ECS Brokerage Event 2026:规模空前的一届,将创新构想转化为未来合作联盟!

ECS Brokerage Event 2026: the biggest edition yet, turning innovative ideas into future consortia!

AENEAS by Editor 2026-02-09 10:46 Original
摘要
2026年2月4日至5日,欧洲ECS合作对接活动在布鲁塞尔举行,创下逾700人参与的纪录。活动聚焦于为2026年“芯片联合执行体”的10项招标组建联盟,参会者通过近900场双边会议及多个专题研讨,共同推动欧洲在半导体、光子学、6G及量子技术等战略领域的项目合作。此次活动由AENEAS等行业协会组织,旨在强化产学研协作,将创新构想转化为具有影响力的欧洲项目。
ECS 2026年合作对接会:规模空前,推动创新构想迈向未来产业联盟

2026年2月4日至5日,在布鲁塞尔The EGG举行的ECS(电子元件与系统)合作对接会再次印证了其凝聚欧洲ECS生态系统的核心作用。本届活动吸引了超过700名参与者,成为迄今为止规模最大的一届ECS对接会。

在为期两天的密集议程中,与会者通过"对话发起工具"安排了近900场双边会议,探讨了70多个项目构想(通过66份海报和42场路演展示),并听取了19家中小企业的专业推介。所有活动的共同目标是组建强有力的产业联盟,为即将到来的2026年"Chips JU"(芯片联合事业)项目征集准备具有竞争力的提案。

活动由AENEAS的Caroline Bedran、EPoSS的Elisabeth Steimetz和INSIDE的Paolo Azzoni联合致开幕辞,由Jack Parrock主持。开幕环节为后续议程定下基调,强调通过促进合作、协调技术路线图,支持应对欧洲战略优先事项的重大项目诞生。

行业协会:生态系统的关键推动者

专题小组讨论探讨了行业协会的角色,汇集了来自生态系统各方的观点。小组成员包括代表中小企业的Excillum公司Simona Laza、来自大型企业恩智浦半导体的Sanae Boulay,以及研究机构布达佩斯技术与经济大学的Pal Varga。

讨论显示,行业协会积极参与塑造ECS战略研究创新议程(SRIA)和Chips JU工作计划,帮助成员预判项目征集方向、协调技术路线,支持联盟构建和政策对话,搭建学术卓越性与产业相关性之间的桥梁,并保持组织与更广泛的欧洲芯片社区的联系。从对中小企业的实际益处,到大型企业的战略协同,再到研究机构的相关性,信息明确:行业协会是合作、可见度和影响力的关键推动者。

聚焦2026年Chips JU项目征集

Chips JU执行主任Jari Kinaret与项目主管Anton Chichkov共同介绍了即将到来的2026年ECS项目征集。他们公布了10项征集的主要时间表和预算,涵盖从SRIA驱动的创新行动与研究创新行动主题,到功率电子、光子学、健康、6G、软件定义汽车、国际合作及供应链韧性等关键欧洲优先领域,为参与者的项目筹备提供了清晰的战略框架。

路演环节:对接会的核心

路演环节为中小企业提供了展示其专业技术和能力的平台,随后项目构想发起者向ECS社区分享了早期概念。这些环节是ECS对接会的核心:提升构想可见度,帮助参与者识别合适的合作伙伴,并启动那些最终将为2026年Chips JU征集形成强大联盟的对话。专注的路演、投入的听众及高水平的互动,充分展现了生态系统的成熟度、多样性和雄心。

分会会议:从构想到具体合作路径

第一天以项目联盟会议和专题分会结束,讨论转向更小、更聚焦的群体。与Photonics21和6G-IA合作组织的光子学与6G专题分会,为探索合作机会、测试想法并明确后续步骤提供了专注的交流环境。这些往往不那么显眼但极具战略意义的时刻,正是合作伙伴关系真正开始成形之处。

