Wooptix, the Spanish semiconductor metrology specialist, has completed the first industrial deployment of its Phemet system at CEA-Leti in Grenoble, France. The installation marks a significant step for the company’s proprietary technology, which leverages wavefront phase imaging to deliver wafer shape and geometry measurements with subnanometric resolution at unprecedented speed.
The Phemet platform is engineered to characterize whole silicon wafers—capturing topography, bow, warp, and nanotopography—in a single snapshot acquisition. This eliminates the throughput bottlenecks of traditional scanning interferometry, enabling inline process control and rapid feedback for advanced semiconductor nodes. At CEA-Leti, the system will support research into process optimization and defect root-causing across 200 mm and 300 mm wafer formats.
During a joint inauguration, Wooptix CEO Javier Elizalde said the collaboration with Leti “validates the industrial readiness of our wavefront metrology,” while Leti’s director of silicon technologies, Olivier Faynot, emphasized the system’s potential to “accelerate learning cycles on next-generation devices by correlating geometry anomalies with process parameters in near real time.”
Key technical specifications cited by Wooptix include a lateral resolution down to 42 µm and vertical repeatability below 0.3 nm, with total measurement time of under one second per wafer. The non-contact optical method avoids contamination risks and mechanical stress, making it suited for delicate advanced substrates including SOI, SiC, and glass carriers.
The deployment follows Wooptix’s earlier collaborations with European semiconductor equipment manufacturers and is part of a broader push to embed its metrology into both R&D fabs and high-volume manufacturing environments. The company expects the CEA-Leti installation to generate reference data that will inform future tool iterations and support adoption by memory and logic chipmakers grappling with tighter process windows at 3 nm and below.