SK hynix lance le chantier de sa première usine de mémoires HBM aux États-Unis
SK hynix 在美国印第安纳州正式启动其首座 HBM（高带宽存储器）相关工厂的建设，这一项目总投资超过 40 亿美元。该基地不仅将成为这家韩国存储芯片厂商在美国的第一座先进 HBM 封装工厂，还将配套建设一个研发与测试中心，形成从工艺开发到量产验证的一体化布局。
按照规划，这座工厂的量产时间预计在 2029 年下半年启动。对于 SK hynix 来说，这意味着其 HBM 业务将进一步向美国本土延伸，强化在高性能计算、AI 服务器和数据中心等关键市场中的供应能力。
HBM 作为当前 AI 芯片生态中最关键的存储技术之一，因其高带宽、低延迟和更高集成度而备受关注。SK hynix 此次在美国落地先进封装产能，既是对北美客户需求的直接响应，也反映出全球存储产业链正在向更靠近终端市场和芯片设计中心的方向重组。
该项目的研发与测试中心同样具有战略意义：它将帮助 SK hynix 在美国本地完成工艺优化、可靠性验证和产品测试，缩短与客户协作的周期，并提升对下一代 HBM 产品的迭代效率。
SK hynix has broken ground on what will become its first advanced packaging plant for high-bandwidth memory (HBM) in the United States, a project backed by more than $4 billion in investment. The facility, located in Indiana, will also include an associated R&D and testing center, making it a strategic U.S. foothold for the South Korean memory maker.
Volume production at the site is expected to begin in the second half of 2029. The move underscores SK hynix’s push to strengthen its HBM supply chain closer to the U.S. market, where demand for advanced memory is being driven by AI and high-performance computing applications.
The project marks a significant expansion of SK hynix’s manufacturing footprint outside Asia and reflects the company’s effort to secure a stronger position in the fast-growing HBM segment, which has become critical for next-generation AI accelerators.
Fruit d’un investissement de plus de 4 milliards de dollars, ce site implanté dans l’Indiana abritera la première usine de conditionnement avancé de mémoires à large bande passante (HBM) du Coréen aux Etats-Unis, ainsi qu’un centre de R&D et de test associé. La production de volume devrait y débuter au second semestre 2029. SK hynix […]
Cet article SK hynix lance le chantier de sa première usine de mémoires HBM aux États-Unis a été publié par VIPress.net.
SK hynix breaks ground in Indiana on its first U.S. HBM advanced packaging/memory site, a $4B+ investment that expands local supply for high-bandwidth AI memory with volume production targeted for H2 2029.
SK hynix — manufactures DRAM/HBM memory and advanced packaging; based in South Korea.
[Strongly track] — major capacity build with long lead time (to 2029) that can shift HBM availability and pricing dynamics.