Le CEA-Leti, le CEA-List et PSMC collaborent pour intégrer la technologie RISC-V et la photonique sur silicium MicroLED dans des solutions d'empilement 3D et d'interposeurs destinées à l'IA de nouvelle génération.
法国原子能与替代能源委员会（CEA）旗下两大顶尖研究机构CEA-Leti与CEA-List，近日宣布与力积电（PSMC）达成战略合作。三方将结合CEA-List在RISC-V架构设计、CEA-Leti在硅基光电子领域的专长，以及力积电成熟的3D堆叠与中介层技术平台，共同开发面向下一代人工智能系统的高带宽通信与高效能计算解决方案。
当前半导体行业面临多重挑战：传统铜互连的物理极限、日益严格的功耗限制，以及对灵活可扩展计算架构的迫切需求。此次合作旨在通过集成短距离高带宽光互连（实现高效数据传输）与可定制的RISC-V处理器架构，突破现有瓶颈，构建高性能数据传输与计算架构的新范式。
CEA Institutes Partner with PSMC to Integrate RISC-V and Silicon Photonics for Next-Gen AI Systems
Two leading French research institutes, CEA-Leti and CEA-List, have entered a strategic collaboration with Taiwan's Powerchip Semiconductor Manufacturing Corporation (PSMC). The partnership aims to combine advanced computing and communication technologies to develop new solutions for next-generation artificial intelligence systems.
The initiative will integrate CEA-List's expertise in RISC-V processor design and CEA-Leti's silicon photonics technology into PSMC's established 3D stacking and interposer platforms. The goal is to introduce high-bandwidth communication and high-efficiency computing capabilities to address critical industry challenges.
These challenges include the physical limitations of traditional copper interconnects, increasingly tight power budgets, and the need for more flexible, scalable computing architectures. The collaboration specifically targets these constraints by combining energy-efficient, short-reach optical links for data movement with customizable RISC-V processor architectures. This approach is positioned to establish a new paradigm for high-performance data transport and computing design in advanced AI systems.
Communiqué de presse|Actualité|Nouvelles technologies
The two flagship institutes of the French Alternative Energies and Atomic Energy Commission (CEA) are global innovation leaders in microelectronics and intelligent digital systems
GRENOBLE, France – April 3, 2026 – CEA-Leti, a world-leading micro & nanotechnologies research institute, and CEA-List, a specialist in smart digital systems, today announced a strategic collaboration withPowerchip Semiconductor Manufacturing Corporation (PSMC).The collaboration will leverage CEA-List's RISC-V design expertise and CEA-Leti's silicon photonics expertise to introduce high-bandwidth communication and high-efficiency computing technologies into PSMC's established 3D stacking and interposer platforms to deliver solutions for next-generation artificial intelligence (AI) systems.
The semiconductor industry faces mounting challenges, including the physical limits of traditional copper interconnects, increasingly stringent power budgets, and the urgent need for flexible, scalable computing architectures. By integrating short-reach, high-bandwidth optical links for energy-efficient data movement and customizable RISC-V processor architectures, the collaboration directly addresses these constraints and establishes a new paradigm in high-performance data transport and computing architecture.
法国CEA研究所与台湾PSMC合作，将RISC-V处理器与硅光MicroLED技术集成到3D堆叠平台，旨在突破AI芯片的互连带宽和能效瓶颈。
CEA-Leti — 法国领先的微纳技术研究所，专注于硅光子学。
CEA-List — 法国智能数字系统研究所，专注于RISC-V设计。
Powerchip Semiconductor Manufacturing Corporation (PSMC) — 台湾半导体制造公司，提供3D堆叠和中介层平台。
Strongly track — 该合作融合了开放指令集、先进封装和光互连三大前沿方向，可能定义下一代AI芯片范式。