类器官与类器官芯片研讨会

Workshop Organoids & Organoids-on-chip

CEA-Leti Original
摘要
CEA-Leti将在格勒诺布尔举办专场活动，聚焦MAGIC胰腺胰岛芯片项目及器官芯片技术，由其健康部门副主任介绍从工业需求到最新科研进展。同时，在LID世界峰会上，CEA-Leti凭借11篇论文（涵盖混合键合与低温工艺）确立其在先进硅集成领域的核心地位，并发布面向下一代显示和数据通信的高性能microLED解决方案。

2026年9月29日，CEA将在法国格勒诺布尔的Y-Spot Partners举办一场高规格的类器官与类器官芯片专题研讨会。会议上午场以“MAGIC项目”为核心，该项目隶属于PEPR MedooC计划，专注于开发胰腺胰岛芯片的多传感与高级生长技术。随后围绕四个主题展开，系统介绍CEA在该领域的布局：从产业需求到最新科技进展，并由CEA-Leti健康部门副主任做引导性概述。上午议程结束后，一场圆桌讨论将汇聚多方视角，聚焦整个领域的关键挑战与未来前景。午餐后，活动转向实操与商务对接，基于CEA的类器官及器官芯片演示器举行一系列B2B会议。本次研讨会采取邀请制，免费入场，但座位有限。

同时值得关注的是，CEA-Leti还将于同年6月23日至25日在格勒诺布尔Maison Minatec举办的LID世界峰会上展示其前沿成果。这场为期三天的全球盛会吸引超过1250名半导体行业专业人士，CEA-Leti专家将在502号展位就七篇论文和海报进行交流，内容涵盖混合键合与低温工艺等关键突破。凭借11篇入选论文，Leti进一步巩固了其在硅基终极集成领域不可或缺的研究中心地位，如其所言：“Avec 11 papiers, le Leti se positionne comme un centre de recherche incontournable dans le domaine de l'intégration ultime sur silicium.”（凭借11篇论文，Leti已确立为硅基终极集成领域无法绕开的研究重镇。）这些进展也预示了类器官芯片开发中可能借力的先进微纳制造能力。

Summary
CEA-Leti will host an invitation-only event on September 29, 2026, in Grenoble to showcase its organoids and organs-on-chips advances, including the MAGIC project and B2B meetings around CEA demonstrators. At the LID World Summit from June 23-25, CEA-Leti will present 11 papers on advanced silicon integration, hybrid bonding, and introduce high-performance microLED solutions for next-generation displays and data communications, reinforcing its leadership in both biotechnology and semiconductor research.

On September 29, 2026, CEA-Leti hosts an invitation-only workshop on organoids and organoids-on-chip at Y-Spot Partners in Grenoble, with limited seating. The event kicks off with the MAGIC project (Multisensing and Advanced Growth of Pancreatic Islets on Chip), part of the PEPR MedooC program. Four thematic sessions and a morning roundtable will address key challenges, followed by afternoon B2B meetings centered on CEA’s Organoids & Organs-on-Chips demonstrators. An introductory overview bridging industrial needs and CEA’s latest scientific advances will be delivered by the deputy head of the Health Division.

Earlier, from June 23 to 25, the LID World Summit at Maison Minatec expects over 1,250 semiconductor professionals. At booth 502, CEA-Leti presents seven papers and posters—including on hybrid bonding and low-temperature processing—contributing to a total of 11 papers that reinforce its leadership in advanced silicon integration. The institute will also unveil high-performance microLED solutions for next-generation displays and data communications.

Résumé
Le CEA-Leti dévoilera son projet MAGIC sur les puces à îlots pancréatiques lors d’une journée dédiée aux organoïdes le 29 septembre 2026 à Y-Spot Partners, et présentera au LID World Summit en juin des avancées en intégration silicium (11 papiers) ainsi que des solutions microLED pour écrans et communications, renforçant son leadership en santé et semi-conducteurs.

Event|Agenda|Health ＆ life sciences|Biotechnology

From 9/29/2026 to 9/29/2026Y-Spot Partners, Grenoble, France

The day will begin with a focus on the MAGIC project (Multisensing and Advanced Growth of Pancreatic Islets on Chip), conducted as part of the PEPR MedooC program the PEPR MedooC program. It will continue with four thematic sessions:

A roundtable discussion will conclude the morning, providing an opportunity to discuss the key challenges and perspectives across the field.

Discussions will continue over lunch, and into the afternoon through B2B meetings organized around CEA Organoids & Organs-on-Chips demonstrators.

Free admission by invitation only. Limited seating available.​

Introduction and overview of CEA’s activities on Organoids & Organoids-on-Chip

From industrial needs to CEA’s latest scientific and technological advances in Organoids & Organoids-on-chip

Deputy head of Health Division, CEA-Leti

Event|Maison Minatec, Grenoble, France

LID World Summit from 23 to 25 June offer you a front-row seat to our most recent advances. Join more than 1,250 semiconductor industry professionals at this three-day global event and come away equipped and inspired to innovate!​

CEA-Leti experts will be onsite at booth 502 and available to discuss the findings of Seven Papers and Posters Includes Hybrid Bonding and Low-Temperature Processing

With 11 papers, Leti has established itself as a leading research centre in the field of advanced silicon integration.​

Avec 11 papiers, le Leti se positionne comme un centre de recherche incontournable dans le domaine de l'intégration ultime sur silicium.

CEA-Leti will introduce their high-performance microLED solutions for next-generation displays and data communications.

AI Insight
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Core Point

CEA-Leti is hosting an invitation-only workshop on organoids-on-chip, showcasing the MAGIC project for pancreatic islets-on-chip, underscoring convergence of microelectronics and biotech for advanced drug testing.

Key Players
  • CEA-Leti — French microelectronics and health tech R&D institute, based in Grenoble.
  • MAGIC Project — pancreatic islets-on-chip initiative under France’s PEPR MedooC program.
Industry Impact
  • ICT: Medium — organ-on-chip devices rely on semiconductor fabrication and microfluidics.
  • Terminals/Consumer Electronics: Low — microLED display mentions are peripheral.
  • Computing/AI: Low — potential for data analysis, but not workshop focus.
Tracking

Monitor — niche event but signals growing CEA-Leti push into bio-electronics and preclinical testing platforms.

Highlights
Upcoming Event
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Categories
半导体 生物技术
AI Processing
2026-05-13 15:23
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