² of cleanrooms and its European-scale prototyping capabilities for components destined for critical space, defense, and nuclear applications.

Concretely, the MoU will enable enhanced knowledge sharing, joint R&D initiatives, and talent development between the institutions. This bilateral partnership aligns with broader European semiconductor initiatives. It connects to projects like the FAMES pilot line, established under the European Chips Act, and strategic discussions on the sector's future, notably the RESOLVE initiative. Led by CEA-Leti, RESOLVE now assembles 14 Research and Technology Organizations from 12 European countries—including CEZAMAT-WUT representing Poland—to propose pathways to the European Commission for a potential Chips Act 2.

This agreement represents a tangible step toward a more integrated, resilient, and competitive European semiconductor ecosystem.

Résumé
Le CEA-Leti et le CEZAMAT-WUT (Université de Technologie de Varsovie) ont signé un protocole d'accord à Varsovie pour renforcer leur collaboration sur les technologies FD-SOI et les semi-conducteurs, en présence de représentants gouvernementaux polonais et français. Ce partenariat stratégique vise à partager des connaissances, mener des projets de R&D conjoints et développer des talents, dans le but de renforcer la souveraineté technologique européenne. Il s'inscrit dans des initiatives plus larges comme la ligne pilote FAMES et l'initiative RESOLVE, soutenues par l'European Chips Act, pour consolider un écosystème européen des semi-conducteurs plus intégré et résilient.

March 19th, 2026, in Warsaw, CEA-Leti and the CEZAMAT-WUT (Warsaw University of Technology) reached a major milestone in their collaboration by signing a Memorandum of Understandin​​g (MoU), as part of a joint workshop on FD-SOI technologies and prospects for semiconductors.

The event brought together high-level representatives from academic, industrial, and institutional fields, such as Professor Mariusz Malinowski, Vice-Rector, Scientific Affairs at the Warsaw University of Technology and Jean-René Lèquepeys, Deputy Director and Director of Programs at CEA-Leti. Also present were representatives of the various Polish Ministries and of the French Embassy, and Mr. Dariusz Standerski - Secretary of State at the Ministry of Digital Affairs, and His Excellency, Mr. Étienne de Poncins, Ambassador of France to the Republic of Poland. Their presence was a testament to the strategic importance of this cooperation, which aims to reinforce the technological sovereignty of Europe.

The workshop gave way to discussions on common projects, such as developing FD-SOI technologies and radiation-resistant components. Conversations also showcased the potential of CEZAMAT infrastructures, with 4,000 m² of clean rooms and a European capacity for prototyping components intended for critical spatial, defense, and nuclear sectors.

In concrete terms, the partnership will facilitate sharing knowledge, joint R&D projects, and nurturing talent.

Finally, the collaboration is also part of a wider European effort, alongside projects such as the FAMES pilot line, established as part of the European Chips Act, and strategic discussions about the future of the semiconductor sector, including the RESOLVE initiative, the purpose of which is to put forward paths to pursue to the European Commission (DG CNECT) for the Chips Act 2, currently being discussed at an EU level. CEA-Leti launched the RESOLVE initiative, which now brings together 14 RTOs from 12 European countries, including the Cezamat-WUT for Poland.

This signature therefore marks a tangible step forward toward a more integrated, resilient, and competitive European ecosystem.​

AI Insight
Core Point

CEA-Leti and CEZAMAT-WUT signed an MoU to deepen collaboration on FD-SOI semiconductor technologies, strengthening European tech sovereignty and R&D capacity.

Key Players

CEA-Leti — French research institute for microelectronics and nanotechnologies, based in Grenoble.

CEZAMAT-WUT — A research center at Warsaw University of Technology focused on advanced materials and technologies, based in Warsaw.

Industry Impact
  • ICT: High — Direct development of semiconductor technologies (FD-SOI) for European sovereignty.
  • Computing/AI: Medium — Advances in specialized semiconductor components enable future computing hardware.
Tracking

Strongly track — This partnership is a direct building block for European strategic autonomy in semiconductors under the Chips Act.

Highlights
Upcoming Event Investment / Funding
Categories
半导体 科研
AI Processing
2026-04-03 23:08
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