CEA-Leti returns to PCIM 2026, the premier international conference for power electronics, intelligent motion, renewable energy, and energy management, from June 9—11 in Nuremberg, Germany. At its booth, the institute will stage live demonstrations of four key innovations: an ultra-thin power converter using piezoelectric energy storage, a smart multilevel converter based on a flying capacitor topology, a high-power multilevel GaN DC-DC converter designed to adapt fuel-cell voltages to batteries, and a predictive maintenance system for power electronics employing non-invasive AI-assisted ultrasonic sensors. The exhibits will also highlight CEA-Leti’s wide-bandgap roadmap, particularly its PowerGaN technology, to meet growing demand for efficient power solutions.

On June 11, during the poster session in Hall 4A (PP354), CEA scientists will present a study on SiC MOSFET gate switching stress, featuring in-situ threshold voltage monitoring and self-heating analysis. The conference, which draws experts from industry and academia along the entire value chain, serves as an indispensable hub for driving R&D and product development in the sector. Inquiries can be directed to Philippe Despesse.

Beyond PCIM, CEA-Leti has a packed events calendar: an Organoids & Organoids-on-Chip workshop in Grenoble on September 29; the LID World Summit (June 23—25) at Maison Minatec, expecting over 1,250 semiconductor professionals; a dry etching and plasma processing workshop at Minatec; and participation in EuCNC & 6G Summit 2026, where it will showcase advances in distributed MIMO, semantic communications, integrated sensing and communication (ISAC), AI-native networking, and sub-THz technologies, with concrete demos for Industry 4.0, robotics, and future wireless infrastructure. CEA-Leti experts will also be at Booth 1 at an unnamed event, presenting six papers and posters on eco-innovation, microbumps, fan-out wafer-level packaging, and hybrid bonding.

From 6/9/2026 to 6/11/2026Nuremberg, Germany

COME AND MEET CEA-LETI'S EXPERTS

This year, CEA-Leti’s booth will exhibit PowerGaN, Piezo DCDC Converter and Smart Predictive Maintenance demos. Come and discuss lastest achievements in terms of power electronics. ​

Efficient step-up power converter for fuel cell-batteries​​

An ultra-slim and lightweight converter for tomorrow's chargers​

AI-assisted ultrasonic sensors for the predictive maintenance of power components​

​DISCOVER CEA-LETI’S MAJOR SCIENTIFIC RESULTS

The institute will present this year’s major scientific results at PCIM

June 11, 2026Poster session​Hall 4A, PP354

SiC MOSFET Gate Switching Stress with In-Situ Threshold Voltage Monitoring and Self-Heating Analysis​

The PCIM Expo & Conference in Nuremberg, Germany is the leading international event for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management. It connects experts from industry and academia who are dedicated to driving forward products, research and development along the entire value chain. This has made the PCIM Expo & Conference an indispensable meeting place for the industry and the home of power electronics for decades.​

More information on ​​PCIM​​’s website

From 6/9/2026 to 6/11/2026 |​Nuremberg, Germany

Contact:Philippe Despesse​​with any questions.​​

Event | Agenda|Y-Spot Partners, Grenoble, France

We are delighted to announce that CEA is hosting the "Organoids & Organoids-on-Chip" workshop at its Grenoble site on September 29, 2026.

Event|Maison Minatec, Grenoble, France

LID World Summit from 23 to 25 June offer you a front-row seat to our most recent advances. Join more than 1,250 semiconductor industry professionals at this three-day global event and come away equipped and inspired to innovate!​

Event|Minatec, Grenoble, France

The workshop gathers scientists, engineers and industry partners to discuss advances and challenges in dry etching, plasma processing and related technologies for semiconductor, MEMS and emerging applications.

CEA-Leti experts will be onsite at booth 1 and available to discuss the findings of Six Papers and Posters Includes eco-innovation, microbumps, FO-WLP, packaging and hybrid bonding.

CEA-Leti will participate in EuCNC & 6G Summit 2026 through a broad portfolio of demonstrations, workshops, and scientific contributions showcasing its latest research and innovation in future communication systems. Through contributions to European and national collaborative projects, CEA-Leti will present advances in distributed MIMO, semantic communications, integrated sensing and communication (ISAC), AI-native networking, sustainability for 6G, and sub-THz technologies. Participants will discover concrete technology demonstrators and real-world use cases for Industry 4.0, intelligent sensing, robotics, and future wireless infrastructures, while gaining insights into emerging 6G architectures, energy-efficient networks, and the technologies shaping next-generation connectivity.