CEA-Leti will present one technology paper and two additional talks at the 2026 IEEE/JSAP Symposium on VLSI Technology & Circuits, taking place June 14–18 at the Hilton Hawaiian Village in Honolulu, Hawaii. The 45th edition of this joint conference is built around the theme “Advancing the AI Frontier Through VLSI Innovation” and showcases advances across AI, machine learning, IoT, biomedical implants, edge computing, AR/VR, robotics, and autonomous vehicles.

The main contributed paper, “Engineering 3D HZO ferroelectric capacitors to scale down 22nm embedded FeRAM”, will be delivered on Wednesday, June 17, from 4:40 to 5:05 PM in Technology Technical Session T9.4 (Honolulu 1 room). A large team of CEA-Leti researchers is listed as authors: Carine Jahan, Simon Martin, Romuald Blanc, Gustav Persson, Fabien Grimaud, Mélanie Louro, Liam Hosier, Nicolo Giovannelli, Théo Monniez, Grégory Boniface, Olivier Glorieux, Christelle Boixaderas, Antonio Roman, Mehdi Oujanba, Messaoud Bedjaoui, Julien Mercier, Stéphane Minoret, Catherine Euvrard, Julian Sturm, Cécile Candegabe, Sébastien Kerdilès, Corinne Comboroure, Estelle Guyez, Stéphane Pocas, Denys Ly, Sébastien Martinie, Yann Beilliard, Gabriel Pares, Fabrice Bernard-Granger, Jean Coignus, Nicolas Bernier, Olivier Billoint, François Andrieu, and Laurent Grenouillet. The work addresses scaling challenges for hafnium-zirconium-oxide (HZO) ferroelectric capacitors within a 22‑nm embedded FeRAM technology, targeting dense, low‑power non‑volatile memory.

Two further presentations highlight CEA-Leti’s work at the intersection of hardware and emerging applications:

• “Innovative Neurotechnologies – A Journey from the Lab to the Clinic and Back” – a joint lunch talk on Thursday, June 18, 12:15–1:15 PM in Coral 4/5, covering technology transfer in brain‑machine interfaces and clinical neurotechnology.
• “Cryo-CMOS Circuits for the Control and Readout of Silicon Qubits” (W1‑4) – a workshop presentation on Sunday, June 14, 2:25–2:50 PM in Tapa 1, focused on cryogenic CMOS circuits for quantum computing.

In‑person attendance is complemented by on‑demand access to technical content the following week. For questions, contact Gaël Pillonnet.

Beyond the symposium, CEA‑Leti is also organizing or attending several forthcoming events: a “Organoids & Organoids‑on‑Chip” workshop at the CEA Grenoble site on September 29, 2026; the LID World Summit in Grenoble from June 23–25, 2026, featuring over 1,250 semiconductor professionals; and PCIM, where live demonstrations will include an ultra‑thin piezoelectric power converter, a smart multilevel flying‑capacitor converter, a high‑power multilevel GaN DC‑DC converter for fuel cell–battery adaptation, and predictive maintenance using non‑invasive sensors, with emphasis on CEA’s wide‑bandgap roadmap. Separately, a workshop on dry etching and plasma processing will bring together scientists and engineers in Minatec, Grenoble, while CEA‑Leti experts at booth 1 will present six papers and posters on eco‑innovation, microbumps, fan‑out wafer‑level packaging, and hybrid bonding.

From 6/14/2026 to 6/18/2026Honolulu, Hawaii

CEA-Leti will present a paper on Ferroelectric Memories have 2 presentations : on Neurotechnologies and Cryo-CMOS Circuits.​

DISCOVER CEA-LETI’S MAJOR SCIENTIFIC RESULTS

Wednesday, June 17​​4:40 PM - 5:05 PM​Technology Technical​Session T9.4Honolulu 1​