第二天议程:C4EU、技能、量子与国际合作

第二天重点转向Chips JU的"C4EU"(欧洲芯片能力中心)部分,由Anton Chichkov概述2026年C4EU Chips JU项目征集。随后通过欧盟委员会代表的专题会议,深入探讨了几项战略优先事项:

* 面向欧盟计算基础设施的AI芯片与系统,由Marco Ceccarelli介绍。

* 技能类项目征集,涵盖高等教育机构、试点联盟及芯片设计激励,由Stefano Selleri介绍。

* 欧盟-日本半导体联合征集,由Werner Steinhögl介绍。

* 量子芯片设计及使能技术,由Christian Trefzger和Cecilia Gonzalez Alvarez(Chips JU)介绍。

除了全体会议,由行业协会与欧盟委员会联合组织的量子分会,汇集了3A协会与Christian Trefzger进行深入交流。下午则完全专注于交流网络构建与联盟组建。

成果与后续

凭借创纪录的参与度、大量的项目构想与会议安排,以及与欧洲政策及资金优先事项的紧密契合,2026年ECS合作对接会再次证明其是欧洲ECS生态系统合作的关键催化剂。

活动演讲材料及中小企业路演资料可在参会代表页面获取,项目构想路演视频及海报已收录于ECS合作工具平台。参与者可继续在该平台识别潜在合作伙伴,共同开发未来项目。对话已经开启,现在是将构想转化为具有影响力的欧洲项目的时候了。

Summary
The ECS Brokerage Event 2026 in Brussels was the largest edition to date, gathering over 700 participants from the European electronics and chip sector to build consortia for the upcoming Chips Joint Undertaking Calls 2026. Attendees engaged in nearly 900 bilateral meetings and explored over 70 project ideas, with a program featuring calls on priorities like AI chips, quantum, 6G, and skills, presented by Chips JU leaders and industry associations. The event served as a key catalyst for collaboration, providing a strategic framework for partners to develop competitive proposals aligned with Europe's semiconductor goals.

ECS Brokerage Event 2026 Sets Participation Record, Gears Up for Chips JU Calls

Held on February 4-5 in Brussels, the ECS Brokerage Event 2026 solidified its role as the central networking forum for Europe’s Electronic Components and Systems (ECS) community. This edition was the largest to date, attracting over 700 participants to The EGG venue.

The core objective was to forge consortia and prepare competitive proposals for the upcoming 2026 Calls of the Chips Joint Undertaking (JU). Participants arranged nearly 900 bilateral meetings using the event's Conversation Starter tool and explored more than 70 project ideas presented through 66 posters and 42 pitches. An additional 19 pitches showcased expertise from SMEs.

Strategic Opening and Ecosystem Enablers

The event opened with a welcome from Caroline Bedran (AENEAS), Elisabeth Steimetz (EPoSS), and Paolo Azzoni (INSIDE), moderated by Jack Parrock. They emphasized fostering collaboration, aligning roadmaps, and developing projects that address European strategic priorities.

A dedicated panel highlighted the critical role of Industry Associations as ecosystem enablers. Featuring Simona Laza (Excillum, representing SMEs), Sanae Boulay (NXP Semiconductors, large industry), and Pal Varga (Budapest University of Technology and Economics, RTOs), the discussion outlined how associations shape the ECS Strategic Research and Innovation Agenda (SRIA), help anticipate calls, support consortium building, and bridge academic research with industrial needs.

Focus on 2026 Funding and Pitch Sessions

Jari Kinaret, Executive Director of the Chips JU, and Anton Chichkov, Head of Programmes, presented the framework for the ECS Calls 2026. They outlined the main timelines and a budget encompassing 10 calls targeting key European priorities. These range from SRIA-driven Innovation Actions (IA) and Research and Innovation Actions (RIA) to specific fields like power electronics, photonics, health, 6G, software-defined vehicles, international cooperation, and supply-chain resilience.

