Engineering the Semiconductor Foundations of the AI Era
人工智能正在重塑半导体产业格局，并推动从底层架构到封装工艺的全栈式技术突破。SEMICON Europa 将于 2026 年 11 月 12 日在德国慕尼黑 Messe München 举行，其中的 LID Europa 论坛安排在当天 10:00 至 11:20，于 C1 馆 Executive Forum 举办。
本场会议聚焦支撑 AI 时代的关键深科技创新，包括先进计算、3D 集成、硅光子学以及高能效封装等方向，并将通过两个真实案例演示展示相关技术的落地进展。会议最后还将介绍欧洲对可持续 AI 基础设施的愿景，强调在算力扩张背景下，如何兼顾性能、能效与长期可持续性。
如有疑问，可联系 Michael Tchagaspanian。
Artificial intelligence is reshaping the semiconductor industry and pushing for breakthroughs across the full technology stack, from advanced compute and 3D integration to silicon photonics and power-efficient packaging.
That focus will be the subject of LID Europa at SEMICON Europa, held on November 12 from 10:00 a.m. to 11:20 a.m. at the Executive Forum in Hall C1 at Messe München, Germany. The session will examine the deep-tech innovations underpinning the AI era, then move to two real-world demonstrations before closing with Europe’s vision for sustainable AI infrastructure.
The event is positioned as a look at both the technical foundations and the broader regional strategy for building AI systems that are not only more capable, but also more energy-efficient and scalable. For questions, attendees can contact Michael Tchagaspanian.
From 11/12/2026 to 11/12/2026SEMICON Europa, Messe München, Germany.
Artificial intelligence is reshaping the semiconductor landscape, demanding breakthroughs across the entire technology stack.
This session explores the deep-tech innovations enabling the AI era—from advanced compute, 3D integration and silicon photonics to power-efficient packaging—before showcasing two real-world demonstrations and concluding with Europe’s vision for sustainable AI infrastructure.
LID Europa will take place on November 12, from 10:00 a.m. to 11:20 a.m., at the Executive Forum, located in Hall C1, at Messe München, Germany.
ContactMichael Tchagaspanianwith any questions.
SEMICON Europa in Munich will host a session on semiconductor deep-tech for AI—covering advanced compute, 3D integration, silicon photonics, and power-efficient packaging—highlighting why next-gen chip foundations are critical for sustainable AI infrastructure.
SEMICON Europa (Messe München) — semiconductor industry event in Germany focused on AI-era chip technologies and demonstrations.
LID Europa — event/session within SEMICON Europa scheduled for Nov 12, Germany.
[Monitor] — relevant for tracking Europe’s semiconductor roadmap and AI infrastructure sustainability direction.