Carine Jahan; CEA-LetiSimon Martin; CEA-LetiRomuald Blanc; CEA-LetiGustav Persson; CEA-LetiFabien Grimaud; CEA-LetiMélanie Louro; CEA-LetiLiam Hosier; CEA-LetiNicolo Giovannelli; CEA-LetiThéo Monniez; CEA-LetiGrégory Boniface; CEA-LetiOlivier Glorieux; CEA-LetiChristelle Boixaderas; CEA-LetiAntonio Roman; CEA-LetiMehdi Oujanba; CEA-LetiMessaoud Bedjaoui; CEA-LetiJulien Mercier; CEA-LetiStéphane Minoret; CEA-LetiCatherine Euvrard; CEA-LetiJulian Sturm; CEA-LetiCécile Candegabe; CEA-LetiSébastien Kerdilès; CEA-LetiCorinne Comboroure; CEA-LetiEstelle Guyez; CEA-LetiStéphane Pocas; CEA-LetiDenys Ly; CEA-LetiSébastien Martinie; CEA-LetiYann Beilliard; CEA-LetiGabriel Pares; CEA-LetiFabrice Bernard-Granger; CEA-LetiJean Coignus; CEA-LetiNicolas Bernier; CEA-LetiOlivier Billoint; CEA-LetiFrançois Andrieu; CEA-Leti​Laurent Grenouillet; CEA-Leti

T9.4 | Engineering 3D HZO ferroelectric capacitors to scale down 22nm embedded FeRAM​

Thursday, June 1812:15 PM - 1:15 PMJoint LunchCoral 4/5

Innovative Neurotechnologies – A Journey from the Lab to the Clinic and Back​

Sunday, June 142:25 PM - 2:50 PMWorkshopTapa 1

W1-4 | Cryo-CMOS Circuits for the Control and Readout of Silicon Qubits​​​

The IEEE/JSAP Symposium on VLSI Technology & Circuits has delivered a unique convergence of technology and circuits in the microelectronics industry for the last 45 years, creating maximum synergy between both domains. The 2026 Symposium is dedicated to the theme: “Advancing the AI Frontier Through VLSI Innovation.” The five-day event will be held in-person, featuring live sessions at the Hilton Hawaiian Village, Honolulu, HI, from June 14 to 18, 2026, and OnDemand access to technical sessions and other content beginning the following week. The Symposium will feature the latest VLSI technology developments, innovative circuit design, and the applications they enable, such as artificial intelligence, machine learning, IoT, wearable/implantable biomedical applications, big data, cloud/edge computing, virtual reality (VR) / augmented reality (AR), robotics, and autonomous vehicles.​

More information on ​​2026 VLSI SYMPOSIUMwebsite

From 06/14/2026 to06/18/2026​|​Honolulu, Hawaii​

Contact:  ​Gaël Pillonnet​with any questions.​​

Event | Agenda|Y-Spot Partners, Grenoble, France

We are delighted to announce that CEA is hosting the "Organoids & Organoids-on-Chip" workshop at its Grenoble site on September 29, 2026.

Event|Maison Minatec, Grenoble, France

LID World Summit from 23 to 25 June offer you a front-row seat to our most recent advances. Join more than 1,250 semiconductor industry professionals at this three-day global event and come away equipped and inspired to innovate!​

We’re excited to welcome you back to PCIM!

Join us to discover our latest innovations through live demonstrations, including:- Ultra thin power converter based on piezoelectric storage,- Smart multilevel converter utilizing flying capacitor topology- High Power multilevel GaN DCDC converter for fuel cell to battery voltages adaptation- Predictive maintenance on power electronic based on non invasive sensors.Focus will be put on CEA Wide Band Gap roadmap and technologies to address high demand and challenges on power supplies. It addresses different applications from data center to drones going through automotive, aeronautic, spatial, medical.

Event|Minatec, Grenoble, France

The workshop gathers scientists, engineers and industry partners to discuss advances and challenges in dry etching, plasma processing and related technologies for semiconductor, MEMS and emerging applications.

CEA-Leti experts will be onsite at booth 1 and available to discuss the findings of Six Papers and Posters Includes eco-innovation, microbumps, FO-WLP, packaging and hybrid bonding.