Bosch lance ses puces SiC de 3ᵉ génération et vise le leadership mondial
博世发布第三代碳化硅芯片，剑指全球市场领导地位。该集团宣布其新一代碳化硅（SiC）芯片性能提升20%，尺寸更小，并已在两大洲布局两座工厂，全力加速进军半导体领域。
碳化硅芯片是提升电动汽车续航、缩短充电时间的关键元件，市场需求正随电动车普及而激增。博世凭借此次技术迭代，直接挑战意法半导体、英飞凌等现有主导厂商。
新一代芯片采用更紧凑的晶体管设计，在相同功率下芯片面积减少约30%，有助于降低系统成本。博世计划将碳化硅业务销售额从2023年的5亿欧元提升至2025年的10亿欧元，并目标在2030年前占据全球市场20%份额。
产能方面，博世已在德国罗伊特林根工厂启动量产，并计划2024年内于马来西亚槟城工厂投产。集团半导体业务负责人表示：“我们正系统性地扩大碳化硅领域竞争力，目标成为全球领先供应商。”
目前博世碳化硅芯片已供应给中国、欧洲和北美的主要汽车制造商。随着全球电动车渗透率持续提升，博世此次技术升级与产能扩张，或将重塑功率半导体市场格局。
Bosch has unveiled its third-generation silicon carbide (SiC) semiconductors, targeting global market leadership with a 20% performance boost and a reduced chip size. The German industrial giant is ramping up production across two new factories on separate continents to secure its position in the competitive electric vehicle component sector.
These new SiC chips are engineered to enhance power efficiency in EVs, notably in traction inverters that convert battery DC current to AC for the motor. The improved performance can increase an electric car's range by up to 6%, a critical metric for automakers. Bosch is already supplying these chips to major customers and plans to use them in its own electric powertrain systems.
To support its ambitious scale-up, Bosch is activating dedicated SiC production lines at its wafer fab in Reutlingen, Germany, and at a new facility in Suzhou, China. This dual-continent manufacturing strategy is designed to strengthen supply chain resilience and meet growing global demand. The company has invested over one billion euros in its semiconductor business since 2021, with a significant portion dedicated to SiC technology.
Bosch's move intensifies the race for SiC market dominance, where it faces established players like STMicroelectronics and Wolfspeed. The broader industry context includes a projected tripling of the SiC semiconductor market to over $4 billion within the next five years, driven primarily by automotive electrification. Bosch's integrated approach—controlling production from wafer to finished chip—aims to give it a competitive edge in reliability and volume supply as the EV transition accelerates.
20% de performances en plus, une taille réduite et deux usines sur deux continents : Bosch accélère dans les semi-conducteurs en carbure de silicium et ambitionne rien moins que de devenir le premier fabricant mondial de puces SiC. Les puces en carbure de silicium (SiC) sont au cœur de la course à l’efficacité et aux […]
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Bosch launched its third-generation silicon carbide (SiC) chips, aiming for global market leadership by improving performance 20% and reducing size.
Bosch — Global automotive supplier and industrial tech company, based in Germany.
Strongly track — Bosch's aggressive capacity expansion on two continents could reshape the competitive SiC semiconductor landscape.