为人工智能时代奠定半导体基础

Engineering the Semiconductor Foundations of the AI Era

CEA-Leti Quality unknown · 质量未知 Original
摘要
SEMICON Europa 期间,LID Europa 将于2026年11月12日在德国慕尼黑Messe München的Executive Forum(Hall C1)举办,时间为10:00至11:20,主题聚焦AI如何重塑半导体产业并推动全技术栈的深科技突破。议程将涵盖先进计算、3D集成、硅光子学以及更高能效的封装,并通过两个真实场景演示,最后阐述欧洲在可持续AI基础设施方面的愿景。该活动由Michael Tchagaspanian提供咨询支持,预计将为相关企业与技术路线提供面向AI时代的方向与落地参考。

人工智能正在重塑半导体产业格局,并推动从底层架构到封装工艺的全栈式技术突破。SEMICON Europa 将于 2026 年 11 月 12 日在德国慕尼黑 Messe München 举行,其中的 LID Europa 论坛安排在当天 10:00 至 11:20,于 C1 馆 Executive Forum 举办。

本场会议聚焦支撑 AI 时代的关键深科技创新,包括先进计算、3D 集成、硅光子学以及高能效封装等方向,并将通过两个真实案例演示展示相关技术的落地进展。会议最后还将介绍欧洲对可持续 AI 基础设施的愿景,强调在算力扩张背景下,如何兼顾性能、能效与长期可持续性。

如有疑问,可联系 Michael Tchagaspanian。

Summary
SEMICON Europa in Germany will host an LID Europa session on November 12, 2026 (10:00–11:20 a.m.) at Messe München, focusing on how AI is driving semiconductor breakthroughs across the full stack, including advanced compute, 3D integration, silicon photonics, and power-efficient packaging. The program will feature two real-world demonstrations and outline Europe’s vision for sustainable AI infrastructure, with Michael Tchagaspanian listed as the contact for questions. The session signals growing industry emphasis on energy-efficient, next-generation chip architectures to support AI workloads.

Artificial intelligence is reshaping the semiconductor industry and pushing for breakthroughs across the full technology stack, from advanced compute and 3D integration to silicon photonics and power-efficient packaging.

That focus will be the subject of LID Europa at SEMICON Europa, held on November 12 from 10:00 a.m. to 11:20 a.m. at the Executive Forum in Hall C1 at Messe München, Germany. The session will examine the deep-tech innovations underpinning the AI era, then move to two real-world demonstrations before closing with Europe’s vision for sustainable AI infrastructure.

The event is positioned as a look at both the technical foundations and the broader regional strategy for building AI systems that are not only more capable, but also more energy-efficient and scalable. For questions, attendees can contact Michael Tchagaspanian.

Résumé
À SEMICON Europa (Messe München, Allemagne) le 12 novembre 2026, une session dédiée à l’impact de l’intelligence artificielle sur l’industrie des semi-conducteurs mettra en avant des innovations deep-tech à travers toute la pile technologique, notamment le calcul avancé, l’intégration 3D, la photonique sur silicium et des solutions d’emballage plus économes en énergie. Le programme inclut deux démonstrations concrètes et se conclut par la vision de l’Europe pour une infrastructure d’IA durable, avec l’événement LID Europa animé au Executive Forum (Hall C1). Contact : Michael Tchagaspanian.

From 11/12/2026 to 11/12/2026SEMICON Europa, Messe München, Germany.

Artificial intelligence is reshaping the semiconductor landscape, demanding breakthroughs across the entire technology stack.

This session explores the deep-tech innovations enabling the AI era—from advanced compute, 3D integration and silicon photonics to power-efficient packaging—before showcasing two real-world demonstrations and concluding with Europe’s vision for sustainable AI infrastructure.​

​​LID Europa will take place on November 12, from 10:00 a.m. to 11:20 a.m., at the Executive Forum, ​located in Hall C1​, at Messe München, Germany.​

ContactMichael Tchagaspanianwith any questions.

AI Insight
Core Point

SEMICON Europa(德国慕尼黑)将聚焦“AI时代半导体底座”的关键技术演进,强调算力、3D集成、硅光子与高能效封装的重要性,反映AI对上游芯片与制造体系的系统性拉动。

Key Players

SEMICON Europa — 半导体产业展会/会议平台,德国慕尼黑(Messe München)。

LID Europa — 活动分会/论坛环节,德国慕尼黑(同场地)。

Industry Impact
  • Computing/AI: High — AI驱动对先进制程、互连与能效封装的需求加速。
  • ICT: Medium — 产业链围绕算力基础设施与互联技术协同升级。
  • Energy: Medium — 强调功耗更低的封装与系统级能效以降低数据中心能耗。
  • Terminals/Consumer Electronics: Low — 主要是上游能力建设,短期对终端影响间接。
Tracking

[Monitor] — 关注欧洲在“可持续AI基础设施”方向的技术路线与产业合作信号。

Highlights
Upcoming Event
Related Companies
Categories
半导体 人工智能 电信
AI Processing
2026-09-17 23:02
openai / gpt-5.4-nano