The pitch sessions formed the heart of the brokerage activities. SMEs first presented their specialized expertise, followed by project idea owners pitching early-stage concepts to the community. These sessions are designed to provide visibility, help identify partners, and initiate the conversations that lead to strong consortium formation.

Targeted Meetings and Day 2 Deep Dives

The first day concluded with project consortium meetings and thematic side sessions. Dedicated meetings on Photonics and 6G, organized with Photonics21 and 6G-IA, allowed for focused exploration of collaboration opportunities.

Day 2 shifted focus to the C4EU (Chips for Europe) component of the Chips JU. Following an overview of the C4EU Calls 2026 by Anton Chichkov, European Commission representatives led sessions on several strategic priorities:

* AI Chips & systems for EU compute infrastructure (Marco Ceccarelli)

* Skills-focused calls covering Higher Education, Pilot Federation, and Chip Design stimulation (Stefano Selleri)

* A Joint EU–Japan Call on semiconductors (Werner Steinhögl)

* Quantum Chips Design and enabling technologies (Christian Trefzger and Cecilia Gonzalez Alvarez of Chips JU)

A separate Quantum side meeting, co-organized by industry associations and the European Commission, facilitated in-depth exchanges. The afternoon was dedicated entirely to networking and consortium building.

With record attendance, a high volume of project ideas and meetings, and strong alignment with EU policy, the 2026 Brokerage Event proved again to be a key collaboration catalyst. Presentation materials and SME pitches are available on the event delegate page, while project ideas and posters remain accessible in the ECS Collaboration Tool for continued partner identification.

Résumé
L'événement ECS Brokerage 2026 à Bruxelles a réuni plus de 700 participants, un record, pour préparer les appels à projets 2026 du Chips Joint Undertaking. Les participants ont organisé près de 900 réunions bilatérales et exploré plus de 70 idées de projets, avec un accent sur le montage de consortiums. Les sessions ont couvert les priorités stratégiques européennes, des puces pour l'IA et la 6G à l'électronique de puissance et la coopération internationale, confirmant le rôle clé de l'événement pour la collaboration dans l'écosystème européen des semi-conducteurs.

4-5 February i2026, Brussels The ECS Brokerage Event 2026 once again confirmed its central role in bringing together Europe’s ECS community. Over two intense and inspiring days in The EGG, Brussels, the event welcomed more than 700 participants, making this edition the largest ECS Brokerage to date.

Across the programme, participants arranged almost 900 bilateral meetings through the Conversation Starter tool, explored 70+ project ideas (through 66 posters and 42 pitches), heared 19 SME expertise pitches,all with a shared objective of building strong consortia and preparing competitive proposals for the upcoming Chips JU Calls 2026.

The event officially opened with a joint welcome from Caroline Bedran, AENEAS, Elisabeth Steimetz, EPoSS, and Paolo Azzoni, INSIDE . Moderated by Jack Parrock, the opening session set the tone for the two days ahead, highlighting a common ambition to foster collaboration, align roadmaps, and support the emergence of impactful projects addressing Europe’s strategic priorities.

Industry Associations as ecosystem enablers

A dedicated panel session explored the role of Industry Associations, bringing together perspectives from across the ecosystem. The panel featured Simona Laza, Excillum, representing SMEs, Sanae Boulay from large industry at NXP Semiconductors, and RTO Pal Varga from Budapest University of Technology and Economics.

The discussion showcased how Industry Associations actively contribute to shaping the ECS SRIA and Chips JU work programmes, help members anticipate calls and align roadmaps, support consortia building and policy dialogue, bridge academic excellence with industrial relevance, and keep organisations connected to the wider European chips community. From practical benefits for SMEs to strategic alignment for large companies and relevance for research organisations, the message was clear: Industry Associations are key enablers of collaboration, visibility and impact.

