The 22nd Hilton Head Workshop on solid-state sensors, actuators, and microsystems runs May 31–June 4, 2026, at the Sonesta Resort in Hilton Head Island, South Carolina. The event typically draws 350–500 participants from academia, industry, and government, spanning chemistry, materials science, electrical and mechanical engineering, physics, biology, and bioengineering.

CEA-Leti will attend with a booth demonstrating its latest optomechanical sensor technology, which the institute describes as a leap beyond conventional sensors by merging silicon photonics with high-performance MEMS. The presentation accompanying the exhibit will trace the MEMS roadmap from early capacitive devices to advanced piezoresistive sensors, highlighting the novel materials and transduction methods enabling next-generation microphones and optomechanical systems.

On June 3, during the afternoon session, two CEA-Leti papers will be presented. The first (Session 2WP-25) covers high-dynamic-range, high-Q-factor GHz optomechanical resonators for timing applications. The second (Session 2WP-37) examines the characterization of integrated vacuum packaging for high-performance MEMS devices. Pierre-Damien Berger, MEMS Industrial Partnerships Manager, is the contact for inquiries.

Beyond Hilton Head, CEA-Leti has several other 2026 events on its agenda. On September 29 in Grenoble, it will host an "Organoids & Organoids-on-Chip" workshop at the Y-Spot Partners venue. From June 23–25, the institute participates in the LID World Summit in San Jose, California, which expects over 1,250 semiconductor professionals. In a separate forthcoming conference, CEA-Leti will present 11 papers on advanced silicon integration, including seven papers and posters on hybrid bonding and low-temperature processing, reinforcing its position as a leading research center in that domain. Experts will be available at booth 502 to discuss these findings.

From 5/31/2026 to 6/4/2026South Carolina, USA

The field of Microelectromechanical Systems (MEMS) has evolved significantly since the 1980s, transitioning from simple capacitive sensors to highly sensitive piezoresistive sensors. This presentation will outline the development roadmap for MEMS, emphasizing innovative materials and sensing technologies that are driving next-generation devices, particularly in microphone MEMS and optomechanical sensing.

COME AND MEET CEA-LETI'S EXPERTS

This year, CEA-Leti’s booth will exhibit optomechanical sensor demo. Come and discuss lastest achievements in terms of microsystems.​

CEA-Leti’s optomechanical sensors represent a technological revolution compared to conventional sensors. This new generation of optomechanical sensors developed by CEA-Leti ​combines silicon photonics and high-performance MEMS.

DISCOVERCEA-LETI’S MAJOR SCIENTIFIC RESULTS

June 3, 2026 - 2:30 PMSession 2WP-25​​

High Dynamic Range And Q-Factor Ghz Optomechancial Resonators For Timing Applications​

June 3, 2026 - 2:30 PMSession 2WP-37​

Characterization Of Integrated Vacuum For High Performance Mems Devices​

MEMS Industrial Partnerships Manager​​

More information onHILTON HEADwebsite

From5/31/2026to6/04/2026|​South Carolina, USA

Contact:Pierre-Damien BERGER​​with any questions.​​

MEMS Industrial Partnerships Manager

Event | Agenda|Y-Spot Partners, Grenoble, France

We are delighted to announce that CEA is hosting the "Organoids & Organoids-on-Chip" workshop at its Grenoble site on September 29, 2026.

Event|Maison Minatec, Grenoble, France

LID World Summit from 23 to 25 June offer you a front-row seat to our most recent advances. Join more than 1,250 semiconductor industry professionals at this three-day global event and come away equipped and inspired to innovate!​

Event | Agenda|San Jose, California, US

Avec 11 papiers, le Leti se positionne comme un centre de recherche incontournable dans le domaine de l'intégration ultime sur silicium.

CEA-Leti experts will be onsite at booth 502 and available to discuss the findings of Seven Papers and Posters Includes Hybrid Bonding and Low-Temperature Processing

With 11 papers, Leti has established itself as a leading research centre in the field of advanced silicon integration.​