Focus on Chips JU Calls 2026

The upcoming ECS Calls 2026 were presented by Jari Kinaret, Executive Director of the Chips Joint Undertaking, together with Anton Chichkov, Head of Programmes. They presented main timelines and budget of 10 calls addressing key European priorities, ranging from SRIA-driven IA and RIA topics to power electronics, photonics, health, 6G, software-defined vehicles, international cooperation and supply-chain resilience—providing participants with a clear strategic framework for project preparation.

Pitch session as the heart of brokerage

The pitch sessions then gave the floor to SMEs, who presented their expertise and technologies, followed by project idea owners sharing early-stage concepts with the ECS community. These sessions are at the core of the ECS Brokerage Event: giving visibility to ideas, helping participants identify the right partners, and initiating the conversations that lead to strong consortia for the Chips Joint Undertaking Calls 2026. Focused pitches, attentive audiences and a high level of interaction clearly demonstrated the maturity, diversity and ambition!

Side meetings: from ideas to concrete collaboration paths

Day 1 concluded with project consortia meetings and thematic side meetings, where discussions shifted to smaller, targeted groups. Dedicated sessions on Photonics and 6G, organised in cooperation with Photonics21 and 6G-IA, provided a focused setting to explore collaboration opportunities, test ideas and clarify next steps. These moments, often less visible but highly strategic, are where partnerships truly begin to take shape.

Day 2: C4EU, skills, quantum and international cooperation

Day 2 shifted the spotlight to the C4EU part of the Chips Joint Undertaking, starting with an overview of the C4EU Chips JU Calls 2026 by Anton Chichkov. The programme then zoomed in on several strategic priorities through dedicated sessions by representatives of the European Commission:

AI Chips & systems for EU compute infrastructure, presented by Marco Ceccarelli

Calls on Skills, covering Higher Education Organisations, Pilot Federation and stimulation of Chip Design, presented by Stefano Selleri

Joint EU–Japan Call on semiconductors, introduced by Werner Steinhögl

Quantum Chips Design and enabling technologies, presented by Christian Trefzger  and Cecilia Gonzalez Alvarez (Chips JU)

Beyond the plenary sessions, a Quantum side meeting, jointly organised by industry associations and the European Commission, brought together 3A Association and Christian Trefzger for in-depth exchanges, followed by an afternoon fully dedicated to networking and consortia building.

Useful links

With record participation, a high number of project ideas and meetings, and a strong alignment with European policy and funding priorities, the ECS Brokerage Event 2026 once again proved to be a key catalyst for collaboration in the European ECS ecosystem. Presentations and SME pitch materials are available on the delegate page, while project idea pitches and posters can be found in the ECS Collaboration Tool, where you can continue identifying potential partners and developing future projects. The conversations have started. Now it’s time to turn ideas into impactful European projects!

The post ECS Brokerage Event 2026: the biggest edition yet, turning innovative ideas into future consortia! appeared first on Aeneas.

AI Insight
Core Point

欧洲ECS对接会2026成功举办,参会人数创新高,旨在促成合作、组建联盟以竞标欧盟芯片联合执行体(Chips JU)2026年的资助项目。

Key Players

AENEAS — 欧洲纳米电子产业协会,总部布鲁塞尔。

EPoSS — 欧洲智能系统集成技术平台,总部柏林。

INSIDE — 意大利纳米电子与系统集成协会,总部米兰。

Chips JU — 欧盟芯片联合执行体,负责资助芯片研发,总部布鲁塞尔。

Industry Impact
  • ICT: 高 — 活动核心围绕芯片、6G、光子学等下一代ICT技术合作。
  • 计算/AI: 中 — 专门会议讨论用于欧盟计算基础设施的AI芯片。
  • 汽车: 低 — 提及软件定义汽车作为资助方向之一。
  • 终端/消费电子: 低 — 作为电子组件与系统(ECS)的广义下游应用。
Tracking

强烈关注 — 该活动是观察欧盟芯片产业政策落地、技术路线及企业联盟形成的关键风向标。

Highlights
Upcoming Event
Categories
半导体 创业 科研
AI Processing
2026-04-03 23:08
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